Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 3 - Assembling of devices or systems from individually processed components
Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
06/2010
06/29/2010US7744718 Microsystem component and method for gluing microcomponents to a substrate
06/29/2010CA2247777C A process for manufacturing microstructure bodies
06/24/2010DE102009055283A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
06/23/2010CN101746711A H-shaped two-dimensional ultraprecise worktable structure
06/23/2010CN101746706A Micro-electromechanical system (MEMS) wafer-level vacuum packaging transverse interconnection structure and manufacture method thereof
06/23/2010CN101217124B A low temperature flip chip welding method of macromolecule electric conducting material of template printing
06/17/2010WO2010066494A2 Arrangement of two substrates having a slid bond and method for producing such an arrangement
06/16/2010CN201506706U Hot-pressing encapsulating device of polymer micro-flow control chip
06/16/2010CN101738512A Probe assembly arrangement
06/16/2010CN101738280A Mems pressure sensor and manufacturing method thereof
06/16/2010CN101734613A SOI wafer-based MEMS structure manufacturing and dicing method
06/16/2010CN101734612A Manufacturing method of wafer level glass microcavity used for packaging MEMS
06/15/2010US7735216 Micro-electromechanical sub-assembly having an on-chip transfer mechanism
06/09/2010CN101729970A Micro-electro-mechanical microphone packaging process
06/09/2010CN101723304A Microstructure with flexible circuit board and manufacturing method thereof
06/09/2010CN101183675B Method and system for wafer-stage package of chip having a number of pieces
06/02/2010DE102009008032B4 Selbstmontage von Bauelementen Self-assembly of components
06/02/2010DE102006012645B4 Verfahren zum Verpacken von integrierten Schaltungen auf Waferniveau, zusammengesetzter Wafer und Packung auf Waferniveau A method of packaging integrated circuits at the wafer level, composite wafer, and wafer-level package
06/02/2010CN101717068A Method for preparing polymeric micro-fluidic chip based on hydrogel male mold
06/02/2010CN101717067A Barium strontium titanate-porous silicon composite material and preparation method thereof
06/02/2010CN101717062A Suspended polyphenylene ethyl film structure and preparation process thereof
06/02/2010CN101249936B Packaging conformation for micro electromechanical systems and method for manufacturing same
06/02/2010CN101202272B Sealing structure for MEMS devices and method of the same
05/2010
05/26/2010CN101712449A Double-corrosion groove capable of realizing MEMS wafer-level airtight encapsulation of glass slurry and method
05/26/2010CN101022255B Two-dimensional rotary remote operating method for micro structural components
05/20/2010DE102008043735A1 Anordnung von mindestens zwei Wafern mit einer Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung Arrangement of at least two wafers with a bonding compound and method for producing such an arrangement
05/19/2010CN201473309U Spraying processing device for producing semi-conductor
05/19/2010CN1987486B Integrated optic grating interference micro mechanical acceleration sensor and its producing method
05/12/2010CN101704499A Manufacturing method of Mach-Zehnder interference microfluidic optical gyro chip
05/12/2010CN101704497A Structure of single-etch tank hermetically packaged by MEMS in wafer level and method thereof
05/06/2010WO2010050500A1 Alignment device controller and alignment method
05/06/2010DE102008043382A1 Bauelement und Verfahren zu dessen Herstellung Device and process for its preparation
05/06/2010CA2732286A1 Alignment unit control apparatus and alignment method
05/05/2010EP2181961A2 MEMS devices and methods of assembling micro electromechanical systems (MEMS)
05/05/2010CN1771575B Micro relay
05/05/2010CN101700867A Manufacture method of MEMS packaged glass microcavity with optical window
04/2010
04/29/2010DE102009008032A1 Selbstmontage von Bauelementen Self-assembly of components
04/28/2010CN101698467A Scribing method for MEMS wafer level packaging
04/22/2010WO2010043966A2 Devices and methods for production of high-precision, multi-component devices
04/21/2010CN101695993A Method for high yield wafer-level package of MEMS device
04/20/2010US7700457 Method and zone for sealing between two microstructure substrates
04/15/2010WO2010040227A1 Hybrid digital and channel microfluidic devices and methods of use thereof
04/15/2010DE102006037512B4 Modul und Verfahren zur Herstellung eines Moduls mit übereinander gestapelten Bauelementen Module and method for manufacturing a module having stacked components
04/15/2010CA2740113A1 Hybrid digital and channel microfluidic devices and methods of use thereof
04/07/2010CN101692099A Piezoresistive double-shaft micro-accelerometer with on-chip zero offset compensation and manufacturing method thereof
04/07/2010CN101692016A Atmospheric pressure sensor compatible with CMOS process and preparation process thereof
04/07/2010CN101691203A Method and device for alignment and assembly of glass micro nanofluidic chip
04/07/2010CN101691200A Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof
04/01/2010DE102008042382A1 Kontaktanordnung zur Herstellung einer beabstandeten, elektrisch leitfähigen Verbindung zwischen mikrostrukturierten Bauteilen Contact arrangement for producing a spaced, electrically conductive connection between microstructured components
04/01/2010DE102008042350A1 Mikromechanisches Bauelement und Verfahren zu dessen Herstellung Micromechanical component and method for its production
04/01/2010DE102008042347A1 Micromechanical sensor for measuring acceleration or turning rate, has semiconductor material, in which cavity is formed
03/2010
03/31/2010EP2168673A1 Micro-passage chip
03/31/2010CN101687277A Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
03/31/2010CN101687276A Method for joining silicon base materials, liquid droplet delivery head, liquid droplet delivery apparatus, and electronic device
03/31/2010CN101685782A Coreless substrate package with symmetric external dielectric layers
03/31/2010CN101683967A Wafer level capsulation mechanism and wafer level capsulation method used for radio-frequency micro electromechanical system
03/31/2010CN101683966A Anti-static accumulation packaging structure for miniature electric field sensor
03/25/2010WO2010032822A1 Mems sensor
03/25/2010WO2010032821A1 Mems sensor
03/24/2010CN100595897C Crystal round stage encapsulation object and method for forming the same
03/18/2010US20100068107 Methods of making microfluidic devices and devices resulting
03/04/2010DE102009038706A1 Sensorbauelement Sensor device
03/04/2010DE102008041721A1 Micromechanical component i.e. acceleration sensor, manufacturing method, involves fastening lower side of element on upper side of another element, and removing silicon substrate of latter element after fastening process
03/04/2010DE102008041674A1 Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren Micro-mechanical device and manufacturing method thereof
03/04/2010DE102008041656A1 Method for manufacturing component, involves preparing two wafers, where contact opening extending perpendicular to main extension plane of former wafer is made in former wafer
03/04/2010DE102008041550A1 Im Diepadbereich strukuiertes Leadframe, dieses Leadframe umfassende mikrostruktuierte Bauteilanordnung und Verfahren zu deren Herstellung In strukuiertes leadframe die pad area, this lead frame comprehensive mikrostruktuierte component assembly and process for their preparation
02/2010
02/25/2010WO2010021263A1 Microchip and process for producing microchip
02/25/2010DE102009035358A1 Elektronikbauelement und Verfahren zu dessen Herstellung An electronics device and process for its preparation
02/24/2010EP2157605A1 Electronic part apparatus and process for manufacturing the same
02/24/2010EP2157402A1 Device for measuring the alignment of attached structures
02/23/2010US7666285 Portable water quality monitoring system
02/18/2010WO2009109288A3 Micro-fixture
02/11/2010WO2010016399A1 Microchip, method for fabricating microchip and apparatus for fabricating microchip
02/11/2010WO2010016371A1 Microchip, microchip manufacturing method and microchip manufacturing device
02/11/2010WO2010016370A1 Microchip, microchip manufacturing method and microchip manufacturing device
02/11/2010DE102008035990A1 Micro-valve for hydrogen gas cells, has valve seat with valve opening and valve flap for locking valve opening with cover section of valve flap
02/04/2010DE102008040775A1 Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln Encapsulation, MEMS and method for selectively encapsulate
02/03/2010CN101638214A Micro-electromechanical packaging method
01/2010
01/28/2010WO2010011244A1 Device for causing particles in a standing wave field to align in a desired configuration and fusing them into this configuration
01/28/2010US20100019623 Micro-electromechanical devices and methods of fabricating thereof
01/27/2010EP2147893A2 MEMS die to bump alignment
01/27/2010CN101636345A Method for making microfluidic devices and devices resulting
01/26/2010CA2536431C Process for fabricating a micro-electro-mechanical system with movable components
01/21/2010US20100014147 Production method for a micromechnical component, and a micromechanical component
01/21/2010DE102008040521A1 Verfahren zur Herstellung eines Bauelements, Verfahren zur Herstellung einer Bauelementanordnung, Bauelement und Bauelementanordnung A method for manufacturing a device, method of manufacturing a component assembly, the component and component arrangement
01/20/2010EP2145857A1 Method of manufacturing a micromechanical part
01/20/2010CN101628705A Substrate bonding method and electronic component thereof
01/18/2010CA2672597A1 Electromechanical device comprising electronic components and at least one nanotube-based interface, and manufacturing method
01/14/2010WO2010005061A1 Functional device and manufacturing method therefor
12/2009
12/31/2009DE102007030284B4 Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestelltes Zwischenprodukt A method of packaging of semiconductor devices and methods in accordance prepared intermediate
12/29/2009US7638098 Process and device for coupling hollow fibers to a microfluidic network
12/23/2009CN101607688A Non-energy-oriented ridge polymer ultrasonic bonding method based on temperature compensation
12/23/2009CN100573682C Method of fabricating micro actuator having media stage
12/17/2009DE102009021244A1 Mikroelektromechanische System-Bauelemente Microelectromechanical system components
12/17/2009DE102008025833A1 Verfahren und Vorrichtung zum stoffschlüssigen Fügen metallischer Anschlussstrukturen Method and apparatus for securely joining metallic connection structures
12/16/2009CN100570361C Method for bonding two solid surfaces through surface assemblying active functional group
12/15/2009CA2410306C Micromachined fluidic device and method for making same
12/10/2009DE102008002307A1 Herstellungsverfahren für ein mikromechanisches Bauelement, entsprechender Bauelementverbund und entsprechendes mikromechanisches Bauelement Manufacturing method for a micromechanical component, corresponding device and corresponding composite micromechanical component
12/10/2009DE102008002268A1 Sensor i.e. micromechanical sensor, arrangement, has sensor module arranged on side of carrier element, where carrier element and sensor module are partially enclosed by housing and side of carrier element has metallic coating
12/09/2009CN101597020A Germanium window, manufacture method thereof and air-tight case body with same
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