| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 03/08/2007 | US20070051461 Method for joining plastic work pieces |
| 03/07/2007 | EP1758729A1 Method for joining plastic workpieces |
| 03/01/2007 | WO2007023941A1 Holding apparatus, assembly system, sputtering apparatus, machining method and machining apparatus |
| 02/22/2007 | US20070042565 Fluidic MEMS device |
| 02/22/2007 | DE10338967B4 Verfahren zum Kleben von Mikrobauteilen auf ein Substrat Method for bonding of micro components on a substrate |
| 02/21/2007 | EP1501756B1 Method of manufacturing an electronic device in a cavity with a cover |
| 02/21/2007 | CN1915798A Method for preparing Nano getter |
| 02/15/2007 | WO2007018955A1 Micro electro-mechanical system packaging and interconnect |
| 02/15/2007 | WO2007017458A1 Microcomponent with nanostructured silicon surface, method for producing it, and connection arrangement comprising such microcomponents |
| 02/14/2007 | EP1753023A2 Method of manufacturing an electronic device in a cavity with a cover |
| 02/14/2007 | CN1300595C Direct heating terminal type micro electronic mechanical system microwave power sensor and its producing method |
| 02/08/2007 | DE102005037139A1 Verfahren zur Verbindung von Mikrobauteilen mit nanostrukturierten Siliziumoberflächen und Verfahren zur deren Herstellung A method for connection of microcomponents with nanostructured silicon surfaces and methods for their preparation |
| 02/06/2007 | US7172916 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate |
| 01/31/2007 | CN1906983A Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
| 01/25/2007 | CA2580599A1 Gold thiolate and photochemically functionalized microcantilevers using molecular recognition agents |
| 01/24/2007 | CN1899953A Adjustable heat press key binding packaging method for degradable high polymer material micro array structure |
| 01/17/2007 | EP1363737A4 Microarrayer |
| 01/11/2007 | DE19537285B4 Verfahren zur Herstellung eines Halbleiterelements mit einer flexiblen Anordnung, Halbleiterelement, Feldeffektsensor mit beweglichem Gate, Verfahren zur Verwendung eines Transistors mit beweglichem Gate als Sensor, sowie kapazitiver Sensor A process for producing a semiconductor element with a flexible arrangement, the semiconductor element, field effect sensor with a movable gate, method of using a transistor as a sensor with a movable gate, and a capacitive sensor |
| 01/11/2007 | DE102005032115A1 Verfahren zum Fügen von Werkstücken und mikrostrukturiertes Bauteil A method of joining workpieces and micro-structured component |
| 01/11/2007 | DE102004006156B4 Verfahren zum Herstellen eines mikrokapazitiven Ultraschall-Wandlers A method for producing a mikrokapazitiven ultrasonic transducer |
| 01/10/2007 | EP1658344B1 Microsystem component and method for gluing microcomponents to a substrate |
| 01/10/2007 | CN1894155A Method and system for self-aligning parts in mems |
| 01/09/2007 | US7160476 Method of manufacturing an electronic device |
| 01/03/2007 | CN1887686A Two-freedom air-floated precisely locating platform for IC packaging |
| 12/28/2006 | DE102005029407A1 Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat Method and apparatus for permanently joining integrated circuits to a substrate |
| 12/26/2006 | US7154173 Semiconductor device and manufacturing method of the same |
| 12/26/2006 | US7153759 Method of fabricating microelectromechanical system structures |
| 12/26/2006 | US7153718 Micromechanical component as well as a method for producing a micromechanical component |
| 12/21/2006 | WO2006134260A1 Compounds for placing objects by self assembling and the use thereof |
| 12/21/2006 | US20060286388 Anodically bonded stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed |
| 12/19/2006 | US7150191 Pyramid socket suspension |
| 12/06/2006 | CN1872658A Switch capsulation structure of microelectronic mechanical system in radio frequency with thin top cover and manufacturing method |
| 12/06/2006 | CN1288724C Method for forming a cavity structure on SOI substrate |
| 12/06/2006 | CN1287977C Coupling structure for component and coupling method |
| 11/30/2006 | WO2006127814A2 Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in mems accelerometers |
| 11/30/2006 | DE102005023591A1 Feldmesseinrichtung, Messbaugruppe für eine Feldmesseinrichtung und Herstellungsmethode für eine Mehrzahl von Messbaugruppen Field measuring device, the measuring assembly for a field measuring device and manufacturing method for a plurality of measurement modules |
| 11/30/2006 | DE10027060B4 Abtastspitzen,Verfahren zur Herstellung und Verwendung derselben, insbesondere für die Rastersondenmikroskopie Scanning tips, method for preparation and use thereof, in particular for scanning probe microscopy |
| 11/29/2006 | CN1286711C Method for constructing non-close packing colloid balls ordered arrangement using soft-graving technology |
| 11/22/2006 | EP1723072A2 Mechanical sensor with pyramid socket suspension |
| 11/09/2006 | US20060250201 Micro relay |
| 11/09/2006 | DE102005021324A1 Silicon wafers bonding method for production of pressure sensor, involves carrying out in situ-reaction of oxygen in cavities with silicon of walls under formation of silicon dioxide during annealing step |
| 11/02/2006 | US20060244085 Method for forming a chamber in an electronic device and device formed thereby |
| 11/02/2006 | US20060243380 Microsystem component and method for gluing microcomponents to a substrate |
| 11/02/2006 | DE20321316U1 Component for use in area of micro technology, has tubes with smaller diameter aligned parallel with linear extensions by connecting unit and combined to cable, where unit has laminar units provided in surface with continuous grooves |
| 11/02/2006 | DE102005020016A1 Semiconductor chip, e.g. air flow sensor chip, assembling method, involves assembling chip mounting area on carrier surface area by flip-chip technology, and assembling profile device mounting area such that chip is embedded into device |
| 11/02/2006 | DE102005017527A1 Oberflächenmontierbares optoelektronisches Bauelement Surface-mountable optoelectronic component |
| 11/01/2006 | CN1856440A Process for fabricating a micro-electro-mechanical system with movable components |
| 11/01/2006 | CN1854061A Sockets for microassembly |
| 10/26/2006 | WO2006112387A1 Micromachine structure system and method for manufacturing same |
| 10/17/2006 | US7122937 Electrostatic driving device having an interval between electrodes facing each other and manufacturing method of the same |
| 10/12/2006 | US20060228066 Optical microelectromechantical structure |
| 10/11/2006 | EP1709847A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
| 10/05/2006 | DE102005015109A1 Semiconductor chip assembling method, involves lifting component region of chip from substrate such that region indirectly contacts substrate via soldering material and chip is assembled on substrate by flip-chip technique |
| 10/04/2006 | CN1277738C Clamp for disk vacuum pack |
| 10/03/2006 | US7115182 Anodic bonding process for ceramics |
| 09/27/2006 | CN1276869C Method of utilizing pre-etched glass base material to reduce post-release time |
| 09/20/2006 | CN1834601A Automatic bonding method of MEMS high temp pressure sensor |
| 09/20/2006 | CN1834000A Round piece class airtight packing technique having low depth-width ratio through hole |
| 09/19/2006 | US7107840 Pyramid socket suspension |
| 09/13/2006 | EP1700821A2 Sockets for microassembly |
| 09/13/2006 | CN1832899A Optical microelectromechanical structure |
| 09/06/2006 | EP1697256A1 Method and system for self-aligning parts in mems |
| 08/31/2006 | WO2006089337A1 Method of bonding substrates |
| 08/31/2006 | US20060191629 Anodically bonding a stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed |
| 08/31/2006 | DE10239306B4 Verfahren zum selektiven Verbinden von Substraten A method of selectively bonding substrates |
| 08/30/2006 | EP1696698A2 Condenser microphone and method for manufacturing the same |
| 08/24/2006 | WO2006073829A3 Bonding method for reducing stress in multilayered wafer |
| 08/23/2006 | CN1821052A Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
| 08/10/2006 | US20060177963 Process for producing copy protection for an electronic circuit |
| 08/08/2006 | US7088019 Air bearing for MEMS based motor |
| 08/08/2006 | CA2533974A1 Micro-optical device and method of making same |
| 08/02/2006 | CN1267764C Imaging technique using optical MEMS device |
| 08/01/2006 | US7083737 Method for manufacturing a micro-actuator |
| 07/27/2006 | DE10302771B4 System und Verfahren zur Herstellung von Mikrobauteilen System and method for producing microcomponents |
| 07/27/2006 | DE102005002967A1 Verfahren zum Herstellen eines Bauelementes mit einem beweglichen Abschnitt A method for manufacturing a component having a movable portion |
| 07/26/2006 | EP1440322B1 Micro-sensor |
| 07/19/2006 | CN1803577A High-precision three-dimensional micro-assembling method and assembly parts based on MEMS |
| 07/18/2006 | US7078804 Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same |
| 07/13/2006 | WO2006073829A2 Bonding method for reducing stress in multilayered wafer |
| 07/13/2006 | DE10350460B4 Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung A process for preparing micromechanical and / or microelectronic structures having semiconductor devices caused by the solid connecting at least two semiconductor wafers, and corresponding arrangement |
| 07/13/2006 | DE102005000799A1 Fluidische Struktur und Verfahren zum Erzeugen einer fluidischen Struktur Fluidic structure and method for generating a fluidic structure |
| 07/13/2006 | DE102004063544A1 Strukturieter Trägerstreifen Strukturieter carrier strip |
| 07/11/2006 | US7073380 Pyramid socket suspension |
| 07/06/2006 | DE102004060197A1 Method for precision aligning and/or fitting at least two components, with surface of each facing component contains at least one determined microstructure |
| 07/04/2006 | US7071031 Three-dimensional integrated CMOS-MEMS device and process for making the same |
| 06/29/2006 | DE102004061056A1 Micromechanical functional component manufacturing method for e.g. micro pump, involves connecting substrates by local application of thermal energy in intermediate layer formed from glass frit, where application is carried out by laser |
| 06/27/2006 | US7065867 Low temperature hermetic sealing method having passivation layer |
| 06/22/2006 | WO2006064158A1 Device and method for hermetically sealing a cavity in an electronic component |
| 06/22/2006 | US20060131262 Fabrication of a reflective spatial light modulator |
| 06/21/2006 | EP1671924A2 Micromechanical device and method of manufacturing a micromechanical device |
| 06/21/2006 | EP1671923A2 Micromechanical device and method of manufacturing a micromechanical device |
| 06/21/2006 | CN1260589C Functional device, mfg. method thereof and drive circuit |
| 06/15/2006 | WO2006062191A1 Support unit for micro fluid system and process for producing the same |
| 06/15/2006 | US20060128048 Pyramid socket suspension |
| 06/15/2006 | US20060123927 Pyramid socket suspension |
| 06/15/2006 | US20060123907 Pyramid socket suspension |
| 06/14/2006 | DE102005007423B3 Integration of electronic component (8) into substrate by formation of dielectric insulating layers on substrate front side useful in structural element modelling in semiconductor flip-chip technology with photoresistive layer in cavity |
| 06/13/2006 | US7060521 Bonding method |
| 06/13/2006 | US7060227 Microfluidic devices with raised walls |
| 06/08/2006 | DE102005058276A1 Sensorvorrichtung Sensor device |