| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/07/2002 | US20020026862 Method and apparatus for cleaving a semiconductor wafer |
| 03/05/2002 | US6352073 Semiconductor manufacturing equipment |
| 03/05/2002 | US6352072 Ingot support device for slicing silicon |
| 02/28/2002 | US20020025616 Alignment method and apparatus for aligning cutting blade |
| 02/28/2002 | US20020023725 Nozzle for cleaving substrates |
| 02/27/2002 | CN1337298A Scriber wheel for brittle base-board |
| 02/26/2002 | US6351022 Method and apparatus for processing a planar structure |
| 02/26/2002 | US6350313 Method of producing a polycrystalline silicon rod |
| 02/21/2002 | US20020020275 Cutting apparatus for ceramic green bodies |
| 02/14/2002 | US20020017177 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/14/2002 | DE10132503A1 Wire saw to separate discs from work piece, e.g. to cut semiconductor wafers has work piece holder to fix work piece plate and adjusting unit to align work piece plate flush with work piece holder |
| 02/12/2002 | US6346034 Cutting method |
| 02/12/2002 | US6345616 Cutting machine |
| 02/12/2002 | US6345615 Complete blade and wafer handling and support system without tape |
| 02/07/2002 | US20020016047 Process for producing a large number of semiconductor chips from a semiconductor wafer |
| 02/07/2002 | DE10035590A1 Wire-saw for cutting semiconductor wafers from single-crystal workpieces, includes supply device for supplying compensating sawing wire to wire guide rollers |
| 02/06/2002 | EP1177870A2 A cutter wheel for forming scribe lines on brittle materials |
| 01/30/2002 | CN1078518C Method of producing semiconductor wafers |
| 01/29/2002 | US6341740 Cutting-and-transferring system and pellet transferring apparatus |
| 01/24/2002 | WO2001041959A3 Monitoring system for dicing saws |
| 01/24/2002 | US20020007553 Method of manufacturing slider and slider manufacturing aid |
| 01/24/2002 | DE10133448A1 Alignment of cutting blade includes determining angle between tracks from workpiece surface image, determining correction angle per track, setting tracks parallel to x-axis |
| 01/24/2002 | DE10032963A1 Separation of thinner surfaces of semiconductor and ceramic substrates uses saw with electromagnetic forces to control separation thickness |
| 01/23/2002 | CN1332666A Superabrasive wheel with active bond |
| 01/23/2002 | CN1332663A Superabrasive wire saw and method for making the saw |
| 01/17/2002 | US20020006765 System for cutting brittle materials |
| 01/17/2002 | DE10121502A1 Verfahren zum Teilen eines Halbleiterwafers A method for dividing a semiconductor wafer |
| 01/09/2002 | CN1077722C Method for processing through-hole on crystal chip with transparent cover |
| 01/01/2002 | CA2225131C Process for producing semiconductor article |
| 12/27/2001 | WO2001043168A3 Method for handling semiconductor substrates during processing and/or machining |
| 12/27/2001 | US20010054606 Laser scribing of wafers |
| 12/26/2001 | CN1076868C Method for processing through-hole on crystal chip with protective layer |
| 12/25/2001 | US6333377 Ingot support device for slicing silicon |
| 12/25/2001 | US6332833 Method for fabricating silicon semiconductor discrete wafer |
| 12/25/2001 | US6332264 Method of manufacturing slider and slider manufacturing aid |
| 12/20/2001 | DE10116791A1 "Verfahren zur Herstellung einer großen Anzahl von Halbleiterchip s aus einem Halbleiterwafer" "A process for producing a large number of semiconductor chip S from a semiconductor wafer" |
| 12/19/2001 | EP0839098B1 Marking diamond |
| 12/19/2001 | CN2465927Y Gem perforating pin |
| 12/13/2001 | WO2001094669A1 Polycrystalline silicon rod and method for processing the same |
| 12/13/2001 | US20010051683 Molding of an acrylic resin and one or more inorganic fillers selected from aluminum hydroxide, barium sulfate, barium carbonate, calcium carbonate and silica; low cost, adequate strength |
| 12/11/2001 | US6328027 Method for precision cutting of soluble scintillator materials |
| 12/06/2001 | WO2001091982A1 Method and apparatus for cutting an ingot |
| 12/06/2001 | WO2001091981A1 Wire saw and process for slicing multiple semiconductor ingots |
| 12/06/2001 | US20010048014 Method of producing a semiconductor device |
| 12/05/2001 | EP1160853A2 Method of producing a semiconductor device |
| 12/04/2001 | US6325059 Techniques for dicing substrates during integrated circuit fabrication |
| 12/04/2001 | US6325058 Complete blade and wafer handling and support system without tape |
| 12/04/2001 | US6325057 Complete blade and wafer handling and support system without tape |
| 11/29/2001 | DE10007642A1 Separating substrate with defined preferred break points involves applying separating blade to preferred break points with substrate held on rubber mat by suction |
| 11/28/2001 | CN1324285A Monitoring system for dicing saws |
| 11/22/2001 | US20010044256 Cutting machine |
| 11/22/2001 | US20010042299 Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| 11/20/2001 | US6319747 Process for producing a thin-film solar module and separating means for use in this process |
| 11/20/2001 | US6319354 System and method for dicing semiconductor components |
| 11/15/2001 | WO2001085387A1 System for cutting brittle materials |
| 11/15/2001 | US20010041387 Semiconductor wafer dividing method |
| 11/15/2001 | US20010040197 Cutting-and-transferring system and pellet transferring apparatus |
| 11/15/2001 | US20010039946 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor |
| 11/15/2001 | US20010039863 Blade exchanging device and blade exchanging method therefor |
| 11/15/2001 | US20010039728 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 11/07/2001 | CN2458146Y Mechanical hand for processing gem |
| 11/01/2001 | WO2001042152A3 Method and device for cutting flat work pieces made of a brittle material |
| 11/01/2001 | US20010035401 Dual laser cutting of wafers |
| 10/31/2001 | DE10117923A1 Halbleiterwaferschneidmaschine Semiconductor wafer cutting machine |
| 10/31/2001 | DE10019601A1 Production of polycrystalline rod involves depositing silicon on carrier rod, rotating polycrystalline silicon rod about a longitudinal axis and cutting rod through with parting tool |
| 10/25/2001 | US20010032583 Method of producing a polycrystalline silicon rod |
| 10/25/2001 | DE10064012A1 Tool used for processing wafers has a thermally sprayed coating on its surface |
| 10/18/2001 | US20010029938 Semiconductor wafer cutting machine |
| 10/18/2001 | DE19959921C1 Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material Method and apparatus for cutting through flat workpieces made from brittle material |
| 10/17/2001 | EP1144160A1 Superabrasive wheel with active bond |
| 10/17/2001 | EP1144158A2 Stiffly bonded thin abrasive wheel |
| 10/17/2001 | CN2454112Y Low-speed diamond cutting machine |
| 10/11/2001 | US20010027986 Air cleave breaker profile for improving cleave yield |
| 10/11/2001 | DE10014445A1 Process for separating a semiconductor rod into a number of wafers comprises guiding a fluid on the surface of the rod and later in a cutting gap formed, and removing the dissolved reaction products with the fluid stream |
| 10/10/2001 | EP1140413A1 Cutting of ultra-hard materials |
| 10/04/2001 | EP1138439A2 Method and apparatus for recycling abrasive grain slurry |
| 10/02/2001 | US6295978 Method for reducing damage to wafer cutting blades during wafer dicing |
| 10/02/2001 | US6295977 Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece |
| 09/27/2001 | US20010023979 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
| 09/27/2001 | US20010023973 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/27/2001 | US20010023691 Machining apparatus capable of saving different fluids in machining |
| 09/25/2001 | US6293270 Manufacturing method of liquid jet recording head, liquid jet recording head manufactured by this manufacturing method, and manufacturing method of element substrate for liquid jet recording head |
| 09/20/2001 | US20010023113 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/20/2001 | DE10011513A1 Spent cutting suspension recovery, comprises adding agent to suspension to induce flocculation of solid particles |
| 09/13/2001 | WO2001066678A1 Method for recovering a spent cutting suspension |
| 09/13/2001 | US20010020408 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/11/2001 | US6286499 Method of cutting and separating a bent board into individual small divisions |
| 09/06/2001 | US20010018913 Method and apparatus for cutting a rare earth alloy |
| 09/04/2001 | US6284661 Method and apparatus for producing a wafer |
| 09/04/2001 | US6283111 Wire saw cutting method and apparatus therefor |
| 08/30/2001 | US20010017130 Apparatus and method for cutting ingots |
| 08/30/2001 | DE19958803C1 Verfahren und Vorrichtung zum Handhaben von Halbleitersubstraten bei der Prozessierung und/oder Bearbeitung Method and apparatus for handling semiconductor substrates during the processing and / or handling |
| 08/29/2001 | EP1126949A1 Monitoring system for dicing saws |
| 08/28/2001 | US6280306 Wafer polishing apparatus and wafer manufacturing method |
| 08/28/2001 | US6279564 Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 08/28/2001 | US6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 08/23/2001 | DE10105655A1 Verfahren zum Sägen von Werkstücken mit einer Bandsäge Method for cutting workpieces with a band saw |
| 08/23/2001 | DE10007853A1 Sägeapparat zum spanenden Trennen von Werkstücken Sägeapparat for the cutting cutting workpieces |
| 08/22/2001 | EP1124674A1 Method and device for separating into two slices a wafer of material, in particular semiconductor material |
| 08/21/2001 | US6277001 Method of cutting a laminated workpiece |