Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
08/2002
08/08/2002US20020104823 Fabrication integration of micro-components
08/07/2002EP1228998A2 Micromechanical device and process for the manufacture of a micromechanical device
08/01/2002US20020102716 Microarrayer
08/01/2002US20020100714 Microfluidic devices
07/2002
07/31/2002EP1226098A1 Method for assembling reinforcing elements by bonding and device obtained by said method
07/31/2002EP1226089A1 Electromechanical component and method for producing said component
07/25/2002US20020097963 Optical waveguide device and method of manufacturing the same
07/24/2002EP1225460A2 Optical waveguide device and method of manufacturing the same
07/19/2002CA2368568A1 Optical waveguide device and method of manufacturing the same
07/18/2002US20020093143 Micromachined rubber O-ring microfluidic couplers
07/17/2002EP1222142A1 Electro-mechanical component and method for producing the same
07/17/2002EP1222141A1 Modular microfluidic devices comprising sandwiched stencils
07/11/2002WO2000065641A9 Microwave bonding of mems component
07/04/2002US20020086458 Precision micromirror positioning
07/03/2002EP1219565A1 Process for manufacturing integrated devices having connections on separate wafers and stacking the same
07/03/2002EP1218790A2 Microelectromechanical device with moving element
06/2002
06/27/2002US20020082172 Accurate etching of an strontium titanate single crystal substrate by forming a patterned silica protective film and etching with phosphoric acid; superconducting quantum interfers; magnetic/electric field sensors; microscope probes
06/20/2002US20020075568 Process for producing a microoptical functional unit
06/20/2002US20020074310 Method of fabricating a cooperating array of rotatable microstructure devices
06/19/2002EP1215168A1 Magnetically packaged optical mems device and method for making the same
06/19/2002EP1214630A2 Microfabricated devices and method of manufacturing the same
06/13/2002US20020072201 Method for electrostatic force bonding and a system thereof
06/13/2002US20020071166 Magnetically packaged optical MEMs device and method for making the same
06/11/2002US6401544 Micromechanical component protected from environmental influences
06/06/2002DE10058074A1 Verfahren zur Herstellung einer mikrooptischen Funktionseinheit A process for producing a micro-optical function unit
05/2002
05/29/2002EP1209499A2 Method of manufacturing a micro-optical functional unit
05/28/2002US6393685 Microjoinery methods and devices
05/23/2002WO2002040901A1 Micromachined rubber o-ring microfluidic couplers
05/21/2002US6392144 Micromechanical die attachment surcharge
05/21/2002US6391742 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same
05/21/2002US6391673 Method of fabricating micro electro mechanical system structure which can be vacuum-packed at wafer level
05/16/2002US20020057041 Piezoelectric/electrostrictive device and method of manufacturing same
05/15/2002EP1204479A1 Multiple fluid sample processor and system
05/14/2002US6387851 Strontium titanate
05/02/2002US20020051281 Galvano-mirror and method of making the same
04/2002
04/25/2002WO2002010684A3 Three-axes sensor and a method of making same
04/18/2002US20020044745 Method of aligning an optical component with an inclined guide mounted on a base and the associated optical device
03/2002
03/20/2002EP1188047A1 Miniaturized analytical system
03/14/2002WO2001058803A3 Method for producing a micromechanical component, and a component produced according to said method
03/07/2002WO2001056921A3 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
03/07/2002US20020026724 Method of aligning micro structures using guides
02/2002
02/28/2002US20020025280 Methods and devices for enhancing bonded substrate yields and regulating temperature
02/28/2002US20020024662 Micro-fluidic cell for optical detection of gases and method for producing same
02/27/2002EP1181716A1 Microwave bonding of mems component
02/27/2002CN1338195A Flexible microsystem and building techniques
02/27/2002CN1338116A Micro-relay
02/21/2002US20020021055 Micro-actuator and manufacturing method thereof
02/20/2002EP1180493A2 Micro-actuator and manufacturing method thereof
02/14/2002US20020019079 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same
02/13/2002EP1179139A1 Micromechanic pump
02/07/2002WO2002011189A2 A tunneling sensor or switch and a method of making same
02/07/2002WO2002010684A2 Three-axes sensor and a method of making same
01/2002
01/17/2002US20020004991 Micro positioning device with shared actuators
01/09/2002EP1169891A1 Flexible microsystem and building techniques
01/02/2002EP1166352A1 Micro-relay
12/2001
12/27/2001WO2001097974A1 Methods and devices for enhancing bonded substrate yields and regulating temperature
12/27/2001US20010054315 Micromechanical component protected from environmental influences
12/27/2001CA2410238A1 Methods and devices for enhancing bonded substrate yields and regulating temperature
12/05/2001EP1160602A1 Alignment of flip-chip mounted laser in a tilted position on a base using alignment studs
12/04/2001US6325886 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
11/2001
11/29/2001WO2001090577A1 Micromachined fluidic device and method for making same
11/29/2001US20010045610 Micro-machined surface structure
11/28/2001EP1157967A2 Packaging micromechanical devices
11/22/2001US20010042598 Apparatus for manufacturing micro-structure
11/22/2001CA2342409A1 Packaging micromechanical devices
11/20/2001US6318177 Micromechanical component and method for producing the micromechanical component
11/15/2001WO2001085602A1 Micro channel in a substrate
11/11/2001CA2308015A1 Method for manufacturing carbon nanotubes as functional elements of mems devices
11/08/2001US20010038148 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
11/07/2001EP1151962A1 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
10/2001
10/24/2001CN1318508A Layout and partition method of multiple processer unit in photoelectronic multichip module
10/18/2001DE10016017A1 Verfahren zur Montage von magazinierten Mikrobauteilen Method for mounting of microcomponents collated
10/17/2001EP1146533A1 Micromachine switch and its production method
10/09/2001US6300676 Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same
10/04/2001WO2001072467A1 Method for assembling cassette-loaded microcomponents
09/2001
09/26/2001EP1135792A1 Method for manufacturing carbon nanotubes as functional elements of mems devices
09/20/2001US20010023010 Multilayer films on substrate
09/19/2001EP1133642A1 Interconnection support for plate-like microcomponents
09/04/2001US6283730 Micro pump and method of producing the same
08/2001
08/30/2001WO2001007506A3 Microfabricated devices and method of manufacturing the same
08/30/2001US20010017058 Micromechanical component and method for producing the micromechanical component
08/23/2001WO2001060614A1 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
08/16/2001WO2001058803A2 Method for producing a micromechanical component, and a component produced according to said method
08/16/2001DE10006035A1 Micro-mechanical component production, used as sensor element or actuator element, comprises providing functional element and/or functional layer with protective layer
08/09/2001WO2001056921A2 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
07/2001
07/31/2001US6268232 Method for fabricating a micromechanical component
07/26/2001US20010009776 Growing epitaxial layer on substrate to form semiconductor wafer, removing selective portion of epitaxial layer to define rotor element and stator element capacitively coupled to rotor, removing portion of substrate below rotor
07/19/2001US20010008300 Semiconductor device with flat protective adhesive sheet and method of manufacturing the same
07/11/2001EP1113832A1 Surface micromachined microneedles
07/03/2001US6255741 Semiconductor device with a protective sheet to affix a semiconductor chip
06/2001
06/26/2001US6251567 Process for manufacturing microstructured bodies
06/21/2001WO2001044140A1 Bonded products and methods of fabrication therefor
06/20/2001EP1108203A2 Micromechanical component protected against environmental influences
06/12/2001US6245593 Semiconductor device with flat protective adhesive sheet and method of manufacturing the same
06/12/2001US6245249 Micro-structure and manufacturing method and apparatus
05/2001
05/31/2001DE19964218A1 Elektromechanisches Bauelement und Verfahren zur Herstellung desselben An electromechanical component and method of manufacturing the same
05/29/2001US6238805 Low-stress interface between materials having different coefficients of expansion and method for fabricating same
05/25/2001WO2001006543A3 Microelectromechanical device with moving element
05/22/2001US6236111 Hybrid circuit substrate mountable micro-electromechanical component
05/10/2001WO2001033648A1 Piezoelectric macro-fiber composite actuator and manufacturing method
1 ... 11 12 13 14 15 16 17 18 19 20 21 22 23