Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 3 - Assembling of devices or systems from individually processed components
Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
12/2003
12/31/2003WO2003088347A3 Method for connecting substrates and composite element
12/31/2003CN1463911A Microcomputer electric component chips level packaging apparatus
12/24/2003WO2003106328A2 Micromechanical component and corresponding production method
12/24/2003WO2003066515A3 Microengineered electrical connectors
12/24/2003WO2003062133A3 Covered microchamber structures
12/18/2003WO2003105198A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
12/18/2003WO2002071371A3 Fabrication integration of micro-components
12/17/2003CN1462257A Connection member, microswitch, method for manufacturing connection member, and method for manufacturing microswitch
12/16/2003US6665109 Compliant mechanism and method of forming same
12/16/2003US6664126 Process for fabrication of 3-dimensional micromechanisms
12/11/2003WO2003102631A2 Bulk silicon mirrors with hinges underneath
12/09/2003US6660614 Method for anodically bonding glass and semiconducting material together
12/04/2003WO2003083912A3 Field-assisted fusion bonding
12/02/2003US6655923 Micromechanic pump
11/2003
11/27/2003US20030219220 System and method for precise positioning of microcomponents
11/26/2003EP1363737A1 Microarrayer
11/20/2003WO2002060583A8 Microarrayer
11/18/2003US6649435 Precision micromirror positioning
11/13/2003US20030211761 Low cost integrated out-of-plane micro-device structures and method of making
11/11/2003US6647184 Optical waveguide device and method of manufacturing the same
11/11/2003US6647172 Imaging technique for use with optical MEMS devices
11/11/2003US6647036 Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
11/11/2003US6644117 Electro-mechanical component and method for producing the same
11/11/2003US6643902 Piezoelectric/electrostrictive device and method of manufacturing same
11/06/2003WO2003090933A2 Method and structures for improved assembly of mems devices employing a centrifuge
10/2003
10/28/2003US6638627 Method for electrostatic force bonding and a system thereof
10/23/2003WO2003088370A2 Hermetic encapsulation of organic electro-optical elements
10/23/2003WO2003088354A2 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003WO2003088347A2 Method for connecting substrates and composite element
10/23/2003WO2003088340A2 Method for the production of structured layers on substrates
10/23/2003WO2003087424A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003WO2003087423A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003WO2003086958A2 Method for producing a product having a structured surface
10/23/2003CA2505014A1 Hermetic encapsulation of organic electro-optical elements
10/23/2003CA2485022A1 Method for connecting substrates and composite element
10/23/2003CA2480854A1 Method for producing a product having a structured surface
10/23/2003CA2480797A1 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003CA2480737A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003CA2480691A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003CA2479823A1 Method for the production of structured layers on substrates
10/16/2003WO2003084861A2 Method of manufacturing an electronic device in a cavity with a cover
10/16/2003WO2003032957A3 Methods for hermetically sealing microchip reservoir devices
10/16/2003WO2002100771A3 Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
10/16/2003US20030192179 Method for assembling micro structures and related apparatus
10/15/2003EP1352414A2 A tunneling sensor or switch and a method of making same
10/09/2003WO2003083912A2 Field-assisted fusion bonding
10/07/2003US6629341 Positioning monolithic wafers on backing sheets, joining using adhesives, then slicing into fibers and covering with conductive films having electrodes patterns; strain activators
09/2003
09/25/2003US20030180190 Wall forming recesses; fluid flow; covering with lid; multilayer laminate
09/25/2003US20030178913 Electrostatically operated device
09/24/2003EP1346947A2 Electrostatically operated optical switching or attenuating devices
09/19/2003CA2422985A1 Electrostatically operated device
09/18/2003WO2003045559A3 Microfluidic devices with distributing inputs
09/18/2003US20030173650 Micro channel in a substrate
09/16/2003US6621638 Process for producing a microoptical functional unit
09/16/2003US6620478 Circular disk containing microchannel/microcavity structures
09/09/2003US6618186 Micro-electromechanical system
09/04/2003WO2002063288A8 Microfluidic devices
09/02/2003US6613284 Appartus for use in the analysis of preferential sample on slides and for use in generating microarrays
08/2003
08/28/2003WO2003070623A1 Micro fluid system support unit and manufacturing method thereof
08/28/2003US20030161027 Light modulator and method of manufacturing the same
08/26/2003US6610582 Field-assisted fusion bonding
08/21/2003WO2003068400A1 Methods of making devices by stacking sheets and processes of conducting unit operations using such devices
08/21/2003US20030156993 Microfluidic devices and methods for two-dimensional separations
08/21/2003CA2476217A1 Methods of making devices by stacking sheets and processes of conducting unit operations using such devices
08/14/2003WO2003066515A2 Microengineered electrical connectors
08/14/2003WO2002011189A3 A tunneling sensor or switch and a method of making same
08/14/2003US20030152488 Stacked together such that the apertures connect and fluid can flow through the device parallel to the direction of sheet thickness; laminated heat exchangers with microchannels; water vaporizers
08/14/2003US20030151104 Single crystal, dual wafer, tunneling sensor or switch with substrate protrusion and a method of making same
08/13/2003EP1179139B1 Micromechanic pump
08/05/2003US6602473 Reaction mixture contained in a tube or insert; slot for receiving the insert holding reaction fluid is made of ceramics, polymers, metals, metallic alloys, composites; resistive heater; microarray
07/2003
07/31/2003WO2003062133A2 Covered microchamber structures
07/31/2003US20030141561 Method for producing a micromechanical component, and a component produced according to said method
07/30/2003EP1311346A4 Methods and devices for enhancing bonded substrate yields and regulating temperature
07/29/2003US6600558 Micro-fluidic cell for optical detection of gases and method for producing same
07/29/2003US6599436 Formation of interconnections to microfluidic devices
07/24/2003WO2003059806A1 Method and zone for sealing between two microstructure substrates
07/22/2003US6595787 Low cost integrated out-of-plane micro-device structures and method of making
07/17/2003US20030134449 Method for adjusting a micro-mechanical device
07/16/2003CN1430703A Micromachined fluidic device and method for making same
07/10/2003WO2003055790A1 A microfluidic device and its manufacture
07/03/2003WO2003054524A1 Microfluidic devices and methods for two-dimensional separations
07/03/2003US20030123125 Detunable Fabry-Perot interferometer and an add/drop multiplexer using the same
06/2003
06/26/2003US20030119219 Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
06/26/2003US20030118277 Digital optical switch apparatus and process for manufacturing same
06/25/2003EP1321430A1 Integrated circuit containing an auxiliary device, e. g. a passive device or a microelectromechanical system, placed on an electronic chip, and method for its manufacture
06/25/2003CN1426352A Method for attaching micromechanical device to manifold, and fluid control system produced thereby
06/05/2003WO2003045559A2 Microfluidic devices with distributing inputs
06/05/2003US20030104651 Low temperature hermetic sealing method having passivation layer
06/05/2003CA2445806A1 Microfluidic devices with distributing inputs
06/03/2003US6574026 Magnetically-packaged optical MEMs device
05/2003
05/30/2003WO2001025138A9 Modular microfluidic devices comprising sandwiched stencils
05/22/2003US20030093895 Connecting member, a micro-switch, a method for manufacturing a connecting member, and a method for manufacturing a micro-switch
05/21/2003EP1311346A1 Methods and devices for enhancing bonded substrate yields and regulating temperature
05/20/2003US6566170 Method for forming a device having a cavity with controlled atmosphere
05/15/2003WO2003040801A1 Digital optical switch apparatus and process for manufacturing same
05/15/2003US20030092243 Method for anodically bonding glass and semiconducting material together
05/14/2003EP1310380A1 A micro-mechanical device and method for producing the same
05/14/2003CN1417105A Micromechanism and its manufacture
05/13/2003US6563184 Single crystal tunneling sensor or switch with silicon beam structure and a method of making same
05/08/2003WO2003038449A1 Micro-sensor
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