| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 02/02/2012 | DE102010038445A1 Verfahren zur Herstellung eines mikrofluidischen Systems A process for preparing a microfluidic system |
| 02/02/2012 | DE102010032850A1 Method for material-conclusive joining of micro-scale component and nano-scale component, involves pressing activated joint component surfaces together without adding welding-rod materials and activating surfaces above ambient temperature |
| 02/02/2012 | DE102010032506A1 Modul und Herstellungsverfahren Module and manufacturing method |
| 02/01/2012 | CN101597020B 锗窗、其制造方法以及具有该锗窗的气密性盒体 Germanium window, its manufacturing method, and has the air-tightness of the germanium window box body |
| 01/25/2012 | EP2409163A1 Three phase capacitance-based sensing |
| 01/25/2012 | CN101021541B Bio-chip lattice method and device thereof |
| 01/19/2012 | WO2012007182A1 Microfluidic system and production method for a microfluidic system |
| 01/19/2012 | DE102010031757A1 Mikrofluidisches System und Herstellungsverfahren für ein mikrofluidisches System Microfluidic system and manufacturing process for a microfluidic system |
| 01/18/2012 | EP2407416A1 Method for manufacturing a membrane device retaining a fluid |
| 01/12/2012 | WO2012004432A1 Method for producing microfluid devices |
| 01/12/2012 | WO2012004423A1 Method for producing microfluid devices. |
| 01/12/2012 | WO2012004066A1 Method for producing an integrated microfluidic system and integrated microfluidic system |
| 01/12/2012 | WO2011113630A3 Method for producing a microfluidic device |
| 01/12/2012 | DE102010031103A1 Verfahren zur Herstellung eines integrierten mikrofluidischen Systems und integriertes mikrofluidisches System A method for manufacturing an integrated microfluidic system and integrated microfluidic system |
| 01/12/2012 | DE102010031055A1 Sensor module i.e. acceleration sensor, manufacturing method, for measuring e.g. acceleration, in motor car, involves applying metallic support on temporary support, and switching circuit contacting contacting area by re-wiring layer |
| 01/12/2012 | DE102010030960A1 Method for manufacturing e.g. electronic stability control sensor that is installed in e.g. prefabricated injection molded base housing, involves applying attenuation mass on micro or nano-structured component |
| 01/11/2012 | CN102318369A Semiconductor device |
| 01/11/2012 | CN102313820A Element structure, inertia sensor, and electronic device |
| 01/11/2012 | CN102311092A Method for producing a vibration-damped component |
| 01/11/2012 | CN101792109B Micro inertial sensor with embedded transversely movable electrodes and manufacturing method thereof |
| 01/11/2012 | CN101786593B Processing method of differential type high-precision accelerometer |
| 01/05/2012 | WO2011138057A3 Method for producing mechanical stops for self-alignment and device comprising stops for self-alignment |
| 01/05/2012 | DE102008035990B4 Ein Mikroventil und ein Verfahren zur Herstellung desselben A micro valve and a method of manufacturing the same |
| 01/04/2012 | CN1654310B Microconnectors ,microconnector sockets, microassembly and as well as assemby and manufacture method thereof |
| 01/04/2012 | CN101636345B Method for making microfluidic devices and devices resulting |
| 12/29/2011 | WO2011163618A2 Array structures of containers |
| 12/29/2011 | WO2011161717A1 Electronic device and method for manufacturing electronic device |
| 12/29/2011 | WO2011094643A3 Methods and system using microscopic building blocks for driving 3d self-assembly |
| 12/29/2011 | DE102010030457A1 Method for manufacturing fragile microelectromechanical system structure of packaged microelectromechanical system components for e.g. laptop, involves coating substrate with plastic material to produce chip packaging |
| 12/28/2011 | EP2399864A1 Method for sealing two elements by low-temperature thermocompression |
| 12/28/2011 | CN101094804B 微机电系统封装件及其制造方法 MEMS package and method for manufacturing |
| 12/22/2011 | WO2011158429A1 Converter module and method for manufacturing same |
| 12/22/2011 | DE102005054177B4 Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen A method of manufacturing a plurality of sensor modules packaged |
| 12/21/2011 | CN102290968A 一种微发电机及其制备方法 A micro power generator and its preparation method |
| 12/21/2011 | CN101792108B 一种基于滑膜阻尼的大电容微惯性传感器及其制作方法 Large capacitive micro inertial sensor and its production method based on synovial damping |
| 12/21/2011 | CN101774528B 具有跨尺度仿生微纳米分支结构阵列及其制备方法 Bionic micro and nano-scale cross-branch structure array and its preparation method |
| 12/20/2011 | US8080442 Vertical system integration |
| 12/15/2011 | DE102007060785B4 Verfahren zur Herstellung eines (Vielfach-) Bauelements auf Basis ultraplanarer Metallstrukturen A method for producing a (multicapper) component based on metal structures ultraplanarer |
| 12/14/2011 | CN1854061B 一种微型组件、与微型连接器装配的插座及其装配方法 A miniature components, and miniature connector socket assembly and assembly method |
| 12/14/2011 | CN102281941A 反应装置以及反应装置的制造方法 The reaction apparatus and a method for producing a reaction apparatus |
| 12/14/2011 | CN102275869A 一种单芯片和晶圆的键合设备及键合方法 A single-chip and wafer bonding equipment and bonding method |
| 12/08/2011 | DE102010029709A1 Mikromechanisches Bauelement Micromechanical component |
| 12/07/2011 | CN102270586A 半导体元件的封装方法 The method of encapsulating a semiconductor element |
| 12/07/2011 | CN101585508B 基于光敏触变胶膜的有机玻璃微流控芯片的制备方法 Preparation of photosensitive film based thixotropic plexiglass microfluidic chips |
| 12/01/2011 | US20110290023 Element structure, inertia sensor, and electronic device |
| 12/01/2011 | DE102010029504A1 Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung Component with a plated-through hole and process for its preparation |
| 11/30/2011 | CN102259829A 隔离腔体及其制造方法 Isolation cavity and manufacturing method thereof |
| 11/30/2011 | CN102259825A 一种mems原子蒸气腔室的制备方法及原子蒸气腔室 Method for preparing mems atomic vapor chamber and atomic vapor chamber |
| 11/30/2011 | CN102259824A 一种基于晶圆键合技术的黏度传感器芯片及其制备方法 Based on wafer bonding technology viscosity sensor chip and its preparation method |
| 11/24/2011 | WO2011083161A3 Micro-electromechanical semiconductor component and method for the production thereof |
| 11/24/2011 | DE102010022204A1 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren Electrical component with a flat design and manufacturing processes |
| 11/16/2011 | CN101905859B Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming |
| 11/16/2011 | CN101817498B Method for preparing low-pollution high-yield wafer-level uniform-size glass micro-cavity |
| 11/16/2011 | CN101804961B Method for performing hermetic package by using spherical glass micro-cavity |
| 11/16/2011 | CN101712449B Double-corrosion groove capable of realizing MEMS wafer-level airtight encapsulation of glass slurry and method |
| 11/16/2011 | CN101692099B Piezoresistive double-shaft micro-accelerometer with on-chip zero offset compensation and manufacturing method thereof |
| 11/16/2011 | CN101566502B Thermo-optical infrared detector and preparation method thereof |
| 11/10/2011 | WO2011138057A2 Method for producing mechanical stops for self-alignment and device comprising stops for self-alignment |
| 11/10/2011 | DE102010048003A1 Verfahren zur Herstellung von mechanischen Anschlägen zur Selbstjustage und Vorrichtung mit Anschlägen zur Selbstjustage Process for the manufacture of mechanical stops for self-adjustment device and with stops for self-adjustment |
| 11/09/2011 | EP2384810A1 Reactor and method for producing a reactor |
| 11/09/2011 | CN102237285A Wafer jointing machine |
| 11/09/2011 | CN101746711B H-shaped two-dimensional ultraprecise worktable structure |
| 11/09/2011 | CN101362586B MEMS encapsulation method |
| 11/02/2011 | EP2382152A2 Microstructure, method for producing the same, device for bonding a microstructure and microsystem |
| 11/02/2011 | CN1639054B Micro fluid system support unit and manufacturing method thereof |
| 10/20/2011 | WO2011129165A1 Surface treatment method and device for micro tas substrate, and mask for surface treatment of micro tas substrate |
| 10/19/2011 | EP2376369A2 Arrangement of two substrates having a slid bond and method for producing such an arrangement |
| 10/19/2011 | EP2259996B1 Micro-fixture for a micro-channel plate |
| 10/13/2011 | WO2011125754A1 Method for manufacturing ferroelectric device |
| 10/13/2011 | DE102010032799A1 Mikroventil mit elastisch verformbarer Ventillippe, Herstellungsverfahren und Mikropumpe Microvalve with elastically deformable valve lip, manufacturing processes and micropump |
| 10/12/2011 | CN102211007A Nanotube encapsulating method |
| 10/12/2011 | CN101417783B Micromechanical device and method of manufacturing micromechanical device |
| 10/06/2011 | WO2011122215A1 Method for producing microchip, and microchip |
| 10/05/2011 | CN101096007B Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system |
| 09/29/2011 | WO2011118090A1 Dynamic quantity sensor and manufacturing method therefor |
| 09/28/2011 | CN101817497B Method for preparing all-dry etching dissolved silicon chip for microstructure manufacturing |
| 09/28/2011 | CN101561510B Chip of three-dimensional MEMS geophone and preparation method thereof |
| 09/22/2011 | WO2011115580A1 A process for making an array |
| 09/22/2011 | WO2011113630A2 Method for producing a microfluidic device |
| 09/21/2011 | CN102190287A Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| 09/21/2011 | CN102190283A Microfluidic chip preparation method capable of realizing microsphere discretization |
| 09/21/2011 | CN102190282A MEMS (Micro Electro Mechanical System) packaging structure and manufacturing method thereof |
| 09/21/2011 | CN101559914B Digital micro-droplet drive with deep submicron pore structure and manufacturing method thereof |
| 09/15/2011 | WO2011111541A1 Mems sensor |
| 09/14/2011 | CN102180441A 微机电装置及其制作方法 MEMS device and manufacturing method thereof |
| 09/14/2011 | CN101497422B Low-temperature glass solder bonding and encapsulating method based on disc level glass micro-chamber |
| 09/13/2011 | US8017443 Light transmissive cover, device provided with same and methods for manufacturing them |
| 09/09/2011 | WO2011108333A1 Microfluidic detection chip manufacturing method |
| 09/07/2011 | CN101819214B Integrated anemograph based on ceramics wafer level package and preparation method thereof |
| 09/07/2011 | CN101683967B Wafer capsulation method used for radio-frequency micro electromechanical system |
| 09/07/2011 | CN101279711B Method of fabricating a micromechanical structure out of two-dimensional elements and micromechanical device |
| 09/01/2011 | DE102009006822B4 Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem Microstructure, to processes for their preparation, to apparatus for bonding a micro-structure and micro-system |
| 08/31/2011 | CN102169038A Side wall protection method for MEMS (Micro Electronic Mechanical System) silicon capacitive pressure transducer with sandwich structure |
| 08/31/2011 | CN101592578B Silicon cantilever sensor, preparation method and application thereof |
| 08/31/2011 | CN101439843B Miniature atomic air chamber encapsulation technology |
| 08/25/2011 | WO2011102474A1 Single crystal diamond movable structure and manufacturing method thereof |
| 08/24/2011 | EP2359197A1 Method for making a micromechanical part |
| 08/24/2011 | CN101734613B SOI wafer-based MEMS structure manufacturing and dicing method |
| 08/17/2011 | CN102153045A Packaging structure with micro-electromechanical element and manufacturing method thereof |
| 08/17/2011 | CN101738280B Mems pressure sensor and manufacturing method thereof |