| Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
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| 10/17/2013 | WO2013153912A1 Valve, microfluidic device, microstructure, valve seat, method for manufacturing valve seat, and method for manufacturing microfluidic device |
| 10/17/2013 | US20130271807 Micromechanical component and method for producing a micromechanical component |
| 10/17/2013 | US20130271806 Micromechanical component and method for producing a micromechanical component |
| 10/17/2013 | DE102004006197B4 Verfahren zur Herstellung eines mikromechanischen Drucksensors Process for producing a micromechanical pressure sensor |
| 10/16/2013 | CN102190287B Method for raising hot pressing bonding rate of PMMA micro fluidic chip formed by injection moulding |
| 10/09/2013 | CN103342339A Method for forming micro-channels |
| 10/03/2013 | WO2013146368A1 Method for manufacturing capacitive acceleration sensor, device for manufacturing same, and capacitive acceleration sensor |
| 10/02/2013 | CN103335753A An ultramicro pressure sensor chip with a silicon-glass base-beam film structure and a manufacturing method |
| 10/02/2013 | CN103335751A A double-harmonic-oscillator silicon micro pressure transducer and a manufacturing method thereof |
| 09/26/2013 | DE102010042438B4 Sensoranordnung Sensor array |
| 09/25/2013 | CN103323042A Capacitance-type ultrasonic sensor of integrated full-vibration conductive film structure and manufacturing method thereof |
| 09/24/2013 | US8541313 Method for etching a sacrificial layer for a micro-machined structure |
| 09/18/2013 | CN103303862A Production method of high-sensitivity biochemical sensor based on resonance type micro-cantilever structure |
| 09/12/2013 | WO2013134744A2 Microfluidic assay assemblies and methods of manufacture |
| 09/12/2013 | WO2013133792A1 Flexible circuits |
| 09/12/2013 | WO2013131759A1 A method of manufacturing a mems micro-mirror assembly |
| 09/12/2013 | DE102012203699A1 Semiconductor component e.g. micro-electromechanical component, for use as e.g. mechanical structure, has connection structure whose element is received between connectors such that linkage is formed between component and substrate |
| 09/12/2013 | DE102012102021A1 Mikromechanisches Messelement und Verfahren zur Herstellung eines mikromechanischen Messelements Micromechanical sensing element and method for manufacturing a micro-mechanical sensing element |
| 09/11/2013 | CN103299245A Assembly of a component which does not have a plastic domain |
| 09/11/2013 | CN103288045A Inner wall clamping device of thin-wall cylindrical micro parts and method |
| 09/11/2013 | CN103288044A Method for mounting a three-axis MEMS device onto substrate with precise orientation |
| 09/11/2013 | CN103288038A Moisture-resistant package |
| 09/11/2013 | CN103288037A Micromechanical sensor arrangement, corresponding manufacturing method and application |
| 09/10/2013 | US8529724 Anodic bonding of silicon carbide to glass |
| 09/06/2013 | WO2013130582A1 Method for embedding controlled-cavity mems package in integration board |
| 09/06/2013 | WO2013130572A1 Methods for bonding material layers to one another and resulting device |
| 09/05/2013 | DE102012203373A1 Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren Micro-mechanical transducer array and a corresponding production method |
| 09/04/2013 | CN203173808U Automatic bonding equipment for bonding anode of long glass column |
| 09/04/2013 | CN103274351A Electrochemistry geophone electrode sensitive core based on MEMS and manufacturing method thereof |
| 08/29/2013 | DE102012203135A1 Micromechanical sensor arrangement for use in navigation component for navigation in mobile terminal, has functional microelectromechanical system-regions integrated on front side of silicon substrate and rear side of silicon substrate |
| 08/29/2013 | DE102011079410B4 Verfahren zur Fixierung zumindest eines Bauteils auf einem Träger A method of fixing at least one component on a carrier |
| 08/28/2013 | CN103270457A Assembly of part not comprising plastic range |
| 08/28/2013 | CN101776476B Systems, gyroscope sensors, and fabrication methods for forming structures for the gyroscope sensors. |
| 08/21/2013 | CN103258778A Method for preparing substrate with hollow cavity |
| 08/21/2013 | CN103253628A Method for manufacturing and assembling tiny metal parts based on deep etching technique |
| 08/21/2013 | CN101665230B Micro-electro-mechanical systems (mems) package and method for forming the mems package |
| 08/14/2013 | DE10344373B4 Sensor mit Membran Sensor with membrane |
| 08/14/2013 | CN103249480A Method for manufacturing microchip |
| 08/14/2013 | CN103241708A Preparation method of substrate with cavity |
| 08/14/2013 | CN103241703A Electronic device, method for manufacturing thereof, and electronic apparatus |
| 08/14/2013 | CN103241702A Electronic device, method for manufacturing thereof, and electronic apparatus |
| 08/08/2013 | DE102012201486A1 Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung Damping device for a micromechanical sensor device |
| 08/07/2013 | CN103232024A Automated bonding device used in long glass column anodic bonding |
| 08/01/2013 | US20130193536 Method of manufacturing a semiconductor integrated circuit device having a mems element |
| 07/31/2013 | CN103224219A Integration method of nanometer getter used for micro-device wafer level packaging |
| 07/25/2013 | DE102005025667B4 Verfahren zur Herstellung einer Sensoranordnung mit einem umgossenen Signalausgabeabschnitt A process for producing a sensor arrangement with a signal output section overmolded |
| 07/24/2013 | EP2616388A2 Sealed packaging for microelectromechanical systems |
| 07/24/2013 | EP2616387A2 Packaging to reduce stress on microelectromechanical systems |
| 07/24/2013 | CN103221332A Packaging to reduce stress on microelectromechanical systems |
| 07/24/2013 | CN103221331A Sealed packaging for microelectromechanical systems |
| 07/18/2013 | WO2013105574A1 Microchannel device and method for manufacturing same |
| 07/18/2013 | DE102012200648A1 Sensor device for use in e.g. air-bag release system, has set of sections provided with terminals for contacting sensor device, where sections are arranged in region of surface of containment body, and sections extend in different planes |
| 07/17/2013 | CN103204462A Low-temperature ultrasonic anodic bonding device for silicon wafers and glass pieces |
| 07/17/2013 | CN103203698A Glass sheet clamp for low-temperature ultrasound anodic bonding device |
| 07/16/2013 | US8486278 Drug-delivery pumps and methods of manufacture |
| 07/10/2013 | CN103196962A Oxidized graphene film vertical type micro-nano structured gas sensor and preparation method thereof |
| 07/10/2013 | CN103193199A Silicon chip clamping device applied to low-temperature ultrasonic anodic bonding device |
| 07/10/2013 | CN103193198A Method for reducing packaging stress of micro-electromechanical system (MEMS) chip through back graphics |
| 07/10/2013 | CN103193193A MEMS device and method of forming same |
| 07/03/2013 | CN103183310A Low temperature bonding method of microfluidic chip |
| 07/03/2013 | CN101585507B Method for producing through-hole structure in PDMS micro-fluidic chip |
| 06/27/2013 | DE102011089569A1 Verfahren zum Verbinden zweier Siliziumsubstrate und entsprechende Anordnung zweier Siliziumsubstrate A method of joining two silicon substrates and corresponding arrangement of two silicon substrates |
| 06/26/2013 | CN103172018A Organic solvent auxiliary bonding method based on organic polymer material micro-fluidic chip |
| 06/25/2013 | US8471573 Dynamic quantity sensor and manufacturing method thereof |
| 06/18/2013 | US8465698 Microfluidic apparatus with integrated porous-substrate/sensor for real-time (BIO) chemical molecule detection |
| 06/13/2013 | DE102011088198A1 Mounting a sensor element on a measuring support, comprises applying the sensor element on a supporting plate and fixing the supporting plate with the applied sensor element on the measuring support by adopting cold welded connection |
| 06/12/2013 | CN202988707U Automatic cilium splicing device of MEMS (Micro-electromechanical Systems) vector hydrophone |
| 06/12/2013 | CN103145096A Low-temperature ultrasound anodic bonding method of silicon wafer and glass sheet |
| 06/12/2013 | CN101644605B Thermopile sensor and method of manufacturing same |
| 06/05/2013 | CN103130180A Bonding method of wafer pole and positive pole |
| 06/05/2013 | CN101282594B Encapsulation structure for Micro-electromechanical microphone with two-sided mounting-pasted electrode |
| 05/30/2013 | WO2013076830A1 Electronic component and method for producing same |
| 05/30/2013 | US20130134604 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems |
| 05/29/2013 | DE102011119610A1 Verfahren zur Herstellung strukturierter optischer Komponenten A process for the production of structured optical components |
| 05/23/2013 | DE102011086764A1 MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages MEMS chip package and method for manufacturing a MEMS chip packages |
| 05/22/2013 | EP2593231A1 Microfluidic system and production method for a microfluidic system |
| 05/22/2013 | CN103115704A High-temperature pressure sensor and production method thereof |
| 05/15/2013 | EP2592044A1 Method for producing microfluid devices |
| 05/15/2013 | EP2590891A1 Method for producing an integrated microfluidic system and integrated microfluidic system |
| 05/15/2013 | CN103107069A Silicon slice eutectic bonding method |
| 05/10/2013 | WO2013029177A8 Monolithic package for housing microelectromechanical systems |
| 05/08/2013 | DE102011085727A1 Mikromechanisches Element, Bauelement mit einem mikromechanischen Element und Verfahren zum Herstellen eines Bauelements Micromechanical element, component with a micro-mechanical element and method for manufacturing a device |
| 05/08/2013 | CN103094099A Method of wafer annealing after bonding |
| 05/08/2013 | CN101454113B Device by cold junction, process for manufacturing device, and cold junction apparatus |
| 05/01/2013 | CN103075954A Micro-nano manufacturing method for curved surface structure electric field type time grating angular displacement sensor |
| 04/24/2013 | CN103063876A Variable area type capacitive horizontal accelerated speed sensor and manufacture method |
| 04/24/2013 | CN103058131A Manufacture method of reversible bonding micro-fluidic chip with high strength |
| 04/18/2013 | DE102011084393A1 Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren Micromechanical device function, particularly the speaker apparatus, and corresponding method of production |
| 04/17/2013 | CN202885979U Uncooled pyroelectric linear array focal plane |
| 04/17/2013 | CN103052011A Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture |
| 04/17/2013 | CN103048487A Wind speed and wind direction sensor with high sensitivity |
| 04/17/2013 | CN103043605A Technique for improving wafer level metal bonding strength by micro electroplating three-dimensional structure |
| 04/17/2013 | CN103043604A Charge release method between silicon-glass bonding interface metal wire and suspension movable structure |
| 04/17/2013 | CN103043603A Attaching a mems to a bonding wafer |
| 04/10/2013 | CN103030102A Automatic bonding device and method for cilia of MEMS vector hydrophone |
| 04/10/2013 | CN103030101A Method for producing a two-chip assembly and corresponding two-chip assembly |
| 04/10/2013 | CN103030093A 3D integrated electronic device structure including increased thermal dissipation capabilities |
| 04/10/2013 | CN102020236B Micro-electromechanical system chip and package method thereof |
| 04/10/2013 | CN101717068B Method for preparing polymeric micro-fluidic chip based on hydrogel male mold |
| 04/04/2013 | WO2013049695A1 Surface mount mems actuator |