Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
05/2001
05/10/2001WO2001032579A1 Method for assembling reinforcing elements by bonding and device obtained by said method
05/10/2001CA2831366A1 Piezoelectric macro-fiber composite actuator and manufacturing method
05/10/2001CA2389146A1 Piezoelectric macro-fiber composite actuator and manufacturing method
05/09/2001EP1097901A2 Method of fabricating micro electro mechanical system structure which can be vacuum-packaged at wafer level
05/03/2001WO2000065641A8 Microwave bonding of mems component
04/2001
04/19/2001WO2001027026A1 Electromechanical component and method for producing said component
04/19/2001WO2001027025A1 Electro-mechanical component and method for producing the same
04/18/2001EP1093142A2 Dual motion electrostatic actuator design for mems micro-relay
04/15/2001CA2323189A1 Dual motion electrostatic actuator design for mems micro-relay
04/12/2001WO2001025138A1 Modular microfluidic devices comprising sandwiched stencils
04/11/2001EP1090419A1 Device and method for forming a device having a cavity with controlled atmosphere
04/04/2001EP1089358A2 Piezoelectric/electrostrictive device and method of manufacturing same
03/2001
03/20/2001US6204086 Method for manufacturing semiconductor components having micromechanical structures
03/15/2001WO2001018857A1 Process for fabrication of 3-dimensional micromechanisms
03/06/2001US6198145 Method for manufacturing a semiconductor material integrated microactuator, in particular for a hard disc mobile read/write head, and a microactuator obtained thereby
02/2001
02/06/2001US6185107 MEMS based tile assemblies and methods of fabrication
02/01/2001WO2001007506A2 Microfabricated devices and method of manufacturing the same
01/2001
01/25/2001WO2001006543A2 Microelectromechanical device with moving element
01/25/2001CA2379537A1 Microelectromechanical device with moving element
01/18/2001WO2001004524A1 Apparatus and method for mounting micromechanical fluid control components
01/18/2001DE19927533A1 Miniaturisiertes Analysensystem Miniaturized Analysis System
01/17/2001EP0948408A4 Microfabricated sleeve devices for chemical reactions
01/09/2001US6171886 Method of making integrated hybrid silicon-based micro-actuator devices
01/09/2001US6170155 System of components to be hybridized and hybridization process allowing for thermal expansions
12/2000
12/27/2000CN1278365A Electrical interface to integrated device having high density I/O count
12/26/2000US6166478 Method for assembly of microelectromechanical systems using magnetic actuation
12/21/2000WO2000077509A1 Miniaturized analytical system
12/07/2000WO2000072968A1 Multiple fluid sample processor and system
12/07/2000CA2374908A1 Multiple fluid sample processor and system
11/2000
11/29/2000CN1275202A Device for transporting very small quantites of liquid and method for producing same
11/23/2000WO2000070224A1 Micromechanic pump
11/16/2000DE19922075A1 Bonding two microstructured plastics workpieces together, comprises introducing a plastics-dissolving organic solvent into a groove between the workpieces
11/02/2000WO2000065641A1 Microwave bonding of mems component
10/2000
10/03/2000US6126765 Method of producing microchannel/microcavity structures
09/2000
09/26/2000US6123107 Apparatus and method for mounting micromechanical fluid control components
08/2000
08/10/2000WO2000046852A1 Micro-relay
08/10/2000CA2361756A1 Micro-relay
08/02/2000EP1023593A1 Device for transporting very small quantities of liquid and method for producing same
08/01/2000US6096576 Method of producing an electrical interface to an integrated circuit device having high density I/O count
07/2000
07/27/2000WO2000044208A1 Flexible microsystem and building techniques
07/26/2000EP1021834A1 Electrical interface to integrated device having high density i/o count
07/11/2000US6087701 Semiconductor device having a cavity and method of making
07/11/2000US6086705 Bonding of micro elements
07/06/2000DE19962650A1 Oberflächenkleinstgerät Surface micro device
06/2000
06/29/2000WO2000038209A1 Micromachine switch and its production method
06/28/2000EP1014457A2 Micro-fabrication method and sensor using the same
06/28/2000EP1014094A1 A small size electronic part and a method for manufacturing the same, and a method for forming a via hole in the same
06/22/2000WO2000012987A3 Micromechanical component protected against environmental influences
06/02/2000WO2000031422A1 Interconnection support for plate-like microcomponents
05/2000
05/31/2000DE19957111A1 Semiconductor component, e.g. wafer of sensor chips or chips with air bridge wiring structures, has attached adhesive foil with low adhesion region above wafer structure portion
05/25/2000DE19854096A1 Connection carrier for plate shaped micro-components, comprises at least one carrier rail fixed to a carrier plate, with a slot for a micro-component insert edge.
04/2000
04/06/2000WO2000019494A1 Method for manufacturing carbon nanotubes as functional elements of mems devices
03/2000
03/30/2000WO2000016833A1 Surface micromachined microneedles
03/30/2000CA2344398A1 Surface micromachined microneedles
03/09/2000WO2000012987A2 Micromechanical component protected against environmental influences
03/09/2000DE19839122A1 Vor Umwelteinflüssen geschützter mikromechanischer Sensor Protected from environmental influences micromechanical sensor
03/02/2000WO2000011461A1 Device for transporting very small quantities of liquid and method for producing same
02/2000
02/29/2000US6030229 Electromagnetic detachable connector
02/15/2000US6025767 Encapsulated micro-relay modules and methods of fabricating same
02/02/2000EP0977260A2 Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same
01/2000
01/11/2000US6013573 Method of manufacturing an air bridge type structure for supporting a micro-structure
12/1999
12/29/1999WO1999067818A1 Device and method for forming a device having a cavity with controlled atmosphere
11/1999
11/23/1999US5989974 Method of manufacturing a semiconductor device
11/04/1999DE19819458A1 Micromechanical component manufacturing method for e.g. capacitive acceleration sensor
11/04/1999DE19819456A1 Micromechanical component manufacturing method, e.g. for micromechanical acceleration sensor manufacture
10/1999
10/19/1999US5970315 Particularly useful for data storage applications, isotropically etching sacrificial layer under at least a beam portion of said microelectromechanical device
10/13/1999EP0948408A1 Microfabricated sleeve devices for chemical reactions
10/06/1999EP0946969A1 Two-stage kinematic mount
10/05/1999US5961767 Method for forming micron-sized and smaller liquid droplets
09/1999
09/23/1999DE19911916A1 Semiconductor component e.g. an acceleration or pressure sensor chip
09/21/1999US5955818 Machine structures fabricated of multiple microstructure layers
09/08/1999EP0871545A4 Silicon-based sleeve devices for chemical reactions
06/1999
06/24/1999DE19859627A1 Semiconducting device, especially sensor forming part of integrated circuit
06/09/1999EP0921566A1 Microelectromechanical component, such as a microsensor or a microactuator transferable onto a hybrid circuit substrate
05/1999
05/19/1999EP0916145A1 Encapsulated micro-relay modules and methods of fabricating same
05/06/1999EP0913921A1 Method for manufacturing a semiconductor material integrated micractuator, in particular for a hard disc mobile read/write head, and a microactuator obtained thereby
03/1999
03/31/1999CN1212382A Process for manufacturing microstructured bodies
03/24/1999EP0903638A1 Process for manufacturing microstructured bodies
03/23/1999US5885425 Angled sputtering using a collimation grid having angled vanes which limit the distribution of trajectories of particles in at least one coordinate direction around a central axis oriented at an angle of less than 90 degrees to said surface
03/11/1999WO1999012208A1 Electrical interface to integrated device having high density i/o count
02/1999
02/16/1999US5872489 Integrated tunable inductance network and method
11/1998
11/18/1998EP0878244A2 Method for forming micron-sized and smaller liquid droplets
10/1998
10/21/1998EP0871545A1 Silicon-based sleeve devices for chemical reactions
09/1998
09/17/1998DE19710324A1 Semiconductor devices with micro-mechanical structures
09/15/1998US5808331 Monolithic semiconductor device having a microstructure and a transistor
06/1998
06/23/1998US5769997 Anodic bonding
06/18/1998WO1998025701A1 Microfabricated sleeve devices for chemical reactions
06/09/1998US5763318 Method of making a machine structures fabricated of mutiple microstructure layers
05/1998
05/05/1998US5748827 Two-stage kinematic mount
04/1998
04/30/1998WO1998018157A1 Two-stage kinematic mount
02/1998
02/17/1998US5719979 Optical semiconductor module and method for manufacturing the same
02/12/1998WO1998006118A1 Encapsulated micro-relay modules and methods of fabricating same
02/12/1998CA2261683A1 Encapsulated micro-relay modules and methods of fabricating same
02/10/1998US5717631 Microelectromechanical structure and process of making same
01/1998
01/14/1998EP0818813A1 Component system for bonding and method of bonding enabling thermal dilatations
10/1997
10/30/1997DE19616970A1 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices
10/01/1997EP0738306B1 Method of producing microchannel/microcavity structures
02/1997
02/06/1997WO1997004451A1 Microelectromechanical structure and process of making same
02/05/1997EP0757431A2 Machine structures fabricated of multiple microstructure layers
01/1997
01/09/1997WO1997000726A1 Silicon-based sleeve devices for chemical reactions
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