Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
10/2005
10/20/2005US20050230042 Bonding structure and method for bonding members
10/20/2005US20050229737 Manufacturing system for microstructure
10/19/2005CN1683234A Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same
10/13/2005US20050227508 Microengineered electrical connectors
10/13/2005US20050227408 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/13/2005US20050227401 Method of packaging MEMS device in vacuum state and MEMS device vacuum-packaged using the same
10/13/2005DE10359807B4 Microstructure used as a micro-reactor comprises microstructured elements/plates having assembly contours aligned on a receiving element
10/12/2005EP1584447A2 Manufacturing system for microstructure by a lamination process
10/12/2005CN1680188A Manufacturing system for microstructure
10/12/2005CN1680187A Method of manufacturing microstructure and manufacturing system for the same
10/11/2005US6953990 Wafer-level packaging of optoelectronic devices
10/06/2005WO2005081288A3 Mechanical sensor with pyramid socket suspension
10/05/2005EP1582499A2 Encapsulation wafer process
10/05/2005EP1576650A3 Method for microfabricating structures using silicon-on-insulator material
10/05/2005CN1678398A Microfluidic apparatus with integrated porous-substrates/sensor for real-time biochemical molecule detection
10/04/2005US6951824 Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method
10/04/2005US6951768 Single crystal, dual wafer, tunneling sensor or switch with substrate protrusion and a method of making same
09/2005
09/29/2005US20050214969 Method for forming a chamber in an electronic device and device formed thereby
09/29/2005DE102004011203A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
09/28/2005EP1580161A1 Method for forming a chamber in an electronic device and device formed thereby
09/28/2005EP1578686A2 An integrated structure and method for fabricating the same
09/28/2005CN1675125A MEMS array, manufacturing method thereof, and MEMS device manufacturing method based on the same
09/28/2005CN1672929A Method for forming a chamber in an electronic device and device formed thereby
09/21/2005EP1576650A2 Method for microfabricating structures using silicon-on-insulator material
09/21/2005CN1672081A Bulk silicon mirrors with hinges underneath
09/21/2005CN1671536A Method and device for forming a body having a three-dimensional structure
09/20/2005US6946314 Method for microfabricating structures using silicon-on-insulator material
09/20/2005US6944941 Method for assembling cassette-loaded microcomponents
09/20/2005US6944931 Vibrating resonator with interior electrode on rigidity support; housing with wall bonded to substrate
09/14/2005CN2725900Y Direct heating terminal type microwave power sensor of microelectronic mechanical system
09/13/2005US6942750 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication
09/09/2005WO2005017972A3 Method for microfabricating structures using silicon-on-insulator material
09/08/2005US20050194685 Method for mounting semiconductor chips and corresponding semiconductor chip system
09/06/2005US6940636 Optical switching apparatus and method of assembling same
09/06/2005US6938334 Vibrating beam accelerometer two-wafer fabrication process
09/01/2005WO2005081288A2 Mechanical sensor with pyramid socket suspension
08/2005
08/30/2005CA2384072C Imaging technique for use with optical mems devices
08/25/2005WO2005079128A1 Micro-electromechanical sub-assembly having an on-chip transfer mechanism
08/25/2005US20050186703 Method for packaging semiconductor chips and corresponding semiconductor chip system
08/25/2005DE102004006199A1 Production of a micromechanical pressure sensor comprises aligning the caverns formed in a first component with openings of a second component, joining the components and applying a material layer to part of the opening
08/24/2005CN1659720A Hermetic encapsulation of organic electro-optical elements
08/24/2005CN1659684A Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
08/23/2005US6933163 Fabricating integrated micro-electromechanical systems using an intermediate electrode layer
08/18/2005WO2004017371A3 Method for microfabricating structures using silicon-on-insulator material
08/18/2005US20050181658 Microconnectors and non-powered microassembly therewith
08/18/2005US20050181636 Sockets for microassembly
08/18/2005US20050178204 Pyramid socket suspension
08/17/2005EP1564183A2 Microconnectors and non-powered microassembly therewith
08/17/2005CN1654311A Method for constructing non-close packing colloid balls ordered arrangement using soft-graving technology
08/17/2005CN1654310A Microconnectors and non-powered microassembly therewith
08/17/2005CN1214971C Two-dimensional excitation set and manufacturing method thereof
08/16/2005US6929781 Interconnection support for plate-like microcomponents
08/11/2005US20050175846 Electron beam evaporation deposition of glass; hermetic sealing; simple; accurately structured on substrates having varied dimensions
08/11/2005DE102004003413A1 Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung A method of packaging a semiconductor chip and corresponding semiconductor chip assembly
08/04/2005WO2005071707A1 Micro relay
08/04/2005WO2005069797A2 Microfluidic structures and methods for integrating a functional component into a microfluidic device
08/04/2005US20050167795 Electronic devices and its production methods
08/03/2005EP1558954A1 Method of producing a movable lens structure for a light shaping unit
08/02/2005US6925390 Customized microfluidic device design, ordering, and manufacturing
08/02/2005US6923669 Microconnectors and non-powered microassembly therewith
07/2005
07/28/2005US20050160816 Vibrating beam accelerometer
07/27/2005CN1647276A Method for coating metal surfaces and substrate having a coated metal surface as protection for copying process and elements concerned
07/27/2005CN1647261A Method for connecting substrates and composite element
07/27/2005CN1647258A Method for the production of structured layers on substrates
07/27/2005CN1646722A Method for coating metal surfaces and substrate having a coated metal surface
07/27/2005CN1646721A Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
07/27/2005CN1646418A Method for producing a product having a structured surface
07/27/2005CN1646417A Method of manufacturing an electronic device
07/27/2005CN1644484A Clamp for disk vacuum pack
07/21/2005US20050156320 Integrated device including connections on a separate wafer
07/21/2005US20050156259 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same
07/20/2005EP1554218A2 Micromechanical component and corresponding production method
07/14/2005US20050152639 Optical switch and fabrication method thereof
07/14/2005US20050151442 Micromechanical electrostatic resonator
07/14/2005US20050151371 Microfluidic structures and methods for integrating a functional component into a microfluidic device
07/14/2005DE10359807A1 Mikrostruktur sowie Verfahren und Einrichtung zu deren Herstellung Microstructure and method and apparatus for the production thereof
07/13/2005CN1639054A Micro fluid system support unit and manufacturing method thereof
07/13/2005CN1637457A Optical switch and fabrication method thereof
07/13/2005CN1636704A Coupling structure for component and coupling method
06/2005
06/30/2005WO2005058748A1 Method and system for self-aligning parts in mems
06/30/2005US20050142692 Wafer-level packaging of optoelectronic devices
06/23/2005US20050133362 Transferable micro spring structure
06/22/2005EP1542802A1 Microfluidic apparatus with integrated porous-substrates/sensor for real-time(bio)chemical molecule detection
06/22/2005EP1204479A4 Multiple fluid sample processor and system
06/14/2005US6905945 Microwave bonding of MEMS component
06/09/2005US20050121413 Method of manufacturing an electronic device
06/08/2005EP1538747A1 Micromechanical electrostatic resonator
06/08/2005EP1135792A4 Method for manufacturing carbon nanotubes as functional elements of mems devices
06/08/2005CN1625046A Micromechanical electrostatic resonator
06/07/2005US6903637 Connecting member, a micro-switch, a method for manufacturing a connecting member, and a method for manufacturing a micro-switch
06/02/2005US20050118742 Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device
06/02/2005US20050116247 Bonded products and methods of fabrication therefor
06/01/2005EP1535879A1 Mems array, manufacturing method thereof, and mems device manufacturing method based on the same
05/2005
05/25/2005DE10348336A1 Mechatronic system, e.g. for machine and system construction, has at least one modifier layer of material with coefficient of thermal expansion between those of metal and ceramic arranged between ceramic substrate and metallic surface
05/25/2005DE10345817A1 Verfahren und Vorrichtung zum Koppeln von Hohlfasern an ein mikrofluidisches Netzwerk Method and apparatus for coupling of hollow fibers to a microfluidic network
05/19/2005US20050106752 Process and device for coupling hollow fibers to a microfluidic network
05/19/2005DE102004042538A1 Manufacture of electronic device, e.g. acceleration sensor device, by plating lid of package, removing burrs on lid surface by chemical polishing, inserting electronic component in package body, and attaching lid to package body
05/18/2005EP1531002A2 Device and method to electrostatically seal microfluidic devices
05/12/2005US20050098750 Electrostatic sealing device and method of use thereof
05/10/2005US6891654 Light modulator and method of manufacturing the same
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