Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 3 - Assembling of devices or systems from individually processed components
Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
08/2012
08/15/2012EP2485841A1 Joining method and joint for microfluidic components
08/08/2012CN102627253A Self-aligning packaging structure for micro-electromechanical system (MEMS) device and manufacture method thereof
08/02/2012WO2012102292A1 Method for producing electrostatic capacitance device
08/01/2012CN101509933B Method for manufacturing micro-acceleration and micro-angular rate integration sensor
07/2012
07/25/2012CN102608099A Method for preparing surface-enhanced Raman spectroscopy substrate of silver self-assembly under assistance of amino acids
07/19/2012DE102009020163B4 Verfahren zum zwischenschichtfreien Verbinden von Substraten, Vorrichtung zur Durchführung einer Plasmabehandlung sowie deren Verwendung A method for interlayer-free bonding substrates, apparatus for performing a plasma treatment and the use thereof
07/18/2012CN102583233A Preparation method of superhydrophilic polydimethylsiloxane film on basis of nano forest template
07/18/2012CN102583232A Method for fabricating a sensor
07/18/2012CN102583231A Electrical elastic capillary power-driven method
07/18/2012CN101897018B Semiconductor device and method for manufacturing the same
07/18/2012CN101871817B Hybrid-type pyroelectric uncooled focal plane detector and manufacturing process thereof
07/18/2012CN101691200B Low temperature vacuum encapsulation structure of non-refrigeration infrared detector and manufacturing method thereof
07/18/2012CN101525116B Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof
07/12/2012WO2012037537A3 Sealed packaging for microelectromechanical systems
07/11/2012EP2475053A1 Wiring connection method and functional device
07/11/2012CN102556939A Systems and methods for a three-layer chip-scale MEMS device
07/11/2012CN102556935A Artificial hollow micro-nano motor and preparation method thereof
07/11/2012CN101832965B Laccase biosensor based on magnetic carbon nano tube and chitosan/silicon dioxide gel and preparation method and application thereof
07/10/2012US8216884 Production methods of electronic devices
07/04/2012CN202297105U 微机电系统mems器件的方形扁平无引脚封装qfn结构 Mems MEMS devices quad flat no-lead package qfn structure
07/04/2012CN102530851A Self-removal anti-stiction coating for bonding process
07/04/2012CN101927454B Wafer grinding method
07/04/2012CN101823686B Sealing method of thermoplastic polymer multi-layer micro-fluidic chips
07/04/2012CN101691203B Method and device for alignment and assembly of glass micro nanofluidic chip
07/04/2012CN101233073B 微机电系统封装和互连 MEMS packaging and interconnection
07/04/2012CN101096008B Support unit for micro fluid system, and method of manufacturing support unit for micro fluid system
06/2012
06/28/2012WO2012084384A2 Assembly of a component which does not have a plastic domain
06/28/2012WO2012084383A2 Assembly of a component which does not have a plastic domain
06/28/2012DE102010064120A1 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
06/28/2012DE102010055935A1 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
06/27/2012EP2469356A1 Assembly of a part not comprising a plastic range
06/27/2012EP2469355A2 Assembly of a part not comprising a plastic range
06/27/2012EP2469354A2 Assembly of a part not comprising a plastic range
06/27/2012EP2469353A1 Assembly of a part not comprising a plastic range
06/27/2012EP2469352A1 Assembly of a part not comprising a plastic range
06/27/2012EP2469351A1 Assembly of a part not comprising a plastic range
06/27/2012CN101776483B Non-refrigerant thermopile infrared detector and manufacturing method thereof
06/27/2012CN101723304B Microstructure with flexible circuit board and manufacturing method thereof
06/27/2012CN101234746B Apparatus and method for housing micromechanical systems
06/21/2012DE102011056484A1 Verfahren zur Herstellung eines Sensors A method for producing a sensor
06/21/2012DE102010063471A1 Micro-electro-mechanical element has micro-electro-mechanical sensors that are arranged on same side surface of substrate
06/20/2012CN102509844A Micro-electromechanical disc resonator and manufacturing method thereof
06/20/2012CN102502482A Cavity-equipped SiC-SiC vacuum bonding method
06/20/2012CN102502481A Wafer level low-temperature bonding system and device based on local heating technology
06/20/2012CN102502474A Nonplanar micron/submicron microneedle array and method for producing same
06/14/2012WO2012077383A1 Method for manufacturing microchip
06/14/2012WO2012037536A3 Packaging to reduce stress on microelectromechanical systems
06/13/2012CN102491261A Limit method for MEMS (Micro-electromechanical System) self assembly process based on lead bonding
06/13/2012CN101837944B Method for forming a gyroscope and accelerometer
06/07/2012US20120141329 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio) chemical molecule detection
06/05/2012US8193550 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
05/2012
05/31/2012WO2012070166A1 Converter module and method for producing same
05/30/2012CN102482075A 在烧结过程中具有受控的压缩的层状烧结微流体装置以及相关方法 Sintered layered microfluidic device having a controlled compression during sintering and related methods
05/23/2012CN101897013B An interconnect structure and a method of fabricating the same
05/23/2012CN101857188B MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method
05/16/2012CN102452639A Binding method of plastic microfluidic chip and plastic microfluidic chip
05/10/2012WO2012060186A1 Microchip and method for manufacturing microchip
05/10/2012DE102011116988A1 Entfernbare Anordnung zur Kontrolle des Verbindungsabstands von Substraten Removable arrangement for controlling the connection distance of substrates
05/03/2012WO2012056878A1 Microchip and process for manufacturing microchip
05/02/2012CN102439509A Passive alignment method and its application in micro projection devices
05/02/2012CN102431958A Waterproof wafer-level package method aiming at glass-silicon-glass sandwich structure
05/02/2012CN101683966B Packaging structure for miniature electric field sensor and packaging method
04/2012
04/26/2012DE102009037802B4 Mikrostruktur und Verfahren zum Montieren einer solchen Microstructure and method of mounting such a
04/26/2012DE102009017306B4 Vorrichtung zum selektiven Übertragen einer mikrostrukturierten Komponente Means for selectively transmitting a microstructured component
04/25/2012EP2444149A1 Manufacturing method for small-sized reactors and small-sized reactors
04/25/2012CN101798054B 微机电器件的晶圆级真空封装方法 Wafer-level vacuum packaging method MEMS devices
04/19/2012WO2011163618A3 Array structures of containers
04/18/2012EP2441518A2 Method and device for thermocompression bonding
04/18/2012CN102417157A 用于mems的液晶微流体驱动与控制方法 LCD microfluidic drive and control method for mems
04/18/2012CN101955152B 具有倒y形通孔的圆片级气密性封装方法 An inverted y-shaped through-hole tightness wafer level packaging method
04/18/2012CN101214918B 用于微机电封盖制程的封装结构 MEMS package structure for the process of closure
04/12/2012DE19616970B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices
04/12/2012DE102010042113A1 Semiconductor component for use in micro-electromechanical system in microsystems technology, has dielectric closure layer attached on structured dielectric layer, where surface of layer comprises depth profile in direction of chip interior
04/11/2012CN102414784A Controller for bonding apparatus and multilayer bonding method
04/11/2012CN101898746B 要求不同气氛压力的mems器件圆片级集成封装方法 Require different atmosphere pressure mems device wafer level packaging method to integrate
04/10/2012US8153079 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection
04/05/2012WO2011067297A9 Microfabricated surface neurostimulation device and methods of making and using the same
03/2012
03/22/2012WO2012037537A2 Sealed packaging for microelectromechanical systems
03/22/2012WO2012037536A2 Packaging to reduce stress on microelectromechanical systems
03/21/2012CN102381677A Composite wafer semiconductor
03/21/2012CN101624170B Method for preparing piezoelectric polymer functional film with ordered micro-cellular structure by using template
03/14/2012EP2427795A1 Passive alignment method and its application in micro projection devices
03/14/2012CN102374972A Humidity sensor for single quantum-dot doped polymer nanowire and preparation method thereof
03/14/2012CN102372248A Sensor module and method for manufacturing the same
03/14/2012CN101817495B Micro fluid control chip and preparation method and application thereof
03/07/2012CN102369101A Film for resin spacer, light-receiving device and method for manufacturing same, and MEMS device and method for manufacturing same
03/07/2012CN102367166A Method for preparing organic single crystal particle two-dimensional ordered structure and its patterned arrangement
03/01/2012DE102010036217A1 Method for manufacturing hermetic housing for microsystem e.g. microelectromechanical system (MEMS), involves placing base with lid in protective atmosphere, and forming adhesive joint between base and lid
02/2012
02/29/2012EP2423160A1 Assembly of objects by means of a sealing bead comprising intermetallic compounds
02/21/2012US8120160 Integrated circuit device including a bifunctional core material in a chamber
02/16/2012DE102010039156A1 Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung A method of manufacturing an electrical circuit and electrical circuit
02/16/2012DE102009021244B4 MEMS-Bauelement, Halbleiterchip und Verfahren zu dessen Herstellung MEMS device, semiconductor chip and process for its preparation
02/15/2012CN102356323A Three phase capacitance-based sensing
02/15/2012CN102351141A Wafer level vacuum encapsulating method for MEMS (Micro Electro Mechanical System) components
02/15/2012CN101665238B 一种微纳放电加工微三维结构的方法和系统 A micro-nano-discharge method and system for processing micro three-dimensional structure
02/09/2012US20120031349 Methods of Making Devices By Stacking Sheets and Processes of Conducting Unit Operations Using Such Devices
02/09/2012DE102010033284A1 Method for producing arrangement of electronic component e.g. microelectro mechanical system (MEMS) chip, involves partially removing support elements, such that supporting elements are in non-contact state with respect to component
02/08/2012EP2415592A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
02/08/2012CN102344115A Micronscale/nanoscale connection method based on dip-pen principle
02/08/2012CN102344110A Quad flat non-leaded package structure and method of micro electro mechanical system device
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