| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
|---|
| 12/09/2009 | CN100568568C Micro-electromechanical device |
| 12/08/2009 | CA2487819C Bulk silicon mirrors with hinges underneath |
| 12/03/2009 | DE10314875B4 Temperaturbeständiges elektronisches Bauteil in Form eines Sensors oder Aktors und Verfahren zu seiner Herstellung Temperature resistant electronic component in the form of a sensor or actuator and process for its preparation |
| 12/02/2009 | CN101592578A Silicon cantilever sensor, preparation method and application thereof |
| 12/02/2009 | CN100564242C Method for preparing spherical glass micro-cavity used for MEMS disc type packaging |
| 11/26/2009 | US20090291264 Microfluid-System-Supporting Unit And Production Method Thereof |
| 11/25/2009 | EP2121511A2 Micropackaging method and devices |
| 11/25/2009 | CN101587847A Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate |
| 11/25/2009 | CN101585508A Preparation method of organic glass micro-fluidic chip based on photosensitive thixotrope film |
| 11/25/2009 | CN101585507A Method for producing through-hole structure in PDMS micro-fluidic chip |
| 11/19/2009 | DE102009020838A1 Sensor für physikalische Größe und Verfahren zu dessen Herstellung Sensor for physical size and process for its preparation |
| 11/18/2009 | CN100560475C Partial vacuum packaging method for resonant mode pressure sensor chip |
| 11/12/2009 | WO2009074368A3 Production method for a micromechanical component, and micromechanical component |
| 11/11/2009 | CN101576569A Vacuum micro-electronics acceleration transducer |
| 11/11/2009 | CN101575084A Method for bonding polymeric microfluidic chip in die |
| 11/11/2009 | CN100559559C Method for making encapsulation cover of optical part |
| 11/05/2009 | US20090274586 Micro fluid system support and manufacturing method thereof |
| 11/05/2009 | US20090274585 Micro fluid system support and manufacturing method thereof |
| 11/05/2009 | US20090274584 Micro fluid system support and manufacturing method thereof |
| 11/05/2009 | US20090274583 Micro fluid system support and manufacturing method thereof |
| 11/05/2009 | US20090274582 Micro fluid system support and manufacturing method thereof |
| 11/05/2009 | US20090274581 Micro fluid system support and manufacturing method thereof |
| 10/29/2009 | US20090269245 Micro fluid system support and manufacturing method thereof |
| 10/29/2009 | DE102008019692A1 Silicon micro system for use in area of e.g. microbiology for cultivating cell, has two-stage opening at upper side and/or lower side, and contact region that is nano-structured between system and integrated polymer-functional component |
| 10/28/2009 | CN101566502A Thermo-optical infrared detector and preparation method thereof |
| 10/28/2009 | CN101565160A Micro-electromechanical system and packaging method thereof |
| 10/22/2009 | US20090260692 Autonomous electrochemical actuation of microfluidic circuits |
| 10/21/2009 | CN101561510A Chip of three-dimensional MEMS geophone and preparation method thereof |
| 10/21/2009 | CN101561446A Glass micro-nano-fluidic control chip, preparation and assembly method and auxiliary assembly device thereof |
| 10/21/2009 | CN101559914A Digital micro-droplet drive with deep submicron pore structure and manufacturing method thereof |
| 10/15/2009 | WO2009125757A1 Microchip and method for manufacturing microchip |
| 10/14/2009 | CN101554988A Wafer-grade vacuum encapsulation method for micro-electro-mechanical system |
| 10/08/2009 | WO2009122466A1 Electroconductive polymer actuator, process for producing the electroconductive polymer actuator, and method for driving the electroconductive polymer actuator |
| 10/07/2009 | CN101553425A Micro electro mechanical system |
| 10/07/2009 | CN101549849A Method for fast releasing sacrificial layer in film shifting process |
| 10/07/2009 | CN101549848A Method for fabricating large angle turning micro mirror driver |
| 10/06/2009 | US7596841 Micro-electromechanical devices and methods of fabricating thereof |
| 10/01/2009 | US20090242048 Structured polydiorganosiloxane polyamide containing devices and methods |
| 09/30/2009 | CN101544350A Microstructure used for supersonic bonding of micro-passages of polymer microflow-control chips |
| 09/24/2009 | WO2009116162A1 Process for manufacture of packaged micro moving element, and packaged micro moving element |
| 09/24/2009 | US20090236226 Modular microfluidic system and method for building a modular microfludic system |
| 09/23/2009 | EP2102098A1 Multilayer device and apparatus and method for manufacturing such a device |
| 09/23/2009 | EP2102097A1 Device built by joining a plurality of layers |
| 09/16/2009 | EP2099708A1 Method for making microfluidic devices and devices resulting |
| 09/16/2009 | EP1663850B1 Process for fabricating a micro-electro-mechanical system with movable components |
| 09/16/2009 | CN101530775A Micro-fluidic apparatus integrated with PDMS film, manufacturing method and application thereof |
| 09/11/2009 | WO2009111737A1 Reconfigurable lithographic structures |
| 09/11/2009 | WO2009109288A2 Micro-fixture |
| 09/11/2009 | CA2716978A1 Micro-fixture |
| 09/09/2009 | CN101525116A Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof |
| 09/03/2009 | US20090217508 End Effector for Nano Manufacturing |
| 09/02/2009 | EP2096445A1 Microchip substrate bonding method and microchip |
| 08/27/2009 | WO2009104345A1 Jig for laminate joining apparatus |
| 08/26/2009 | CN100532248C Process for fabricating a micro-electro-mechanical system with movable components |
| 08/20/2009 | DE10256059B4 Heißprägewerkzeug Hot stamping tool |
| 08/19/2009 | CN101509933A Method for manufacturing micro-acceleration and micro-angular rate integration sensor |
| 08/06/2009 | US20090194768 Vertical system integration |
| 08/05/2009 | CN101497422A Low-temperature glass solder bonding and encapsulating method based on disc level glass micro-chamber |
| 08/04/2009 | US7569127 Interconnecting microfluidic package and fabrication method |
| 07/23/2009 | DE102007063040A1 Production of micro-reactors comprises coating a plate having channels and joint regions on the surface with a joining layer, applying a layer made from a suspension containing catalyst support particles and further processing |
| 07/22/2009 | CN100515922C Sensor having membrane and method for manufacturing the same |
| 07/16/2009 | WO2009087796A1 Cold jointing apparatus, and cold jointing method |
| 07/16/2009 | CA2711227A1 Room temperature bonding machine and room temperature bonding method |
| 07/15/2009 | EP1723072B1 Mechanical sensor with pyramid socket suspension |
| 07/15/2009 | CN101481082A Preparation of micro-nano lens array with adjustable light transmittance ratio |
| 07/15/2009 | CN100513299C Wafer level vacuum encapsulation of microelectron mechanical system and upside-down mounting soldering method thereof |
| 07/15/2009 | CN100513298C Method for bonding silicon with gold |
| 07/02/2009 | WO2009081763A1 Semiconductor device and method for manufacturing the same |
| 07/02/2009 | WO2009081459A1 Manufacturing method of packaged micro moving element and the packaged micro moving element |
| 07/01/2009 | CN101468787A Ultra-thin encapsulation structure of electroacoustic sensing micro-electro-mechanism system |
| 07/01/2009 | CN100507573C Micro-sensor |
| 06/18/2009 | DE102007060785A1 Method for manufacturing component or multiple components with micromechanical functional units, involves joining base element and attachment element for forming part of housing of component |
| 06/18/2009 | DE102007060632A1 Verfahren zum Herstellen eines Kappenwafers für einen Sensor A method of manufacturing a cap wafer for a sensor |
| 06/10/2009 | CN100498407C Bulk silicon mirrors with hinges underneath |
| 06/04/2009 | WO2009069807A1 Optical device, sealing board and method for manufacturing optical device |
| 06/04/2009 | DE102007057441A1 Verfahren zur Herstellung eines mikromechanischen Bauelements mit einem volumenelastischen Medium und mikromechanischen Bauelement A process for producing a micromechanical component having a volume-elastic medium and micromechanical component |
| 06/04/2009 | DE102007057429A1 Vorrichtung und Verfahren zum Drahtbonden Apparatus and method for wire bonding |
| 05/28/2009 | DE102007055019A1 Verfahren zum Herstellen einer nanoporösen Schicht A method for producing a nano-porous layer |
| 05/28/2009 | DE102007055017A1 Verfahren zum Verbinden zweier Fügeflächen A method for connecting two joint surfaces |
| 05/27/2009 | CN101439843A Miniature atomic air chamber encapsulation apparatus and technology method |
| 05/20/2009 | CN101434374A Structure and implementing method of MEMS device disc grade chip size hermetic package |
| 05/20/2009 | CN100488865C Method for preparing Nano getter |
| 05/19/2009 | CA2274620C Microfabricated sleeve devices for chemical reactions |
| 05/14/2009 | WO2009061282A1 An interconnect structure and a method of fabricating the same |
| 05/14/2009 | DE102006058325B4 Halbleiterdynamiksensor und Verfahren zur Herstellung desselben A semiconductor dynamic sensor and method for manufacturing the same |
| 04/29/2009 | CN101417864A Intermediate film material for anodic bonding of metallic material and glass-ceramics |
| 04/29/2009 | CN101417785A Wafer-level sensing element packaging structure and method for producing the same |
| 04/29/2009 | CN101417783A Micromechanical device and method of manufacturing micromechanical device |
| 04/21/2009 | US7520998 Method of fabricating micro actuator having media stage |
| 04/16/2009 | WO2006130558A3 Flexible structures for sensors and electronics |
| 04/16/2009 | DE102007048604A1 Verbund aus mindestens zwei Halbleitersubstraten sowie Herstellungsverfahren Composite of at least two semiconductor substrates and manufacturing method |
| 04/08/2009 | CN101405215A Microstructure, micromachine, and manufacturing method of microstructure and micromachine |
| 04/07/2009 | US7514045 Covered microchamber structures |
| 04/01/2009 | CN101397121A Silicon nanowire pressure sensor, cantilever beam, production method and pressure measurement method thereof |
| 03/19/2009 | WO2009034819A1 Microchip manufacturing method, microchip and vacuum bonding apparatus |
| 03/12/2009 | US20090068795 Production methods of electronic devices |
| 03/11/2009 | CN101381069A Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials |
| 03/10/2009 | US7501069 Flexible structures for sensors and electronics |
| 03/05/2009 | WO2009029262A1 Systems and methods for producing multi-component colloidal structures |
| 03/05/2009 | WO2009029043A1 Quantum tunnelling sensor device and method |