Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210) |
---|
10/20/2005 | US20050230042 Bonding structure and method for bonding members |
10/20/2005 | US20050229737 Manufacturing system for microstructure |
10/19/2005 | CN1683234A Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same |
10/13/2005 | US20050227508 Microengineered electrical connectors |
10/13/2005 | US20050227408 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
10/13/2005 | US20050227401 Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same |
10/13/2005 | DE10359807B4 Microstructure used as a micro-reactor comprises microstructured elements/plates having assembly contours aligned on a receiving element |
10/12/2005 | EP1584447A2 Manufacturing system for microstructure by a lamination process |
10/12/2005 | CN1680188A Manufacturing system for microstructure |
10/12/2005 | CN1680187A Method of manufacturing microstructure and manufacturing system for the same |
10/11/2005 | US6953990 Wafer-level packaging of optoelectronic devices |
10/06/2005 | WO2005081288A3 Mechanical sensor with pyramid socket suspension |
10/05/2005 | EP1582499A2 Encapsulation wafer process |
10/05/2005 | EP1576650A3 Method for microfabricating structures using silicon-on-insulator material |
10/05/2005 | CN1678398A Microfluidic apparatus with integrated porous-substrates/sensor for real-time biochemical molecule detection |
10/04/2005 | US6951824 Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method |
10/04/2005 | US6951768 Single crystal, dual wafer, tunneling sensor or switch with substrate protrusion and a method of making same |
09/29/2005 | US20050214969 Method for forming a chamber in an electronic device and device formed thereby |
09/29/2005 | DE102004011203A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system |
09/28/2005 | EP1580161A1 Method for forming a chamber in an electronic device and device formed thereby |
09/28/2005 | EP1578686A2 An integrated structure and method for fabricating the same |
09/28/2005 | CN1675125A MEMS array, manufacturing method thereof, and MEMS device manufacturing method based on the same |
09/28/2005 | CN1672929A Method for forming a chamber in an electronic device and device formed thereby |
09/21/2005 | EP1576650A2 Method for microfabricating structures using silicon-on-insulator material |
09/21/2005 | CN1672081A Bulk silicon mirrors with hinges underneath |
09/21/2005 | CN1671536A Method and device for forming a body having a three-dimensional structure |
09/20/2005 | US6946314 Method for microfabricating structures using silicon-on-insulator material |
09/20/2005 | US6944941 Method for assembling cassette-loaded microcomponents |
09/20/2005 | US6944931 Vibrating resonator with interior electrode on rigidity support; housing with wall bonded to substrate |
09/14/2005 | CN2725900Y Direct heating terminal type microwave power sensor of microelectronic mechanical system |
09/13/2005 | US6942750 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication |
09/09/2005 | WO2005017972A3 Method for microfabricating structures using silicon-on-insulator material |
09/08/2005 | US20050194685 Method for mounting semiconductor chips and corresponding semiconductor chip system |
09/06/2005 | US6940636 Optical switching apparatus and method of assembling same |
09/06/2005 | US6938334 Vibrating beam accelerometer two-wafer fabrication process |
09/01/2005 | WO2005081288A2 Mechanical sensor with pyramid socket suspension |
08/30/2005 | CA2384072C Imaging technique for use with optical mems devices |
08/25/2005 | WO2005079128A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism |
08/25/2005 | US20050186703 Method for packaging semiconductor chips and corresponding semiconductor chip system |
08/25/2005 | DE102004006199A1 Production of a micromechanical pressure sensor comprises aligning the caverns formed in a first component with openings of a second component, joining the components and applying a material layer to part of the opening |
08/24/2005 | CN1659720A Hermetic encapsulation of organic electro-optical elements |
08/24/2005 | CN1659684A Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
08/23/2005 | US6933163 Fabricating integrated micro-electromechanical systems using an intermediate electrode layer |
08/18/2005 | WO2004017371A3 Method for microfabricating structures using silicon-on-insulator material |
08/18/2005 | US20050181658 Microconnectors and non-powered microassembly therewith |
08/18/2005 | US20050181636 Sockets for microassembly |
08/18/2005 | US20050178204 Pyramid socket suspension |
08/17/2005 | EP1564183A2 Microconnectors and non-powered microassembly therewith |
08/17/2005 | CN1654311A Method for constructing non-close packing colloid balls ordered arrangement using soft-graving technology |
08/17/2005 | CN1654310A Microconnectors and non-powered microassembly therewith |
08/17/2005 | CN1214971C Two-dimensional excitation set and manufacturing method thereof |
08/16/2005 | US6929781 Interconnection support for plate-like microcomponents |
08/11/2005 | US20050175846 Electron beam evaporation deposition of glass; hermetic sealing; simple; accurately structured on substrates having varied dimensions |
08/11/2005 | DE102004003413A1 Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung A method of packaging a semiconductor chip and corresponding semiconductor chip assembly |
08/04/2005 | WO2005071707A1 Micro relay |
08/04/2005 | WO2005069797A2 Microfluidic structures and methods for integrating a functional component into a microfluidic device |
08/04/2005 | US20050167795 Electronic devices and its production methods |
08/03/2005 | EP1558954A1 Method of producing a movable lens structure for a light shaping unit |
08/02/2005 | US6925390 Customized microfluidic device design, ordering, and manufacturing |
08/02/2005 | US6923669 Microconnectors and non-powered microassembly therewith |
07/28/2005 | US20050160816 Vibrating beam accelerometer |
07/27/2005 | CN1647276A Method for coating metal surfaces and substrate having a coated metal surface as protection for copying process and elements concerned |
07/27/2005 | CN1647261A Method for connecting substrates and composite element |
07/27/2005 | CN1647258A Method for the production of structured layers on substrates |
07/27/2005 | CN1646722A Method for coating metal surfaces and substrate having a coated metal surface |
07/27/2005 | CN1646721A Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
07/27/2005 | CN1646418A Method for producing a product having a structured surface |
07/27/2005 | CN1646417A Method of manufacturing an electronic device |
07/27/2005 | CN1644484A Clamp for disk vacuum pack |
07/21/2005 | US20050156320 Integrated device including connections on a separate wafer |
07/21/2005 | US20050156259 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same |
07/20/2005 | EP1554218A2 Micromechanical component and corresponding production method |
07/14/2005 | US20050152639 Optical switch and fabrication method thereof |
07/14/2005 | US20050151442 Micromechanical electrostatic resonator |
07/14/2005 | US20050151371 Microfluidic structures and methods for integrating a functional component into a microfluidic device |
07/14/2005 | DE10359807A1 Mikrostruktur sowie Verfahren und Einrichtung zu deren Herstellung Microstructure and method and apparatus for the production thereof |
07/13/2005 | CN1639054A Micro fluid system support unit and manufacturing method thereof |
07/13/2005 | CN1637457A Optical switch and fabrication method thereof |
07/13/2005 | CN1636704A Coupling structure for component and coupling method |
06/30/2005 | WO2005058748A1 Method and system for self-aligning parts in mems |
06/30/2005 | US20050142692 Wafer-level packaging of optoelectronic devices |
06/23/2005 | US20050133362 Transferable micro spring structure |
06/22/2005 | EP1542802A1 Microfluidic apparatus with integrated porous-substrates/sensor for real-time(bio)chemical molecule detection |
06/22/2005 | EP1204479A4 Multiple fluid sample processor and system |
06/14/2005 | US6905945 Microwave bonding of MEMS component |
06/09/2005 | US20050121413 Method of manufacturing an electronic device |
06/08/2005 | EP1538747A1 Micromechanical electrostatic resonator |
06/08/2005 | EP1135792A4 Method for manufacturing carbon nanotubes as functional elements of mems devices |
06/08/2005 | CN1625046A Micromechanical electrostatic resonator |
06/07/2005 | US6903637 Connecting member, a micro-switch, a method for manufacturing a connecting member, and a method for manufacturing a micro-switch |
06/02/2005 | US20050118742 Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device |
06/02/2005 | US20050116247 Bonded products and methods of fabrication therefor |
06/01/2005 | EP1535879A1 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same |
05/25/2005 | DE10348336A1 Mechatronic system, e.g. for machine and system construction, has at least one modifier layer of material with coefficient of thermal expansion between those of metal and ceramic arranged between ceramic substrate and metallic surface |
05/25/2005 | DE10345817A1 Verfahren und Vorrichtung zum Koppeln von Hohlfasern an ein mikrofluidisches Netzwerk Method and apparatus for coupling of hollow fibers to a microfluidic network |
05/19/2005 | US20050106752 Process and device for coupling hollow fibers to a microfluidic network |
05/19/2005 | DE102004042538A1 Manufacture of electronic device, e.g. acceleration sensor device, by plating lid of package, removing burrs on lid surface by chemical polishing, inserting electronic component in package body, and attaching lid to package body |
05/18/2005 | EP1531002A2 Device and method to electrostatically seal microfluidic devices |
05/12/2005 | US20050098750 Electrostatic sealing device and method of use thereof |
05/10/2005 | US6891654 Light modulator and method of manufacturing the same |