| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 08/17/2011 | CN101717062B Preparation process of suspended polyphenylene ethyl film structure |
| 08/11/2011 | DE102010007605A1 Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals |
| 08/11/2011 | DE102010001759A1 Mikromechanisches System und Verfahren zum Herstellen eines mikromechanischen Systems A micromechanical system and method for producing a micro-mechanical system |
| 08/10/2011 | CN1832899B Optical microelectromechanical structure |
| 08/10/2011 | CN102145874A Micro-electro-mechanical device and manufacturing method thereof |
| 08/10/2011 | CN101692016B Atmospheric pressure sensor compatible with CMOS process and preparation process thereof |
| 08/10/2011 | CN101337652B Packaging of contact surface of sensor element and packaging method thereof |
| 08/04/2011 | WO2011094643A2 Methods and system using microscopic building blocks for driving 3d self-assembly |
| 08/04/2011 | DE102010006492A1 Connection method for connecting accumulators of micro capillary hoses at common supply system in e.g. heat exchanger for solar collector in e.g. industrial region to transport liquid, involves producing core element using casting method |
| 08/03/2011 | CN101700867B Manufacture method of MEMS packaged glass microcavity with optical window |
| 07/28/2011 | DE102010042438A1 Sensoranordnung Sensor array |
| 07/27/2011 | EP2346778A2 Devices and methods for production of high-precision, multi-component devices |
| 07/27/2011 | EP2346777A1 Hybrid digital and channel microfluidic devices and methods of use thereof |
| 07/27/2011 | CN102134053A Manufacturing method of biaxial MEMS (micro-electro-mechanical system) gyroscope |
| 07/26/2011 | US7985081 Transferable micro spring structure |
| 07/20/2011 | CN1906983B On-chip system |
| 07/20/2011 | CN102126701A Controlled bond wave over patterned wafer |
| 07/20/2011 | CN102126700A Jointing device for workpiece |
| 07/20/2011 | CN101221911B Packaging micro devices |
| 07/07/2011 | WO2011057850A3 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip |
| 06/29/2011 | CN102113088A Alignment device controller and alignment method |
| 06/23/2011 | WO2011073393A2 Method for plugging a hole and a plugged hole |
| 06/23/2011 | WO2011072600A1 Manufacturing method of wafer level glass microcavity by using foaming molding |
| 06/23/2011 | CA2782262A1 Method for plugging a hole and a plugged hole |
| 06/16/2011 | WO2011070627A1 Method for bonding semiconductor substrates and mems device |
| 06/16/2011 | WO2011070626A1 Method for bonding semiconductor substrates and mems device |
| 06/16/2011 | WO2011070625A1 Method for bonding semiconductor substrates and mems device |
| 06/16/2011 | DE102009047710A1 Multimodulsensor Multi sensor module |
| 06/15/2011 | CN101530775B Micro-fluidic apparatus integrated with PDMS film, manufacturing method and application thereof |
| 06/09/2011 | WO2011067533A1 Method and device for producing a microstructure by means of transfer |
| 06/09/2011 | WO2011067297A1 Microfabricated neurostimulation device and methods of making and using the same |
| 06/09/2011 | DE19819456B4 Verfahren zur Herstellung eines mikromechanischen Bauelements A process for producing a micromechanical component |
| 06/09/2011 | DE102009047592A1 Silicon sub-carrier manufacturing method for installing e.g. electronic device, on substrate, involves applying electrically conductive material on insulation layer to form through-connection from one side to another side of substrate |
| 06/09/2011 | CA2782710A1 Microfabricated neurostimulation device and methods of making and using the same |
| 06/08/2011 | EP2329884A1 Method for hardening an adhesive material |
| 06/08/2011 | CN102087382A Fabrication method of isotropic photonic crystal with full-space forbidden band structure |
| 06/08/2011 | CN102086015A Support unit for microfluidic system and manufacturing method |
| 06/01/2011 | CN102079500A Micro electro mechanical system (MEMS) chip and preparing method thereof |
| 06/01/2011 | CN101172185B Process for producing implantation type two-sided flexible tiny array electrode |
| 06/01/2011 | CN101016148B Chip-stage cavity airtight packaging method and packaging structure |
| 05/26/2011 | WO2010043966A3 Devices and methods for production of high-precision, multi-component devices |
| 05/25/2011 | EP2325875A1 Semiconductor device |
| 05/25/2011 | CN101150889B Encapsulation structure and its method for computer electric microphone |
| 05/19/2011 | WO2011057850A2 Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip |
| 05/19/2011 | WO2011031432A3 Layered sintered microfluidic devices with controlled compression during sintering and associated methods |
| 05/18/2011 | CN101261964B Functional device package |
| 05/11/2011 | CN101332974B Thermal bonding device |
| 05/11/2011 | CN101332973B Anode bonding device |
| 05/05/2011 | WO2011052627A1 Controller for bonding apparatus and multilayer bonding method |
| 05/05/2011 | US20110104025 Method for producing reconfigurable microchannels |
| 05/05/2011 | CA2758157A1 Bonding unit control unit and multi-layer bonding method |
| 05/04/2011 | CN102044530A System packaging structure and manufacture method thereof |
| 05/04/2011 | CN101468787B Ultra-thin encapsulation structure of electroacoustic sensing micro-electro-mechanism system |
| 04/27/2011 | EP2315037A1 Microchip and process for producing microchip |
| 04/27/2011 | CN101607688B Non-energy-oriented ridge polymer ultrasonic bonding method based on temperature compensation |
| 04/20/2011 | CN201802574U Three-dimensional array for miniature silica-based electroosmotic pump |
| 04/20/2011 | CN102020236A Micro-electromechanical system chip and package method thereof |
| 04/20/2011 | CN102020234A Glue spraying processing device used in semiconductor manufacturing |
| 04/20/2011 | CN101128556B Method for felting underlay |
| 04/14/2011 | WO2011042422A1 Joining method and joint for microfluidic components |
| 04/14/2011 | DE102009045541A1 Method for manufacturing micromechanical device, involves arranging micro-electro-mechanical system structures and bond contact surfaces respectively in rows on micro-electro-mechanical system-wafer |
| 04/07/2011 | DE102009048384A1 Miniaturisierte Online-Spurenanalytik Miniaturized on-line trace analysis |
| 04/06/2011 | CN102001613A Microelectronic device and manufacturing method thereof, and micro electromechanical packaging structure and packaging method thereof |
| 03/31/2011 | DE102009045164A1 Sensoranordnung und Verfahren zu deren Herstellung Sensor arrangement and method for their preparation |
| 03/31/2011 | DE102005002967B4 Verfahren zum Herstellen eines Bauelementes mit einem beweglichen Abschnitt A method for manufacturing a component having a movable portion |
| 03/30/2011 | CN101999078A Microchip and method for manufacturing microchip |
| 03/30/2011 | CN101998213A 一种mems麦克风的封装结构及晶圆级封装方法 Package structure for a mems microphones and wafer level packaging method |
| 03/30/2011 | CN101997187A Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly |
| 03/30/2011 | CN101554988B Wafer-grade vacuum encapsulation method for micro-electro-mechanical system |
| 03/30/2011 | CN101323429B Method for encapsulating microstructure device by means of ultrasonic effect |
| 03/30/2011 | CN101150888B Encapsulation structure and its encapsulation method for computer electric microphone |
| 03/24/2011 | WO2010085942A3 Microstructure, method for producing the same, device for bonding a microstructure and microsystem |
| 03/23/2011 | CN101576569B Vacuum micro-electronics acceleration transducer |
| 03/17/2011 | WO2011031432A2 Layered sintered microfluidic devices with controlled compression during sintering and associated methods |
| 03/17/2011 | DE102010040011A1 Package-on-Package (POP)-optischer-Näherungssensor Package-on-Package (POP) -optischer proximity sensor |
| 03/17/2011 | DE102009029180A1 Mikrosystem Microsystems |
| 03/17/2011 | DE102009027391A1 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component |
| 03/16/2011 | CN101666646B Inclined double-end tuning-fork type silica micromechanical gyroscope and making method thereof |
| 03/10/2011 | DE102010009017A1 Verfahren zur Bildung eines endovaskulären Behandlungshilfsmittels mit Hilfe von selbstorganisierenden, aus Catomen (Cat) bestehenden Nanoroboter und dazu gehöriges System A method of forming an endovascular treatment aid with the help of self-organizing of carbon atoms (Cat) existing nanorobots and associated system |
| 03/10/2011 | DE102009029184A1 Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement Manufacturing method for a micromechanical component capped, micromechanical component and corresponding cap for a micromechanical component |
| 03/03/2011 | WO2011024648A1 Mems, and method for manufacturing same |
| 03/03/2011 | US20110048132 Microsystem |
| 03/02/2011 | EP2289845A1 Layered sintered microfluidic devices with controlled compression during sintering and associated methods |
| 02/24/2011 | DE102009037802A1 Mikrostruktur und Verfahren zum Montieren einer solchen Microstructure and method of mounting such a |
| 02/24/2011 | DE102004004539B4 Waferverbindung unter Verwendung von Reaktivfolien zum Häusen mikro-elektromechhanischer Systeme Wafer bonding using reactive foils for housing micro-elektromechhanischer systems |
| 02/17/2011 | US20110036479 Micro fluid system support and manufacturing method thereof |
| 02/17/2011 | DE10153319B4 Mikrosensor Microsensor |
| 02/09/2011 | CN101663748B Functional element package and fabrication method therefor |
| 02/09/2011 | CN101417864B Intermediate film material for anodic bonding of metallic material and glass-ceramics |
| 02/08/2011 | US7883670 Stacked together such that the apertures connect and fluid can flow through the device parallel to the direction of sheet thickness; laminated heat exchangers with microchannels; water vaporizers |
| 02/02/2011 | CN101965309A Micro fixture |
| 01/27/2011 | WO2011010739A1 Method for producing microstructure |
| 01/27/2011 | DE102009027995A1 Vorrichtung mit einem Halbleiterbauelement und einem Gehäuse und Verfahren zur Herstellung der Vorrichtung An apparatus with a semiconductor device and a housing, and method for manufacturing the device |
| 01/27/2011 | DE102009027893A1 Chip e.g. actuator chip, for use in e.g. angular velocity sensor, has recess that is formed in outer side of substrate area, where side walls of recess are partially coated with metal |
| 01/27/2011 | DE102009008772A1 Self-adjusting bonding method for positioning, fixing, contacting of chip on silicon surface, involves nano-structuring surface area of chip or chip carrier, where surface areas of needle are auxiliary nano-porous |
| 01/26/2011 | CN101959106A Packaging structure of microphone of micro electromechanical system and packaging method thereof |
| 01/26/2011 | CN101955152A Method of wafer-level airtight package with inverted Y-shaped through hole |
| 01/26/2011 | CN101634662B Micro-accelerometer and preparation method thereof |
| 01/19/2011 | CN101614604B Silicon resonation type pressure sensor based on synovial membrane differential structure and manufacturing method thereof |
| 01/12/2011 | EP2273548A2 Handle wafer with viewing windows |