| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 12/26/2007 | CN101093817A Structure for packaging semiconductor, fabricating method |
| 12/26/2007 | CN101092232A Method for preparing inorganic Nano / micro tube |
| 12/25/2007 | US7311503 Micromachined fluidic device and method for making same |
| 12/11/2007 | US7307775 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 12/06/2007 | WO2007139152A1 Device by cold junction, process for manufacturing device, and cold junction apparatus |
| 12/06/2007 | WO2007138346A1 A bonding tool and method |
| 12/06/2007 | CA2669733A1 Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus |
| 12/05/2007 | CN101081692A Method for manufacturing semiconductor package structure having micro electro-mechanical system |
| 11/29/2007 | WO2007135878A1 Microstructure, micromachine, and manufacturing method of microstructure and micromachine |
| 11/27/2007 | US7299815 Micropump check valve device and method of manufacturing the same |
| 11/21/2007 | EP1857407A2 Method of aligning mask layers to buried features |
| 11/15/2007 | WO2007129983A1 Anodic bonding of polymers to glass, silicon or other materials |
| 11/15/2007 | US20070262306 Semiconductor device having microstructure and method of manufacturing microstructure |
| 11/14/2007 | EP1853676A1 Method of bonding substrates |
| 11/14/2007 | CN101072635A Support unit for micro fluid system and process for producing the same |
| 11/14/2007 | CN100348323C Microfluidic apparatus with integrated porous-substrates/sensor for real-time biochemical molecule detection |
| 11/08/2007 | US20070256774 Method of manufacturing microstructure and manufacturing system for the same |
| 11/07/2007 | CN101069293A Micro-electromechanical device |
| 10/18/2007 | DE102006016275A1 Verfahren zum Platzieren von elektrisch kontaktierbaren Bauelementen auf einem Schaltungsträger sowie zur Durchführung dieses Verfahrens geeignetes Montagesystem Method of placing electrically contactable components on a circuit carrier and for carrying out this method suitable mounting system |
| 10/17/2007 | EP1558954B1 Method of producing a movable lens structure for a light shaping unit |
| 10/11/2007 | DE102007015892A1 Abdeckungsanbringungsstruktur, Halbleitervorrichtung und Verfahren dafür Cover mounting structure, the semiconductor device and method thereof |
| 10/11/2007 | DE102004042538B4 Verfahren zum Herstellen eines Gehäuses für eine elektronische Komponente A method of manufacturing a housing for an electronic component |
| 10/10/2007 | CN101049904A Vacuum packaging method and equipment |
| 10/03/2007 | CN200955018Y Microcomputer electric module package structure |
| 09/25/2007 | US7274096 Light transmissive cover, device provided with same and methods for manufacturing them |
| 09/20/2007 | DE102006011753A1 Halbleitersensorbauteil mit Sensorgehäuse und Sensorchip und Verfahren zur Herstellung desselben Of the same semiconductor sensor device with the sensor housing and the sensor chip and method for producing |
| 09/19/2007 | EP1833754A2 Bonding method for reducing stress in multilayered wafer |
| 09/19/2007 | CN101037032A 3d structure based on 2d substrate |
| 09/19/2007 | CN100337905C Manufacturing system for microstructure |
| 09/13/2007 | WO2007102210A1 Heat focusing jig for anodic bonding, method of anodic bonding and apparatus therefor |
| 09/12/2007 | EP1832339A1 Support unit for micro fluid system and process for producing the same |
| 09/04/2007 | US7263883 Gyro-sensor comprising a plurality of component units, and fabricating method thereof |
| 08/29/2007 | EP1824779A1 Device and method for hermetically sealing a cavity in an electronic component |
| 08/29/2007 | CN100334479C Optical modulator and manufacturing method thereof |
| 08/29/2007 | CN100333992C Method of manufacturing microstructure and manufacturing system for the same |
| 08/22/2007 | CN101022255A Two-dimensional rotary remote operating method for micro structural components |
| 08/22/2007 | CN101021541A Bio-chip lattice method and device thereof |
| 08/16/2007 | DE10222958B4 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element A method of manufacturing an organic electro-optical element and an organic electro-optical element |
| 08/16/2007 | DE102006005994A1 Semiconductor component e.g. semiconductor chip useful in semiconductor wafer comprises semiconductor substrate having active area region, interspace between carrier and covering filled with underfiller material |
| 08/16/2007 | DE102005053722B4 Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile Cap wafer, which can be used in microsystems technology device with such a wafer and soldering for connecting corresponding component parts |
| 08/15/2007 | CN101016148A Chip-stage cavity airtight packaging method and packaging structure |
| 08/09/2007 | WO2007089204A1 Mems components and method for manufacturing same |
| 08/08/2007 | CN1330557C Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same |
| 08/08/2007 | CN101012052A Micro and nano structure assembling method welded by energy beam |
| 08/07/2007 | US7253388 Assembly with self-alignment features to position a cover on a substrate that supports a micro component |
| 08/01/2007 | CN1329285C Method for producing a product having a structured surface |
| 08/01/2007 | CN1329284C Fabrication of a reflective spatial light modulator |
| 07/26/2007 | WO2007082380A1 Redeposition technique for membrane attachment |
| 07/25/2007 | EP1809569A1 Method for aligning or assembling nano-structure on solid surface |
| 07/19/2007 | WO2007080206A1 Method for obtaining microfluidic polymer structures |
| 07/19/2007 | US20070164634 Micro-electromechanical device |
| 07/19/2007 | DE10348245B4 Sensoren auf der Basis von Dichte-Unterschieden in Fluiden und Verfahren zum Betrieb und zur Herstellung derartiger Sensoren zur Erfassung von Bewegung, Lage, Fluid-Eigenschaften Sensors on the basis of density differences in fluids and methods of operation and for the preparation of such sensors for detecting movement, position, fluid properties |
| 07/04/2007 | CN1324238C Micromachined fluidic device and method for making same |
| 07/03/2007 | US7239054 Method of forming a micro-rotating device, and a micro-rotating device produced by the method |
| 06/28/2007 | DE102006058325A1 Halbleiterdynamiksensor und Verfahren zur Herstellung desselben A semiconductor dynamic sensor and method for manufacturing the same |
| 06/28/2007 | DE102004052688B4 Lumineszenzdiodenchip sowie optoelektronisches Bauteil mit solch einem Lumineszenzdiodenchip LED chip and optoelectronic device with such a luminescence |
| 06/27/2007 | CN1988018A Method of fabricating micro actuator having media stage |
| 06/27/2007 | CN1987486A Integrated optic grating interference micro mechanical acceleration sensor and its producing method |
| 06/26/2007 | US7236279 Digital optical switch apparatus and process for manufacturing same |
| 06/21/2007 | WO2005089348A3 Packaging for micro electro-mechanical systems and methods of fabricating thereof |
| 06/21/2007 | US20070137780 Method of fabricating micro actuator having media stage |
| 06/21/2007 | DE102005060876A1 Sensor and production process has connected carrier and sensor substrates with metal-free sensor region arranged over a recess in the carrier substrate |
| 06/21/2007 | DE102005015109B4 Verfahren zum Montieren von Halbleiterchips auf einem Substrat und entsprechende Anordnung A method of mounting semiconductor chips on a substrate and corresponding arrangement |
| 06/14/2007 | DE19957326B4 Verfahren zur Herstellung von Kontaktstrukturen A method for producing contact structures |
| 06/13/2007 | EP1795498A2 Package for a semiconductor device |
| 06/07/2007 | WO2007047523A3 System and method for positioning and synthesizing of nanostructures |
| 06/07/2007 | US20070128831 Process for fabricating a micro-electro-mechanical system with movable components |
| 06/06/2007 | DE19945470B4 Verfahren zum Herstellen einer mikrofunktionalen Verbundvorrichtung A method of manufacturing a micro-composite functional device |
| 06/06/2007 | CN1974372A Monolithic integrated sensor chip for measing three parameters of pressure difference, absolute pressure and temperature and its making process |
| 05/31/2007 | WO2007060289A1 Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
| 05/31/2007 | US20070122929 Method and zone for sealing between two microstructure substrates |
| 05/30/2007 | EP1790704A1 micro system component and method for bonding micro components to a substrate |
| 05/30/2007 | CN1970431A Mciromechanical two-dimensional obliquity sensor silicon chip and production method |
| 05/29/2007 | CA2380075C Microfabricated devices and method of manufacturing the same using polymer gel |
| 05/24/2007 | DE102005053722A1 Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile Cap wafer, which can be used in microsystems technology device with such a wafer and soldering for connecting corresponding component parts |
| 05/23/2007 | CN1966394A Touch sensor and its manufacture method |
| 05/16/2007 | CN1962410A Liquid-liquid interface magnetic force assisted tridimensional micro part self-assembling method |
| 05/10/2007 | US20070105342 Method of fabricating microelectromechanical system structures |
| 05/10/2007 | DE10161492C5 Verfahren zur Herstellung und Magazinierung von Mikrobauteilen, Magazin und Montageverfahren für Mikrobauteile Process for the preparation and magazining microcomponents, magazine and installation procedures for micro-components |
| 05/09/2007 | CN1958437A Method for bonding silicon with gold |
| 05/08/2007 | US7215061 Micromechanical electrostatic resonator |
| 05/03/2007 | US20070096294 Semiconductor device and manufacturing method of the same |
| 05/03/2007 | DE102005052039A1 Micropump manufacturing method for use in e.g. medical technology, involves providing inner structures of micropump on substrate, where substrate and glasses are anodically bonded to each other in region of inner structures |
| 05/02/2007 | EP1780175A2 Method for assembling MEMS parts |
| 04/26/2007 | WO2007047523A2 System and method for positioning and synthesizing of nanostructures |
| 04/12/2007 | WO2006127814A3 Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in mems accelerometers |
| 04/12/2007 | DE10335492B4 Verfahren zum selektiven Verbinden von mikrostrukturierten Teilen A method for selectively connecting microstructured parts |
| 04/12/2007 | DE102005042317B3 Layer arrangement production, for use in microelectronic devices, comprises bonding together partial layer systems contacted with oxide layer interfacing with additional nitride layer to ensure high energy bonding |
| 04/11/2007 | EP1772426A2 Surface preparation for selective silicon fusion bonding |
| 04/04/2007 | CN1308221C MEMS array, manufacturing method thereof, and MEMS device manufacturing method based on the same |
| 04/03/2007 | US7197798 Method of fabricating a composite apparatus |
| 03/29/2007 | US20070072330 Wafer bonding compatible with bulk micro-machining |
| 03/28/2007 | EP1766663A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 03/28/2007 | EP1765724A1 Method and system for improving alignment precision of parts in mems |
| 03/28/2007 | CN1935630A Micro electromechanical system chip size airtight packaging vertical interconnecting structure and its manufacturing method |
| 03/28/2007 | CN1935629A Polyamide membrane self-assembling manufacture process |
| 03/28/2007 | CN1935628A Polyamide membrane self-assembling structure |
| 03/22/2007 | US20070065595 Micro-structure formed of thin films |
| 03/22/2007 | DE102005040781A1 Sensor and production process especially for pressure measurement as in a tire has housing with micro-mechanical sensor, evaluation element and a carrier in the housing |
| 03/15/2007 | US20070059216 Hydrophobic Barriers |