Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 3 - Assembling of devices or systems from individually processed components
Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
05/2014
05/28/2014CN203612946U 基于多能场耦合的复合式阳极键合系统 Based pluripotent field coupling compound anodic bonding system
05/28/2014CN103818876A 一种微流控芯片的快速键合方法 A micro-fluidic chip bonding method quickly
05/21/2014CN103803488A 封装纳米结构组件和用于制作封装纳米结构组件的方法 Encapsulated nanostructure components and structural components for the production of nano-encapsulation method
05/21/2014CN102431958B 一种针对玻璃-硅-玻璃三明治结构防水圆片级封装方法 One for glass - silicon - glass sandwich structure waterproof wafer level packaging method
05/15/2014US20140134950 Vertical System Integration
05/15/2014US20140131850 Microchip with blocking apparatus and method of fabricating microchip
05/15/2014US20140131820 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom
05/15/2014DE102010055935B4 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
05/14/2014CN103787269A 具有可重配置模块化特征的自动微装配装置 Characterized by having a reconfigurable modular automated micro-assembly device
05/14/2014CN103787262A Tsv-mems组合 Tsv-mems portfolio
05/14/2014CN103787259A 基于石墨烯用于获取微弱能量的柔性微结构及其制造方法 Based on flexible micro-structure and manufacturing method for obtaining graphene weak energy
05/08/2014US20140126167 Using millisecond pulsed laser welding in mems packaging
05/07/2014CN103768985A 一种新型压电驱动微流体混合器及其制备工艺 A novel piezoelectric drive microfluidic mixer and preparation process
05/01/2014WO2014064606A1 Production of micro-mechanical devices
04/2014
04/30/2014CN103754820A Ultrasonic transducer ring array based sound field synthesis and parallel operation device
04/30/2014CN102792168B Mems传感器 Mems Sensor
04/24/2014DE102012218096A1 Micro-fluidic layer system for measuring of fluid printings for medical applications, has transparent layer arranged adjacent to tensile layer, and optical path influenced by recess of transparent layer by elongation unit of tensile layer
04/23/2014CN101997187B Micro electro mechanical system plug and socket connectors, manufacturing method thereof and connector assembly
04/17/2014US20140106095 Anodic bonding for a mems device
04/17/2014US20140103468 Micro-electromechanical pressure sensor having reduced thermally-induced stress
04/16/2014CN103727884A Bonding tool detection method
04/16/2014CN103723677A Assembling and packaging system and method of sensor
04/10/2014WO2014023301A3 Sensor having simple connection technology
04/09/2014EP2714583A1 Microfluidic device having an electronic component and a spring element
04/09/2014CN103708407A Wafer-level packaging structure and method of integrated MEMS sensor
04/09/2014CN103708406A Resonant type infrared detector structure capable of isolating packaging stress and manufacturing method thereof
04/09/2014CN102275869B Equipment and method for bonding single chip and wafer
04/03/2014WO2014051054A1 Functional device and functional device manufacturing method
03/2014
03/27/2014WO2014044816A1 Method and device for arranging small parts
03/27/2014DE102012216997A1 Electrical switching element i.e. reed contact, for e.g. contactless switch used in pacemaker, has contact pad contacted by deflection region of extension during deflecting deflection region in direction by external magnetic field
03/26/2014CN203498072U Hetero-bonded forming device
03/26/2014CN103676481A Polymer material and application thereof
03/26/2014CN103674399A Stress dispersion MEMS (Micro-Electro-Mechanical Systems) plastic package pressure sensor and preparation method thereof
03/26/2014CN103663362A 传感器封装方法以及传感器封装 Sensor packaging methods and sensor package
03/26/2014CN103663356A Method and structure for encapsulating transparent substrate detector chip
03/26/2014CN103663352A MEMS microphone packaging structure and packaging method
03/26/2014CN103663346A Packaged device designed to be exposed to environmental air and liquids and manufacturing method thereof
03/25/2014US8679887 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
03/20/2014US20140077316 Wafer bonding and related methods and apparatus
03/20/2014DE10348908B4 Verfahren zur Herstellung eines Mikrosystems mit integrierter Schaltung und mikromechanischem Bauteil A process for producing a microsystem with an integrated circuit and the micromechanical component
03/20/2014DE102012216618A1 Anordnung von mindestens zwei Wafern zum Detektieren von elektromagnetischer Strahlung und Verfahren zum Herstellen der Anordnung Arrangement of at least two wafers for detecting electromagnetic radiation and methods of making the arrangement
03/19/2014CN103641060A Semiconductor integrated device assembly and related manufacturing process
03/13/2014DE102004008148B4 Sensor mit Membran und Verfahren zur Herstellung des Sensors Sensor with membrane and method of manufacturing the sensor
03/12/2014CN103626122A Anodic-bonding batch production equipment
03/12/2014CN103626121A Anodic automatic bonding equipment
02/2014
02/27/2014DE102010029504B4 Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung Component with a plated-through hole and process for its preparation
02/20/2014WO2014026823A1 Device and method for producing hermetically-sealed cavities
02/20/2014DE102010036217B4 Verfahren zur hermetischen Verkapselung eines Mikrosystems Process for hermetic encapsulation of a microsystem
02/20/2014DE102004020173B4 Mikrostrukturiertes Bauelement und ein Verfahren zum Herstellen eines mikrostrukturierten Bauelements Microstructured component and a method for producing a microstructured component
02/19/2014CN102145874B Micro-electro-mechanical device and manufacturing method thereof
02/13/2014DE102012109986A1 Siliziumsubstrat und Verfahren zu dessen Herstellung Silicon substrate and process for its preparation
02/12/2014CN103576242A Manufacturing method for light-blocking type micro-electro-mechanical variable light attenuator
02/12/2014CN103569956A Sensor package and method of forming same
02/12/2014CN103569935A Method for manufacturing metal micron/ submicron tube array
02/12/2014CN102290968B Miniature generator and preparation method thereof
02/05/2014CN103552980A Wafer level packaging method for micro electromechanical system (MEMS) chip and single-chip micro-miniature type MEMS chip
02/05/2014CN103552977A Wafer level package structure for micro electromechanical system and package method
01/2014
01/30/2014DE102013200531A1 Micro mirror for projection exposure system such as extreme UV (EUV) projection exposure system, has mirror element which is tiltable formed around axis, and coil spring is provided to bias mirror element in basic position
01/29/2014CN103539062A MEMS devices, packaged MEMS devices, and methods of manufacture thereof
01/28/2014CA2476217C Methods of making devices by stacking sheets and processes of conducting unit operations using such devices
01/23/2014US20140021639 Vertical System Integration
01/22/2014CN103531910A Terahertz circularly-polarized double-layer 90-degree corrugated horn antenna and preparation method thereof under bulk silicon MEMS (micro-electromechanical system) process
01/22/2014CN103531909A Terahertz frequency-scanning H-plane sectoral horn antenna and preparation method thereof under bulk silicon MEMS (micro-electromechanical system) process
01/22/2014CN103523746A Composite anodic bonding system and method based on multi-energy field coupling
01/22/2014CN103523739A Packaging structure of three-dimensional flexible substrate of environment MEMS sensor and manufacturing method
01/16/2014US20140014618 Method for producing a substrate holder
01/15/2014CN103508414A MEMS (micro-electromechanical system) gyroscope chip two-sided anodic bonding technology
01/09/2014WO2013134744A3 Microfluidic assay assemblies and methods of manufacture
01/07/2014CA2389146C Piezoelectric macro-fiber composite actuator and manufacturing method
12/2013
12/25/2013CN103472480A Electrochemical sensitive element, manufacturing method of electrochemical sensitive element and seismic detector applying electrochemical sensitive element
12/25/2013CN103466542A Heterogeneous bonding and forming device
12/19/2013US20130335011 Microelectronic devices for harvesting kinetic energy and/or detecting motion, and associated systems and methods
12/18/2013EP1765724B1 Method for improving alignment precision of parts in mems
12/12/2013DE102012209676A1 Method for manufacturing micro-fluidic device for use in lab-on-a-chip (LOC) system, involves melting and welding the materials of lower and upper layers with each other, after cooling below certain temperature
12/11/2013CN103434999A Integrated manufacturing method for capacitance type temperature, humidity, air pressure and acceleration sensors based on anodic bonding of SOI (silicon on insulator) sheet silicon substrate
12/04/2013CN103420332A Method for manufacturing a hybrid integrated component
12/04/2013CN103420331A Cavity-type semiconductor package and method of packaging same
11/2013
11/27/2013CN203307044U Anodic bonding based mass production equipment
11/27/2013CN203307043U Anodic automatic bonding equipment
11/21/2013DE102010032799B4 Mikroventil mit elastisch verformbarer Ventillippe, Herstellungsverfahren und Mikropumpe Microvalve with elastically deformable valve lip, manufacturing processes and micropump
11/20/2013CN103398707A Three chips assembled silicon-based ultrathin micro-hemispherical resonator gyroscope and making method thereof
11/20/2013CN103395736A MEMS glass size bonding structure and manufacturing method thereof
11/19/2013US8587102 Vertical system integration
11/14/2013DE102012208033A1 Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung Hybrid integrated component and method for its production
11/14/2013DE102012208031A1 +Hybrid integriertes Bauteil und Verfahren zu dessen Herstellung + Hybrid integrated component and method for its production
11/13/2013CN1974372B Monolithic integrated sensor chip for measing three parameters of pressure difference, absolute pressure and temperature and making process thereof
11/07/2013DE102011079389B4 Verfahren und Vorrichtung zum überstandsfreien Verfüllen eines Spalts zwischen einem Träger und einem darauf aufgebrachten Bauteil Method and apparatus for supernatant free filling a gap between a carrier and applied thereto a component
11/06/2013EP1433199B1 Method for forming a cavity structure in an soi substrate and cavity structure formed in an soi substrate
11/06/2013CN102583232B Method for fabricating a sensor
10/2013
10/31/2013US20130285165 Method for manufacturing a hybrid integrated component
10/31/2013DE102012206875A1 Verfahren zum Herstellen eines hybrid integrierten Bauteils A method for manufacturing a hybrid integrated component
10/30/2013EP2656151A2 Assembly of a component which does not have a plastic domain
10/30/2013EP2656150A2 Assembly of a component which does not have a plastic domain
10/24/2013US20130278108 Mems shock cushion spring systems and methods
10/24/2013DE102012206732A1 Verfahren zum Herstellen eines hybrid integrierten Bauteils A method for manufacturing a hybrid integrated component
10/23/2013CN103364592A Physical quantity sensor and manufacturing method thereof, and electronic device
10/23/2013CN103359680A Vacuum-packaged ultrathin MEMS chip and processing method thereof
10/23/2013CN103359679A Electronic device and manufacturing method thereof, electronic apparatus, and moving body
10/23/2013CN103359678A Semiconductor device and method of manufacturing same
10/23/2013CN103359676A Package structure and packaging method
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