| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 03/03/2015 | US8970043 Bonded stacked wafers and methods of electroplating bonded stacked wafers |
| 02/26/2015 | WO2015025424A1 Microchemical chip and reaction device |
| 02/19/2015 | WO2015022172A1 Microfluidic device |
| 02/19/2015 | DE102011080774B4 Verfahren zum herstellen einer halbleiterstruktur und halbleiterstruktur A method of manufacturing a semiconductor structure and semiconductor structure |
| 02/18/2015 | EP2837866A1 Valve, microfluidic device, microstructure, valve seat, method for manufacturing valve seat, and method for manufacturing microfluidic device |
| 02/17/2015 | US8956494 Method of adhering hard silicone resin, method of adhering substrate having fine structure, and preparation method of micro fluidic device utilizing adhesion method |
| 02/11/2015 | CN104340947A Mems器件的装配和封装 Mems device assembly and packaging |
| 02/11/2015 | CN102509844B 一种微机械圆盘谐振器及制作方法 A micro mechanical resonator disc and production methods |
| 02/11/2015 | CN102126700B 工件的贴合装置 Bonding device workpiece |
| 02/10/2015 | US8950259 Element structure, inertia sensor, and electronic device |
| 02/05/2015 | US20150037210 Method for producing a functional unit and corresponding functional unit |
| 02/05/2015 | US20150034620 Wafer bonding method for use in making a mems gyroscope |
| 02/04/2015 | EP2833153A1 Method for manufacturing capacitive acceleration sensor, device for manufacturing same, and capacitive acceleration sensor |
| 01/29/2015 | WO2015012212A1 Microfluidic device and process for producing same, and photosensitive resin composition for forming flow path |
| 01/28/2015 | CN103115704B 高温压力传感器制备方法 Preparation of high temperature pressure sensor |
| 01/27/2015 | US8941193 Method for manufacturing a hybrid integrated component |
| 01/27/2015 | CA2758157C Bonding unit control unit and multi-layer bonding method |
| 01/22/2015 | WO2015008422A1 Sensor |
| 01/22/2015 | US20150022872 Method of manufacturing a mems micro-mirror assembly |
| 01/22/2015 | DE102011056484B4 Verfahren zur Herstellung eines Sensors A method for producing a sensor |
| 01/21/2015 | CN104291267A 氯仿封装pmma微流控芯片 Chloroform pmma microfluidic chip package |
| 01/14/2015 | EP2822688A2 Microfluidic assay assemblies and methods of manufacture |
| 01/14/2015 | CN104280697A 用于磁传感器装置或磁致动器的微技术构件及其制造方法 The magnetic sensor apparatus or a magnetic member and a manufacturing method microtechnology actuator for |
| 01/14/2015 | CN102583233B 一种基于纳米森林模板的超亲水聚二甲基硅氧烷薄膜制备方法 Super-hydrophilic poly-siloxane film preparation method based on nano-forest template |
| 01/08/2015 | DE102013212830A1 Mikrotechnisches Bauteil für eine magnetische Sensorvorrichtung oder einen magnetischen Aktor und Herstellungsverfahren für ein mikrotechnisches Bauteil für eine magnetische Sensorvorrichtung oder einen magnetischen Aktor Microtechnical component for a magnetic sensor apparatus or a magnetic actuator and manufacturing method of a micro-technical component for a magnetic sensor apparatus or a magnetic actuator |
| 01/06/2015 | US8927664 Method for the manufacture of articles of thiol-ene polymers |
| 01/01/2015 | US20150001651 Mems device having a suspended diaphragm and manufacturing process thereof |
| 12/31/2014 | CN104249992A 晶片与晶片之间的对准方法 Alignment between the wafer and wafer |
| 12/31/2014 | CN104249990A 包含流体路径的mems器件及其制造工艺 Mems device and a manufacturing process comprising the fluid path |
| 12/24/2014 | CN104229730A Mems装置的封装方法 Mems device packaging method |
| 12/24/2014 | CN104229723A 晶片级封装形式的部件及其制造方法 Wafer-level package in the form of components and manufacturing method thereof |
| 12/17/2014 | CN103203698B 一种用于硅片与玻璃片的低温超声阳极键合设备 A low-temperature silicon and glass anodic bonding ultrasound equipment |
| 12/09/2014 | US8906729 Method of manufacturing a device with a cavity |
| 12/04/2014 | US20140355095 Multi-purpose optical cap and apparatus and methods useful in conjunction therewith |
| 12/02/2014 | US8901684 Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component |
| 11/25/2014 | US8895362 Methods for bonding material layers to one another and resultant apparatus |
| 11/18/2014 | US8889084 Micro fluid system support and manufacturing method thereof |
| 11/13/2014 | US20140332909 Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same |
| 11/04/2014 | US8877071 Angle control of multi-cavity molded components for MEMS and NEMS group assembly |
| 10/21/2014 | US8866238 Hybrid integrated component and method for the manufacture thereof |
| 10/21/2014 | US8865090 Micro fluid system support and manufacturing method thereof |
| 10/09/2014 | US20140299653 Micromirror array assembly |
| 09/30/2014 | US8847079 Method for producing an integrated device |
| 09/18/2014 | WO2014142841A1 Multilayer fluidic devices and methods for their fabrication |
| 09/18/2014 | WO2014139751A1 Microfluidic device |
| 09/18/2014 | US20140264661 MEMS Devices and Methods for Forming Same |
| 09/18/2014 | DE102013106596A1 Verfahren für die Ausbildung von Biochips sowie Biochips mit nicht-organischen Kontaktauflagen für einen verbesserten Wärmehaushalt Method for the formation of biochips and biochips with non-organic contact pads for improved heat management |
| 09/17/2014 | EP2778743A1 Interference filter, interference filter manufacturing method, optical module, electronic apparatus, and bonded substrate |
| 09/16/2014 | US8835207 Method of manufacturing a semiconductor integrated circuit device having a MEMS element |
| 09/11/2014 | US20140256077 Method for preparation of micro electro-mechanical structure |
| 08/21/2014 | US20140231254 Method of Fabricating a Nanochannel System for DNA Sequencing and Nanoparticle Characterization |
| 08/19/2014 | US8808588 Methods for integrating a functional component into a microfluidic device |
| 08/13/2014 | CN103985651A 一种低温快速连接活化金属表面与微纳米连接材料的方法 A cryogenic quick connect activation of the metal surface and the method of micro and nano-connecting material |
| 08/13/2014 | CN103979481A Mems铝锗键合结构及其制造方法 Mems AlGe bonded structure and manufacturing method |
| 08/13/2014 | CN102928089B 一种非制冷热释电线列焦平面及其制造方法 An uncooled focal plane and its manufacturing method pyroelectric wire column |
| 08/13/2014 | CN102627253B 一种用于mems器件的自对准封装结构及其制造方法 Self-aligning method of manufacturing a package structure and device for mems |
| 08/06/2014 | CN103964376A 双层微机电系统器件及其制造方法 Double MEMS device and manufacturing method |
| 08/06/2014 | CN103964375A 芯片键合方法 Chip bonding method |
| 08/06/2014 | CN103964372A 一种整合式微机电元件及其制造方法 An integrated micro-electromechanical device and manufacturing method |
| 08/06/2014 | CN102659072B 一种芯片和晶圆的键合设备 A chip and wafer bonding equipment |
| 08/06/2014 | CN102414784B 接合装置控制装置及多层接合方法 Device control apparatus and method for multi-layer bonding bonding |
| 08/06/2014 | CN101776501B 一种mems压力敏感芯片及其制作方法 Mems one kind of pressure-sensitive chip and production methods |
| 08/05/2014 | US8794498 Electronic component device and method for producing the same |
| 07/30/2014 | CN103955129A 具有双反射镜的微型原子气体腔器件及其制造方法 Miniature atomic gas chamber device and a manufacturing method having a double mirror |
| 07/30/2014 | CN102356323B 基于三相电容的感测 Based on the three-phase capacitor sensing |
| 07/24/2014 | WO2014019676A3 Ring laser gyroscope |
| 07/24/2014 | DE102013100388B4 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making |
| 07/23/2014 | CN103941577A 具有双反射镜和凹槽形结构的原子气体腔器件及其制造方法 Atomic gases having a chamber device and a method of manufacturing a mirror and a double groove-shaped structure |
| 07/23/2014 | CN103941576A 基于mems技术的原子气体腔器件及其制造方法 Based on device and method for manufacturing atomic gas chamber mems technology |
| 07/23/2014 | CN103935953A 复合腔体及其形成方法 And method of forming the composite cavity |
| 07/22/2014 | US8784973 Resin bonding method by photoirradiation, method for producing resin article, resin article produced by the same method, method for producing microchip, and microchip produced by the same method |
| 07/17/2014 | US20140196540 Two-axis vertical mount package assembly |
| 07/17/2014 | DE102013100388A1 Bauelement mit einer MEMS Komponente und Verfahren zur Herstellung Device having a MEMS component and methods for making |
| 07/16/2014 | CN203715270U 一种传感器装配封装系统 A sensor assembly packaging system |
| 07/16/2014 | CN103928300A 一种基于多场耦合的键合方法 A multi-field coupling based bonding method |
| 07/16/2014 | CN103922272A 纯二氧化硅侧壁的腔体结构、复合腔体及其形成方法 Pure silica cavity structure sidewall, and method of forming the composite cavity |
| 07/10/2014 | DE102011077933B4 Verfahren zum Bonden zweier Substrate A method of bonding two substrates |
| 07/09/2014 | CN103916046A 压电磁电震动发电装置及制造方法 Electric shock electromagnetic pressure generating device and method of manufacture |
| 07/09/2014 | CN103915422A 用于半导体结构的方法和装置 Method and apparatus for a semiconductor structure |
| 07/09/2014 | CN102642808B 基于静电键合的玻璃/硅/玻璃三层结构材料的制备方法 Electrostatic bonding of glass / silicon / glass three preparation methods based on structural materials |
| 07/09/2014 | CN102381677B 复合晶片半导体元件及其形成方法 Compound semiconductor device and method of forming a wafer |
| 07/02/2014 | CN203683083U 一种基于超声换能器环形阵列的声场合成与并行操纵装置 Based on an annular array ultrasound transducer sound field synthesis with parallel operating device |
| 06/25/2014 | CN103890932A 电子部件及其制造方法 An electronic component and its manufacturing method |
| 06/25/2014 | CN103879954A 一种硅基上非晶硅与玻璃的阳极键合方法及其应用 Amorphous silicon and glass anodic bonding method and its application on a silicon |
| 06/19/2014 | WO2014093243A1 Micro pick up array with integrated pivot mount |
| 06/19/2014 | US20140167190 Monolithic Package for Housing Microelectromechanical Systems |
| 06/18/2014 | DE102012112306A1 Verfahren zur Verbindung von Komponenten einer mikrofluidischen Flusszelle A method of joining components of a microfluidic flow cell |
| 06/12/2014 | WO2014087923A1 Bonded member and method for producing bonded member |
| 06/12/2014 | DE102012112058A1 MEMS-Bauelement und Verfahren zur Verkapselung von MEMS-Bauelementen MEMS device and method of encapsulating MEMS devices |
| 06/12/2014 | DE102012110549A1 Silicon substrate, has reactive multilayer comprising two-dimensional nanosheets made of different materials, and insulating layer arranged between upper cap substrate and reactive multilayer and connected with lower substrate |
| 06/12/2014 | DE102012110542A1 Semiconductor substrate e.g. silicon substrate of subsystem, is connected with another semiconductor substrate, so as to encapsulate passive or active device between two substrates in cavity hermetically |
| 06/11/2014 | CN103048487B Wind speed and wind direction sensor with high sensitivity |
| 06/04/2014 | CN103839845A Method for manufacturing high-temperature service low-resistance connector through induced reaction of silicon/metal energy-contained modulation film |
| 06/04/2014 | CN103832970A Low-temperature wafer bonding method |
| 06/04/2014 | CN103832969A Wafer-level bonding method |
| 06/04/2014 | CN101633490B Component and component module provided with micro-cap, and wafer-level packaging methods thereof |
| 05/29/2014 | US20140145244 Mems device and process for rf and low resistance applications |
| 05/28/2014 | EP2735540A1 Compound micromechanical component having coating, method for producing same, and use thereof |
| 05/28/2014 | DE102008007682B4 Modul mit einem Mikro-Elektromechanischen Mikrofon Module with a micro-electro-mechanical microphone |
| 05/28/2014 | DE102007051823B4 Sensor für eine physikalische Grösse und Verfahren zur Fertigung des Sensors A physical quantity sensor and method for manufacturing the sensor |