Patents for B81C 1 - Manufacture or treatment of devices or systems in or on a substrate (14,526) |
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12/31/2014 | CN104252039A 微机电反射体及用于制造微机电反射体的方法 MEMS reflector and a method for manufacturing a MEMS reflector |
12/31/2014 | CN104249992A 晶片与晶片之间的对准方法 Alignment between the wafer and wafer |
12/31/2014 | CN104249991A Mems器件及其制作方法 Mems device and manufacturing method thereof |
12/31/2014 | CN102901997B 一种曲面复眼的制备方法 One kind of compound eye surface preparation |
12/31/2014 | CN102616733B 双掩膜浓硼掺杂soi mems加工方法 Soi mems double mask processing methods concentrated boron-doped |
12/31/2014 | CN102556943B 微机电传感器的形成方法 The method for forming micro-electromechanical sensors |
12/31/2014 | CN102360119B 光调制器像素单元及其制作方法 Light modulator pixel unit and its production method |
12/31/2014 | CN102303840B 矢量式afm纳米加工系统的纳米压印模版的制备方法 Preparation nanofabrication system afm vector type nanoimprint templates |
12/31/2014 | CN102275860B 惯性微机电传感器的制造方法 Manufacturing method of inertial MEMS sensors |
12/31/2014 | CN101643193B 具有带有不同大气内压力的空腔的微机械装置 Micromechanical device having a cavity with an internal pressure of the different atmospheric |
12/30/2014 | US8922870 Electrical routing |
12/30/2014 | US8922864 MEMS device having reduced deformations |
12/30/2014 | US8921997 Electrical component and method of manufacturing the same |
12/30/2014 | US8921974 Semiconductor manufacturing and semiconductor device with semiconductor structure |
12/30/2014 | US8921957 Method of improving MEMS microphone mechanical stability |
12/30/2014 | US8921954 Method of providing a semiconductor structure with forming a sacrificial structure |
12/30/2014 | US8921953 Method for MEMS device fabrication and device formed |
12/30/2014 | US8921952 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof |
12/30/2014 | US8921166 Structure and method for placement, sizing and shaping of dummy structures |
12/30/2014 | US8921165 Elimination of silicon residues from MEMS cavity floor |
12/30/2014 | US8921145 Hybrid MEMS bump design to prevent in-process and in-use stiction |
12/30/2014 | US8921144 Planar cavity MEMS and related structures, methods of manufacture and design structures |
12/30/2014 | US8921128 Method of manufacturing MEMS devices with reliable hermetic seal |
12/25/2014 | US20140376071 Micromechanical component, micromirror device, and manufacturing method for a micromechanical component |
12/25/2014 | US20140376069 Micro-electromechanical reflector and method for manufacturing a micro-electromechanical reflector |
12/25/2014 | US20140375168 Capacitive micro-machined transducer and method of manufacturing the same |
12/25/2014 | US20140374857 Cantilever beam structure where stress is matched and method of manufacturing the same |
12/25/2014 | US20140374855 Pressure sensor and method of packaging same |
12/25/2014 | US20140374854 Vertical mount package and wafer level packaging therefor |
12/25/2014 | US20140374853 Component including means for reducing assembly-related mechanical stresses and methods for manufacturing same |
12/25/2014 | US20140374852 Electrical Shielding in a MEMS Leadframe Package |
12/25/2014 | US20140374851 Mems device and method for fabricating mems devices |
12/25/2014 | US20140374850 Apparatus and Method for Shielding and Biasing in MEMS Devices Encapsulated by Active Circuitry |
12/25/2014 | US20140374847 Packaging method for mems devices |
12/24/2014 | CN204034020U 一种异平面微针阵列 A different plane microneedle array |
12/24/2014 | CN104241281A 一种集成电路及其制造方法 An integrated circuit and its manufacturing method |
12/24/2014 | CN104240731A 用于二嵌段聚合物的超薄对准壁 For the two-block polymer thin wall alignment |
12/24/2014 | CN104237202A 一种硅纳米阵列基底及其制备方法、应用 A silicone nano-array substrate and its preparation method, application |
12/24/2014 | CN104236766A 封装应力与温漂自补偿的双悬浮式力敏传感器芯片及制备方法 Since the compensation package stress and temperature drift dual suspension force sensor chip and preparation method |
12/24/2014 | CN104236593A 伸展模态传感器及其制造方法 Stretch modal sensor and its manufacturing method |
12/24/2014 | CN104229729A 一种碳纳米管垂直阵列转移至柔性聚合物基底上的方法 A carbon nanotube array is transferred to the vertical method on flexible polymer substrates |
12/24/2014 | CN104229728A 一种基于机械张紧方式的柔性衬底薄膜微加工方法及机械张紧装置和使用方法 A flexible substrate film microfabrication and mechanical tensioning device and method of use based on the mechanical tensioning mode |
12/24/2014 | CN104229727A 用于磁体半导体组件组的预模制及其生产方法 Pre-molded magnet semiconductor component groups and production method for |
12/24/2014 | CN104229726A 应力匹配的悬臂梁结构及其制造方法 Cantilever structure and manufacturing method stresses matches |
12/24/2014 | CN104229725A 一种半导体器件及其形成方法 A semiconductor device and method of forming |
12/24/2014 | CN104229724A 一种制备自封闭纳米通道的方法 A self-closing process for preparing a nanochannel |
12/24/2014 | CN104229722A 具有光学波导和二维偏转的mems梁的集成 Integrated with optical waveguides and two-dimensional beam deflection mems |
12/24/2014 | CN104229721A 用于mems设备的悬浮无源元件 Passive Components for mems suspension equipment |
12/24/2014 | CN104229720A 芯片布置及用于制造芯片布置的方法 Chip layout and method for manufacturing the chip layout |
12/24/2014 | CN104229719A 具有原子蒸气腔室的mems器件及其形成方法 Mems devices with atomic vapor chamber and forming method |
12/24/2014 | CN103235156B 单弹性梁叉指电容加速度计 Interdigital capacitor single elastic beam accelerometer |
12/24/2014 | CN102937651B 血清肿瘤标志物检测的巨磁阻抗效应生物传感器制作方法 GMI biosensor fabrication method of serum tumor markers |
12/24/2014 | CN102879608B 弯折形弹性梁的电容式加速度传感器及制备方法 Capacitive accelerometer bent-shaped elastic beam and preparation methods |
12/24/2014 | CN102800879B 燃料电池的mems制造方法 Mems manufacturing method of the fuel cell |
12/24/2014 | CN102800872B 燃料电池极板的mems制造方法 Mems manufacturing method of the fuel cell plates |
12/24/2014 | CN102257374B 传感器装置和用于制造传感器装置的方法 Sensor apparatus and method for manufacturing a sensor device |
12/24/2014 | CN102190276B 微机电器件及其封装制作工艺 MEMS devices and packaging production process |
12/23/2014 | US8918152 Parallel fabrication of nanogaps and devices thereof |
12/23/2014 | US8916943 MEMS devices having a plurality of cavities |
12/23/2014 | US8916449 Package structure and substrate bonding method |
12/23/2014 | US8916408 Leadframe-based premolded package having air channel for microelectromechanical system (MEMS) device |
12/23/2014 | US8916407 MEMS device and method of manufacturing same |
12/23/2014 | US8916053 Pattern forming method |
12/18/2014 | US20140370715 Plasma processing method and substrate processing apparatus |
12/18/2014 | US20140370638 Mems structure with improved shielding and method |
12/18/2014 | US20140367811 Capacitance type sensor and method of manufacturing the same |
12/18/2014 | US20140367809 Viristor In Base For MEMS Microphones |
12/18/2014 | US20140367805 MEMS structure and method of forming the same |
12/17/2014 | CN204022464U 三维mems封装结构 Three-dimensional packaging structure mems |
12/17/2014 | CN104220365A 腔封装设计 Cavity package design |
12/17/2014 | CN104211010A 一种刻蚀方法 One kind of etching method |
12/17/2014 | CN102602880B 通用的多种材料间全限制纳米线的自对准制备方法 Whole variety of materials between the general limit self-aligned nanowires prepared |
12/17/2014 | CN102491252B 离散纳米材料的选择性排列方法 Selective arrangement Discrete nanomaterials |
12/17/2014 | CN102295265B 平面腔体微机电系统及相关结构、制造和设计结构的方法 Methods planar cavity micro-electromechanical systems and related structures, manufacturing and design structure |
12/16/2014 | US8912088 Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate |
12/16/2014 | US8912031 Electronic device, electronic apparatus, and method of manufacturing electronic device |
12/16/2014 | US8911636 Micro-device on glass |
12/11/2014 | US20140363975 Substrate etching method and substrate processing device |
12/11/2014 | US20140361388 Capacitive sensing structure with embedded acoustic channels |
12/11/2014 | US20140361387 Chip arrangement and method for manufacturing a chip arrangement |
12/10/2014 | CN204008696U 一种柔性电容式加速度传感器 A flexible capacitive accelerometer |
12/10/2014 | CN204008693U 一种热膜风速风向传感器 A thermal membrane Wind Sensor |
12/10/2014 | CN204008531U 一种具有绝热沟槽的mems气体传感器 Adiabatic trench having a gas sensor mems |
12/10/2014 | CN203998938U 晶圆封装设备 Wafer Packaging Equipment |
12/10/2014 | CN203998937U 一种mems硅基微热板 One kind of silicon mems micro-hotplate |
12/10/2014 | CN104203806A 用于微机电的测量变换器的膜片装置和用于制造膜片装置的方法 Diaphragm means for measuring micro-electromechanical transducer and a method for manufacturing a membrane device |
12/10/2014 | CN104199252A 一种实现光刻胶微结构的方法 A method for implementing a photoresist microstructures |
12/10/2014 | CN104197921A 一种图形转移的压印式微型半球谐振陀螺及其制备方法 Embossed mini HRG and its preparation method for pattern transfer |
12/10/2014 | CN104197918A 半环形压电谐振陀螺仪及其制备方法 Semi-circular piezoelectric resonator gyroscope and its preparation method |
12/10/2014 | CN104197917A 一种压电驱动和检测的微型半球谐振陀螺仪及其制备方法 Miniature hemispherical resonator gyro and its preparation method and detection piezoelectric drive |
12/10/2014 | CN104197916A 半球体固态波动微陀螺仪及其制备方法 Fluctuations in the hemisphere solid micro gyroscope and its preparation method |
12/10/2014 | CN104197910A 基于微圆球的微型半球谐振陀螺仪及其制备方法 Based on micro-hemispherical resonator gyro and preparation method of micro ball |
12/10/2014 | CN104197909A 一种双半球结构微型谐振陀螺仪及其制备方法 A dual hemispherical structure of micro-resonant gyroscope and its preparation method |
12/10/2014 | CN104192791A 一种mems晶圆的切割方法 One kind of mems wafer cutting method |
12/10/2014 | CN103149606B 原位成形式光学微透镜制造的实时监测和质量控制系统 In situ in the form of optical micro-lens manufacturing, real-time monitoring and quality control systems |
12/10/2014 | CN102967556B 一种基于数字微镜器件的微流控芯片加工与检测实验装置 A microfluidic chip processing and testing experimental apparatus based on a digital micromirror device |
12/10/2014 | CN102757012B 一种微溶液存储器和多相异性微颗粒的制备方法 Method for preparing a solution of a memory and a heterogeneous anisotropic micro microparticles |
12/10/2014 | CN102730625B 在含有疏水性的硅柱的硅片表面构筑微电极对阵列的方法 In the silicon wafer surface of the column containing a hydrophobic build microelectrode array method |
12/10/2014 | CN102649537B 一种soi mems单片集成方法 One kind of monolithic integration method soi mems |
12/10/2014 | CN102637610B 用于在载体上安装半导体芯片的方法 Mounting a semiconductor chip on a support method for |