Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
05/2003
05/08/2003US20030085438 Micro-mechanical device and method for producing the same
05/08/2003US20030085109 MEMS switch having hexsil beam and method of integrating MEMS switch with a chip
05/06/2003US6557607 Apparatus for manufacturing micro-structure
05/02/2003EP1305570A2 Three-axes sensor and a method of making same
04/2003
04/24/2003WO2003032957A2 Methods for hermetically sealing microchip reservoir devices
04/24/2003US20030078690 Microarrayer
04/24/2003US20030075790 Structure for aligning chips in stacked arrangement
04/24/2003CA2451953A1 Methods for hermetically sealing microchip reservoir devices
04/10/2003WO2002093122A3 Sensor arrangement, in particular micro-mechanical sensor arrangement
04/10/2003WO2002061800A3 A method and system for electrostatic bonding
04/08/2003US6545796 Article comprising a freestanding micro-tube and method therefor
03/2003
03/27/2003WO2003025986A1 Bonding method
03/27/2003WO2002010684A9 Three-axes sensor and a method of making same
03/27/2003US20030056351 Piezoelectric macro-fiber composite actuator and method for making same
03/25/2003US6538362 Piezoelectric/electrostrictive device and method of manufacturing same
03/20/2003US20030053233 Optical switching apparatus and method for assembling same
03/20/2003US20030051339 Method for assembling cassette-loaded microcomponents
03/19/2003EP1255642A4 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
03/18/2003US6534340 Cover cap for semiconductor wafer devices
03/12/2003EP1289877A1 Micro channel in a substrate
03/12/2003CN1402033A Functional device, mfg. method thereof and drive circuit
03/05/2003EP1288697A2 Display device and method for producing the same
03/04/2003US6527903 Substrate bonding method, bonded product, ink jet head, and image forming apparatus
02/2003
02/27/2003WO2003016206A2 System and method for precise positioning of microcomponents
02/27/2003US20030040180 Heating nanomaterial comprising porous silicon; melting; bonding strength; low temperature welding
02/25/2003US6524532 Microfabricated sleeve devices for chemical reactions
02/20/2003US20030034542 Functional device, method of manufacturing therefor and driver circuit
02/20/2003US20030033712 Method for assembling micro devices and related apparatus
02/19/2003EP1283957A1 Micromachined fluidic device and method for making same
02/18/2003US6522452 Latchable microelectromechanical structures using non-newtonian fluids, and methods of operating same
02/18/2003US6521181 Microfabricated electrochemiluminescence cell for chemical reaction detection
02/06/2003WO2003010580A1 Tooling fixture for packaged optical micro-mechanical devices
02/06/2003US20030026740 Microfluidic devices
02/06/2003US20030024632 Process for forming metal micro-patterns on plastic substrate
02/05/2003CN1395128A Optical modulator and manufacturing method thereof
02/04/2003US6513250 Micro positioning device with shared actuators
01/2003
01/30/2003US20030021570 Tooling fixture for packaged optical micro-mechanical devices
01/29/2003CN1393710A Imaging technique using optical MEMS device
01/23/2003US20030016436 Fabry-Perot cavity manufactured with bulk micro-machining process applied on supporting substrate
01/16/2003US20030011866 Compliant mechanism and method of forming same
01/16/2003US20030010808 Methods for hermetically sealing microchip reservoir devices
01/08/2003EP1272422A2 Vacuum package fabrication of microelectromechanical system devices with integrated circuit components
01/07/2003US6504253 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure
01/07/2003US6503847 Spin coating, alignment, applying light pressure to assure surface contact and air bubble removal and curing; low pressure/voltage; biocompatible/radiation transparent; microsensors microelectronics; biomedical equipment
01/02/2003US20030002782 Imaging technique for use with optical MEMS devices
01/02/2003US20030001221 Micromechanical component as well as a method for producing a micromechanical component
01/02/2003EP1271200A1 Imaging technique and optical switch using optical MEMS devices
01/02/2003EP1268121A1 Method for assembling cassette-loaded microcomponents
12/2002
12/26/2002US20020196817 Tunable laser
12/26/2002US20020196522 Compliant mechanism and method of forming same
12/26/2002US20020196521 Methods of making mechanisms in which relative locations of elements are maintained during manufacturing
12/26/2002US20020196440 Structure for aligning chips in stacked arrangement
12/26/2002US20020195673 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
12/25/2002CN1387251A Processing method binded by selenide chip for atomic resolution store shuffling device
12/25/2002CN1387250A Processing method binded by selenide chip for atomic resolution store shuffling device
12/24/2002US6498053 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
12/19/2002WO2002100771A2 Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
12/12/2002US20020185183 Microfluidic devices with distributing inputs
12/05/2002WO2002097767A2 Fabrication integration of micro-components
12/05/2002WO2002096640A1 Recessed patterns in a multilayered ceramic package
12/05/2002US20020179439 Microelectronic system and method of use and fabrication
12/03/2002US6488872 Microfabricated devices and method of manufacturing the same
11/2002
11/28/2002US20020174936 Cast-on-resist (COR) methods; Multilayered Microfluidic Device (MMD) for example
11/28/2002DE10124497A1 Micro-reactor, used for carrying out chemical reactions under periodically changing temperatures, comprises parallel layers stacked over each other
11/27/2002EP1261023A2 Atomic resolution storage system
11/27/2002EP1260481A2 Atomic resolution storage system
11/26/2002US6486542 Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same
11/26/2002US6485690 Multiple fluid sample processor and system
11/21/2002WO2002093122A2 Sensor arrangement, in particular micro-mechanical sensor arrangement
11/21/2002DE10123039A1 Sensor arrangement used as a micromechanical sensor comprises a sensor section to deliver sensor signals, and a covering section arranged on the sensor section to form a hermetically sealed sensor inner chamber
11/20/2002EP1257496A2 Method for producing a micromechanical component, and a component produced according to said method
11/13/2002EP1255642A1 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
11/07/2002WO2002088017A1 Connection member, microswitch, method for manufacturing connection member, and method for manufacturing microwitch
10/2002
10/31/2002WO2002086587A1 Compliant mechanism and method of forming same
10/31/2002WO2002086582A1 Mems-based tunable fabry-perot filters and method of forming same
10/31/2002US20020160582 Hydrolysis and condensation of alkoxysilane; evaporating solvent; coating integrated circuits and semiconductors
10/31/2002US20020158547 Latchable microelectromechanical structures using non-newtonian fluids, and methods of operating same
10/29/2002US6473221 Galvano-mirror and method of making the same
10/01/2002US6458616 Method for manufacturing a semiconductor material integrated microactuator, in particular for a hard disc mobile read/write head, and a microactuator obtained thereby
09/2002
09/26/2002US20020135062 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
09/25/2002EP1242334A1 Bonded products and methods of fabrication therefor
09/24/2002US6454925 Device for electrophoresis and component therefor
09/17/2002US6452260 Electrical interface to integrated circuit device having high density I/O count
09/12/2002WO2002071371A2 Fabrication integration of micro-components
09/12/2002US20020125582 Process for manufacturing integrated devices having connections on a separate wafer, and integrated device thus obtained
09/06/2002WO2002068320A2 Devices having substrates with openings passing through the substrates and conductors in the openings, and methods of manufacture
08/2002
08/29/2002WO2001018857A9 Process for fabrication of 3-dimensional micromechanisms
08/27/2002US6440820 Process flow for ARS mover using selenidation wafer bonding after processing a media side of a rotor wafer
08/22/2002US20020115234 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002US20020113321 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002DE10104868A1 Mikromechanisches Bauelement sowie ein Verfahren zur Herstellung eines mikromechanischen Bauelements Micromechanical component as well as a process for producing a micromechanical component
08/20/2002US6436794 Process flow for ARS mover using selenidation wafer bonding before processing a media side of a rotor wafer
08/15/2002WO2002063288A1 Microfluidic devices
08/15/2002US20020110757 Low cost integrated out-of-plane micro-device structures and method of making
08/15/2002US20020109903 Micro-electromechanical system
08/14/2002EP1231616A1 Out-of-plane micro-device structures
08/14/2002EP1230689A1 Piezoelectric macro-fiber composite actuator and manufacturing method
08/13/2002US6433411 Packaging micromechanical devices
08/08/2002WO2002061800A2 A method and system for electrostatic bonding
08/08/2002WO2002060583A1 Microarrayer
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