Patents
Sitemap › B81 - Micro-structural technology › B81C - Processes or apparatus specially adapted for the manufacture or treatment of micro-structural devices or systems › B81C 3 - Assembling of devices or systems from individually processed components
Patents for B81C 3 - Assembling of devices or systems from individually processed components (2,210)
01/2011
01/12/2011CN101941671A Electrostatic type vibration energy collector construction member and manufacturing method thereof
01/12/2011CN101587847B Perpendicular interconnection multi-chip assembly encapsulation method by PCB substrate
01/12/2011CN101397121B Silicon nanowire pressure sensor, cantilever beam, production method and pressure measurement method thereof
01/11/2011CA2463900C Digital optical switch apparatus and process for manufacturing same
01/05/2011DE102009027343A1 Verfahren zur Herstellung eines elektronischen Bauteils A method of manufacturing an electronic component
01/04/2011US7863200 Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules
12/2010
12/29/2010EP2267807A2 Piezoelectric macro-fiber composite actuator and manufacturing method
12/29/2010CN101927454A Wafer grinding method
12/29/2010CN101261963B Miniature electronic part and making method
12/23/2010WO2010147173A1 Manufacturing method for small-sized reactors and small-sized reactors
12/22/2010EP2264466A1 Microchip and method for manufacturing microchip
12/22/2010CN101920930A Wafer-level encapsulation method for non-refrigeration infrared image device
12/22/2010CN101049904B Vacuum packaging method and equipment
12/15/2010EP2259996A2 Micro-fixture
12/09/2010DE102009026676A1 Pressure sensor device for semiconductor chip arrangement, has sensor chip projecting pressure intake regions in housing chambers, where chambers include through-holes and pressure intake regions are supplied with absolute pressure
12/09/2010DE102009026628A1 Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements Micromechanical component and process for producing a micromechanical component
12/08/2010EP2258657A1 Method and apparatus for coupling hollow fibers to a microfluidical network.
12/08/2010CN101909803A Cold jointing apparatus, and cold jointing method
12/08/2010CN101905859A Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming
12/02/2010DE102009020163A1 Method for interlayer free connection of two semiconductor substrates through bonding by pretreatment, involves producing plasma between bonding surface and electrode by corona discharge
12/01/2010EP2255870A2 A manufacturing method of a support unit for a microfluidic system
12/01/2010CN1672929B Method for forming a chamber in an electronic device and device formed thereby
12/01/2010CN101898746A Wafer-level integrated encapsulation method of MEMS (Micro Electric Mechanical System) devices requiring different atmosphere pressures
12/01/2010CN101898743A Micro-machined ultrasonic transducer
11/2010
11/25/2010WO2010134244A1 Converter module and method for manufacturing same
11/24/2010CN101897018A Semiconductor device and method for manufacturing the same
11/24/2010CN101897013A An interconnect structure and a method of fabricating the same
11/24/2010CN101891143A Method for manufacturing multilayer three-dimensional device or structure
11/23/2010CA2592266C Method of bonding substrates
11/11/2010WO2010127694A1 Passive alignment method and its application in micro projection devices
11/11/2010WO2009149979A4 Production method for a micromechanical component consisting of a carrier and a semiconductor chip
11/11/2010DE202004021772U1 Waferverbindung unter Verwendung von Reaktivfolien zum massiv parallelen Häusen mikro-elektromechanischer Systeme Wafer bonding using reactive foils for massively parallel housings micro-electro-mechanical systems
11/10/2010CN201626828U Cover plate for micro electro mechanical system (MEMS) packaging technology
11/04/2010DE102010000631A1 Sensorvorrichtung und Sensorvorrichtungs-Anbringungsstruktur Sensor device and the sensor device mounting structure
11/04/2010DE102007055017B4 Verfahren zum Verbinden zweier Fügeflächen und Bauteil mit zwei verbundenen Fügeflächen A method for joining two joining surfaces and components associated with two joining surfaces
11/04/2010DE102007037788B4 Vorrichtung zum Ankoppeln von Leitungen an einen mikrofluidischen Chip Apparatus for coupling leads to a microfluidic chip
11/03/2010CN101239285B Passive microfluid mixer and packaging method thereof
11/03/2010CN101123231B Encapsulation structure for wafer chip dimension of micro mechanical-electrical system and its making method
11/02/2010US7825029 Method for the production of structured layers on substrates
10/2010
10/28/2010DE102009002584A1 Sensor arrangement, has adhesive layer partially embedded into mold housing, where adhesive layer below contact section is thinner than adhesive layer below sensitive section at region of recess in support surface
10/27/2010CN101871817A Hybrid-type pyroelectric uncooled focal plane detector and manufacturing process thereof
10/21/2010DE102009017306A1 Device for selective transfer of micro-structured component from printed circuit board into micro system, has thermally detachable retaining unit directly connected with heating medium and comprising adhesive surface and foil magnet
10/21/2010DE102009002485A1 Verfahren zur Herstellung von verkappten MEMS-Bauelementen Process for the preparation of capped MEMS devices
10/21/2010DE102009002376A1 Multichip-Sensormodul und Verfahren dessen Herstellung Multi-chip sensor module and method of manufacturing
10/21/2010DE102009002363A1 Verfahren zum Befestigen einer ersten Trägereinrichtung an einer zweiten Trägereinrichtung und mikromechanische Bauteile A method for attaching a first carrier device on a second carrier means and micromechanical components
10/20/2010EP2241398A1 Cold jointing apparatus, and cold jointing method
10/13/2010CN101858929A Capacitive micro-acceleration sensor with symmetrically combined elastic beam structure and production method thereof
10/13/2010CN101857188A MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method
10/13/2010CN101234747B Electromechanical system packaging construct and manufacturing method thereof
10/13/2010CN101081692B Method for manufacturing semiconductor package structure having micro electro-mechanical system
10/07/2010WO2010113759A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
10/07/2010DE102009029281A1 Module, particularly sensor module, is provided with component and connecting element, where component is connected to another component in electrically conductive manner
10/07/2010DE102008034448B4 Verfahren zur Bestimmung der Justagegenauigkeit beim Waferbonden Method for determining the alignment accuracy for wafer bonding
09/2010
09/30/2010DE102009001930A1 Sensorbaustein Sensor module
09/29/2010CN101844740A Low-temperature bonding method based on gold silicon eutectic
09/23/2010WO2010107436A1 Three phase capacitance-based sensing
09/23/2010WO2010106733A1 Semiconductor device
09/23/2010WO2009149979A3 Production method for a micromechanical component consisting of a carrier and a semiconductor chip
09/22/2010CN101840867A Method for producing an electronic module
09/22/2010CN101837944A Method for forming a gyroscope and accelerometer
09/16/2010US20100233801 Centrifugal force based microfluidic device, biochemical treatment system having the same, and method of fabricating the microfluidic device
09/16/2010DE102009006822A1 Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem Microstructure, to processes for their preparation, to apparatus for bonding a micro-structure and micro-system
09/16/2010DE102009001461A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly
09/16/2010DE102004011203B4 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
09/15/2010CN101832965A Laccase biosensor based on magnetic carbon nano tube and chitosan/silicon dioxide gel and preparation method and application thereof
09/14/2010US7794610 Optical components and production thereof
09/09/2010DE102010002545A1 Sensorvorrichtung und Herstellverfahren für eine Sensorvorrichtung Sensor device and manufacturing method for a sensor device
09/09/2010DE102010000729A1 Halbleitervorrichtung und Verfahren zu deren Fertigung A semiconductor device and method of manufacturing
09/08/2010CN101823686A Sealing method of thermoplastic polymer multi-layer micro-fluidic chips
09/01/2010CN101819214A Integrated anemograph based on ceramics wafer level package and preparation method thereof
09/01/2010CN101817498A Method for preparing low-pollution high-yield wafer-level uniform-size glass micro-cavity
09/01/2010CN101817497A Method for preparing all-dry etching dissolved silicon chip for microstructure manufacturing
09/01/2010CN101817495A Micro fluid control chip and preparation method and application thereof
09/01/2010CN101172184B Three-dimensional flexible nervus and preparation method
08/2010
08/25/2010EP1255642B1 Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
08/19/2010DE102009024048B3 Mountable and demountable microfluidic system used for producing, cultivating, manipulating, analyzing and preserving single-phase and multiphase fluids, comprises stack of plates
08/19/2010DE102009007837A1 Sensormodul und Verfahren zum Herstellen von Sensormodulen Sensor module and method of manufacturing of sensor modules
08/18/2010CN101804961A Method for performing hermetic package by using spherical glass micro-cavity
08/18/2010CN101804959A Semiconductor package and manufacturing method thereof
08/12/2010DE102008019692B4 Verfahren zur Integration eines Polymer-Funktionsbauteils in ein Silizium-Mikrosystem Method for integrating a polymer-functional component in a silicon microsystems
08/11/2010EP2216289A1 Method for the production of micro/nanofluidic devices for flow control and resulting device
08/11/2010CN101798054A Wafer-level vacuum encapsulating method for micro-electromechanical device
08/05/2010WO2010085942A2 Microstructure, method for producing the same, device for bonding a microstructure and microsystem
08/04/2010CN101792109A Micro inertial sensor with transversely movable electrodes embedded and manufacturing method thereof
08/04/2010CN101792108A Large capacitance micro inertial sensor based on slide-film damping and manufacturing method thereof
07/2010
07/28/2010CN101786594A Electronic device package and fabrication method thereo
07/28/2010CN101786593A Processing method of differential type high-precision accelerometer
07/27/2010CA2520250C Micro relay
07/22/2010WO2010082433A1 Reactor and method for producing a reactor
07/22/2010DE102009000352A1 Sensor device has housing, sensor chip and evaluation chip, where housing has inner chamber, in which sensor chip and evaluation chip are arranged, and sensor chip is arranged on bottom area of housing
07/21/2010CN101139079B Plastic packaging method of microcomputer sensing and measuring element, and structure thereof
07/14/2010CN101776501A MEMS presser sensor chip and manufacturing method thereof
07/14/2010CN101776483A Non-refrigerant thermopile infrared detector and manufacturing method thereof
07/14/2010CN101776476A Systems, gyroscope sensors, and fabrication methods for forming structures for the gyroscope sensors.
07/14/2010CN101774529A MEMS atom cavity chip and preparation method thereof
07/14/2010CN101774528A Cross-scale biomimetic micro-nano branch structure array and preparation method thereof
07/07/2010CN201522458U Sensor measuring force-electricity properties and microstructure of transmission electron microscope
06/2010
06/30/2010CN101762714A Shrinking valve in microfluidic chip
06/30/2010CN101762356A Vacuum micro-electronics pressure sensor
06/30/2010CN101759135A Sensor and manufacture method thereof
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