| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 04/04/2013 | DE102012217853A1 Arrangement for producing defined gap between electrode areas on metal oxide semiconductor components for chemical and biochemical sensors in sensor system, has surface pattern formed on components to obtain gap with adjustable width |
| 04/03/2013 | CN103017946A Micro-electromechanical system (MEMS) piezoresistive multi-axis force sensor and production method thereof |
| 04/03/2013 | CN103011053A Face-down exposed packaging structure of sensor chip and packaging method |
| 04/03/2013 | CN101619954B Completely-integrated impact piece ignitor and preparation method thereof |
| 03/27/2013 | CN102113088B Alignment device controller and alignment method |
| 03/13/2013 | CN102967394A Symmetrical capacitor pressure sensor and manufacture method thereof |
| 03/13/2013 | CN102963865A Treatment method of Si-Si bonded surface stains |
| 03/13/2013 | CN101661012B Microfilm capacitive type surface stress sensor used for biochemical detection and manufacture method thereof |
| 03/07/2013 | WO2013029177A1 Monolithic package for housing microelectromechanical systems |
| 03/06/2013 | CN102958827A Method for producing an integrated microfluidic system and integrated microfluidic system |
| 03/06/2013 | CN102955037A Environmental hazardous material monitoring and early warning system and its preparation method |
| 03/06/2013 | CN102955019A Water quality on-line monitoring system and its preparation method |
| 03/06/2013 | CN102954812A Sensor module and method for producing semsor module |
| 03/06/2013 | CN102951595A Structure and method for motion sensor |
| 03/06/2013 | CN102951591A Micro-channel structure for catching circulating tumor cells and preparation method thereof |
| 02/28/2013 | DE102012100796A1 Chip-Zu-Chip-Abstandskontrolle für eine Halbleiterstruktur und Verfahren zu deren Herstellung Chip-to-chip spacing control for a semiconductor structure and process for their preparation |
| 02/21/2013 | US20130042457 Method and System Using Microscopic Building Blocks For Driving 3D Self-Assembly |
| 02/21/2013 | DE102011081016A1 Sensormodul und Verfahren zur Herstellung eines Sensormoduls Sensor module and method of manufacturing a sensor module |
| 02/14/2013 | DE102011110166A1 Verfahren zum Strukturieren eines aus glasartigem Material bestehenden Flächensubstrats sowie optisches Bauelement A method for patterning a substrate consisting of glassy material surface and optical component |
| 02/14/2013 | DE102011080774A1 Method for manufacturing e.g. temperature sensing structure, involves forming metallization on side facing away from plate side of semiconductor layer in region of portions of highly doped regions to produce pads |
| 02/13/2013 | CN102928089A Uncooled pyroelectric linear focal plane and manufacturing method thereof |
| 02/13/2013 | CN102923638A Hermetic sealing assembly and sealing method |
| 02/13/2013 | CN101239697B Vertical integration microelectron mechanical structure, implementing method and system thereof |
| 02/06/2013 | CN102910578A Method for bonding silicon-based chip and PDMS (Polydimethylsiloxane) chip by adopting hybrid plasma |
| 02/06/2013 | CN102910577A Microwave interface heating bonding method for micro-fluidic chip based on PMMA (Polymethyl Methacrylate) material and other organic polymers |
| 01/24/2013 | DE102011079410A1 Fixing component on carrier, comprises applying optically transparent UV-curable adhesive to carrier and/or component, positioning component in predetermined distance from carrier, and irradiating fixing adhesive with UV-light |
| 01/24/2013 | DE102011079389A1 Method for filling liquid adhesive between support and fixed component, for use in manufacture of radiation detector, involves filling gap with liquid adhesive, and removing outlet opening from edge of gap after hardening adhesive |
| 01/23/2013 | EP2547618A2 Method for producing a microfluidic device |
| 01/23/2013 | CN102889933A Chip of MEMS (micro-electromechanical system) thermopile infrared detector and method for manufacturing inner chip in chip of MEMS thermopile infrared detector and chip of MEMS thermopile infrared detector |
| 01/23/2013 | CN102886281A Micro-fluidic chip bonding device based on PMMA (polymethyl methacrylate) and other polymers |
| 01/16/2013 | EP2546189A1 Method for producing a structure having a buried electrode by direct transfer and resulting structure |
| 01/16/2013 | CN102874739A 自锁圆片键合结构及制作方法 Self-locking wafer bonding structure and production methods |
| 01/16/2013 | CN102874737A micro system and/or nano system type of device and manufacturing method thereof |
| 01/16/2013 | CN101553425B Micro electro mechanical system |
| 01/09/2013 | CN102862947A MEMS (micro-electromechanical systems) device and vacuum encapsulation method of wafer level thereof |
| 01/09/2013 | CN101405215B Microstructure, micromachine, and manufacturing method of microstructure and micromachine |
| 01/02/2013 | EP2540877A1 Single crystal diamond movable structure and manufacturing method thereof |
| 01/02/2013 | CN102859737A Method for manufacturing ferroelectric device |
| 12/27/2012 | DE102011077933A1 Method for bonding substrates for use in semiconductor device, involves cooling composite substrate to specific temperature below another temperature with defined cooling rate |
| 12/26/2012 | EP2157402B1 Device for measuring the alignment of attached structures |
| 12/26/2012 | CN102838079A Open-type packaging structure used for sensor chip and manufacturing method thereof |
| 12/20/2012 | WO2012172654A1 Drive device |
| 12/20/2012 | WO2012172653A1 Drive device |
| 12/20/2012 | WO2012172652A1 Drive device |
| 12/20/2012 | WO2012148604A3 Method for aligned transfer of thin membranes to substrates |
| 12/19/2012 | CN102180441B 微机电装置及其制作方法 MEMS device and manufacturing method thereof |
| 12/13/2012 | DE102010033284B4 Verfahren zum Herstellen einer Bauelementanordnung sowie mittels des Verfahrens hergestellte Bauelementanordnung A method of manufacturing a component arrangement and produced by the method of component assembly |
| 12/12/2012 | CN102815665A Interface method of micro-fluidic pipeline embedded in low-temperature co-fired ceramic substrate |
| 12/06/2012 | WO2012163577A1 Microfluidic device having an electronic component and a spring element |
| 12/06/2012 | WO2012163072A1 Method for manufacturing dielectric substrate, and metamaterial |
| 12/06/2012 | DE102011103749A1 Multi-channel detection device for detecting field components of magnetic field vector produced by magnetic field line camera, has sensor chips whose respective associated Hall-sensors form separate measuring channel |
| 11/28/2012 | EP2526397A2 Cell counting and sample chamber and methods of fabrication |
| 11/28/2012 | CN102795593A Method for processing ultrathin vacuum-sealed MEMS (Micro-electromechanical System) wafer |
| 11/21/2012 | EP2524198A2 Micro-electromechanical semiconductor component and method for the production thereof |
| 11/21/2012 | CN102792168A Mems传感器 Mems Sensor |
| 11/21/2012 | CN102786025A Integrated pressure sensor seal |
| 11/21/2012 | CN101965309B Micro fixture |
| 11/15/2012 | WO2012152719A1 Semiconductor device and method for producing a semiconductor device |
| 11/15/2012 | DE102009036033B4 Durchkontaktierung für Halbleiterwafer und Herstellungsverfahren Plated-through hole for semiconductor wafers and manufacturing processes |
| 11/14/2012 | CN102779809A Chip package and method for forming the same |
| 11/14/2012 | CN101774529B MEMS atom cavity chip and preparation method thereof |
| 10/31/2012 | CN202508875U Automatic wire arrangement microclamping device for micromotor |
| 10/31/2012 | CN102757010A A micro-electromechanical system (MEMS) device |
| 10/31/2012 | CN101628705B Substrate bonding method and electronic component thereof |
| 10/30/2012 | US8298457 Method of producing a movable lens structure for a light shaping unit |
| 10/26/2012 | WO2012144408A1 Method for bonding work and apparatus for bonding work |
| 10/26/2012 | WO2012144256A1 Mems sensor and method for manufacturing same |
| 10/26/2012 | WO2012088119A3 Three dimensional assembly of diamagnetic materials using magnetic levitation |
| 10/24/2012 | EP2512977A2 Method for plugging a hole and a plugged hole |
| 10/24/2012 | CN101698467B Scribing method for MEMS wafer level packaging |
| 10/17/2012 | CN102741674A Micro-electromechanical semiconductor component and method for the production thereof |
| 10/17/2012 | CN102730633A Forming a membrane having curved features |
| 10/10/2012 | EP2506920A1 Microfabricated surface neurostimulation device and methods of making and using the same |
| 10/10/2012 | CN102718179A Mems device and manufacturing process thereof |
| 10/10/2012 | CN102169038B Side wall protection method for MEMS (Micro Electronic Mechanical System) silicon capacitive pressure transducer with sandwich structure |
| 10/04/2012 | DE102011006596A1 Micro-mechanical arrangement for manufacturing thin polysilicon layer utilized as e.g. strip conductor, has hole pairs connected with micro-mechanical functional area over contact plugs and disconnected from area by gap |
| 10/03/2012 | CN102701145A Method for irreversible bonding of high-quality polydimethylsiloxane (PDMS)-polyolefine plastics |
| 10/03/2012 | CN102701139A Preparation method of solid state chemistry micro-propeller |
| 10/03/2012 | CN102701137A Anti-overload MEMS (Micro Electro Mechanical Systems) device with three-dimensional stop structure and machining method thereof |
| 10/03/2012 | CN101625542B Method of manufacturing a micromechanical part |
| 09/27/2012 | WO2012078541A3 Methods for anodic bonding material layers to one another and resultant apparatus |
| 09/27/2012 | DE102011001422A1 Sensor module has three sensors electrically connected with electric wires that are provided at mounting substrate and sensors are mounted at mounting substrate |
| 09/20/2012 | US20120235694 Dynamic quantity sensor and manufacturing method thereof |
| 09/19/2012 | CN102674240A Micromechanical sensor and manufacturing method thereof |
| 09/18/2012 | US8269327 Vertical system integration |
| 09/12/2012 | CN102666368A Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip |
| 09/12/2012 | CN102659072A Bonding equipment for chips and wafers |
| 09/12/2012 | CN102659071A Composite anodic bonding method |
| 09/05/2012 | EP2495752A1 Controller for bonding apparatus and multilayer bonding method |
| 09/05/2012 | CN101858929B Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof |
| 09/05/2012 | CN101734612B Manufacturing method of wafer level glass microcavity used for packaging MEMS |
| 08/30/2012 | DE10231730B4 Mikrostrukturbauelement Microstructure component |
| 08/29/2012 | CN102649538A Silica glass bonding-based SOI MEMS (silicon on insulator micro electro mechanical system) preparation method |
| 08/29/2012 | CN101704497B Structure of single-etch tank hermetically packaged by MEMS in wafer level and method thereof |
| 08/22/2012 | CN102645294A Pressure sensor chip based on ZnO nanoline array, and manufacturing method of pressure sensor chip |
| 08/22/2012 | CN102642808A Preparation method of glass/silicon/glass three-layer structure material based on electrostatic bonding |
| 08/22/2012 | CN101657961B Electrically conductive polymer actuator, method for manufacturing the same, and method of driving the same |
| 08/16/2012 | WO2012084384A3 Assembly of a component which does not have a plastic domain |
| 08/16/2012 | WO2012084383A3 Assembly of a component which does not have a plastic domain |
| 08/16/2012 | US20120208343 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |