Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
07/2003
07/17/2003WO2003058697A1 Method of manufacturing semiconductor chip
07/15/2003US6593170 Semiconductor wafer dividing method
07/10/2003WO2002066263A3 Mounting and preparing a gemstone or industrial diamond for the formation of a mark on the surface thereof
07/09/2003CN1113951C Aqueous composition
07/08/2003US6590181 Laser cutter apparatus using two laser beams of different wavelengths
06/2003
06/26/2003WO2003051594A1 Separating device and method for creating point contacts
06/26/2003WO2002066262A3 Forming a mark on a gemstone or industrial diamond
06/26/2003US20030116152 Chuck for holding a workpiece
06/25/2003EP1320438A1 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire
06/24/2003US6581586 Cutting machine
06/24/2003CA2247444C Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method
06/18/2003EP1320126A2 Method for dicing a semiconductor wafer using U-grooves
06/17/2003US6580054 Scribing sapphire substrates with a solid state UV laser
06/17/2003US6578567 Wafer sawing apparatus
06/17/2003US6578458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
06/10/2003US6577913 Cutting and sorting automation system and method for manufacturing a liquid crystal device using the same
06/10/2003US6576531 Method for cutting semiconductor wafers
06/05/2003US20030104765 Resin diamond blade and optical waveguide manufacturing method using the blade
06/04/2003EP1316992A2 Method for processing a semiconductor wafer and laminate substrate used as a support for said semiconductor wafer in said method
06/04/2003EP1144158B1 Stiffly bonded thin abrasive wheel
06/03/2003USH2067 Cutting metallates of refractory metals
05/2003
05/28/2003CN1420529A Cutter
05/27/2003US6568385 Cutting machine
05/27/2003US6568384 Semiconductor material cutting and processing method
05/22/2003WO2003041899A1 Sawing wire
05/15/2003US20030089362 Wire saw and cutting method thereof
05/15/2003US20030089214 Cutting apparatus for ceramic green bodies
05/15/2003US20030089206 Method of aligning a workpiece in a cutting machine
05/14/2003EP1310316A1 Saw wire
05/14/2003CN1417008A Workpiece regulating method for cutting machine
05/13/2003US6562698 Dual laser cutting of wafers
05/13/2003US6561177 Wafer dicing blade consisting of multiple layers
05/08/2003WO2003038880A1 Method of forming scribe line on semiconductor wafer, and scribe line forming device
05/08/2003US20030084922 Method for removing the circumferential edge of a dielectric layer
05/08/2003US20030084578 Scribing device
05/01/2003US20030082995 In-situ wear measurement apparatus for dicing saw blades
05/01/2003US20030079588 Blade assembly cover
05/01/2003US20030079583 Substrate cutting method and substrate cutting apparatus
04/2003
04/29/2003US6555447 Method for laser scribing of wafers
04/29/2003US6554686 Sawing wire and method for the cutting and lapping of hard brittle workpieces
04/29/2003US6554046 Substrate cleaving tool and method
04/24/2003WO2003033207A1 Cutting method using wire saw, wire saw device, and method of manufacturing rare-earth magnet
04/24/2003WO2002081392A9 Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
04/24/2003US20030077980 Vibratory material removal system and method
04/24/2003US20030075162 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements
04/23/2003CN1413136A Method and apparatus for separating non-metallic materials
04/23/2003CN1411963A Cutter
04/22/2003US6550364 Wire sawing device
04/17/2003WO2002067300A3 Singulation apparatus and method for manufacturing semiconductors
04/17/2003US20030073382 System and method for non-contact wear measurement of dicing saw blades
04/17/2003US20030070520 Cutting machine
04/17/2003DE10139962C1 Verfahren zum Abtrennen von Scheiben von einem sprödharten Werkstück und Drahtsäge zur Durchführung des Verfahrens A method for cutting wafers from a hard brittle workpiece and wire saw for performing the method
04/10/2003WO2003028949A2 Method of machining substrates
04/10/2003WO2003018276B1 Method of processing brittle material and processing device
04/09/2003CN1408498A Method for cutting non-metal base
04/08/2003US6543434 Device for simultaneously separating a multiplicity of wafers from a workpiece
04/03/2003WO2003026861A1 Method for scribing substrate of brittle material and scriber
04/03/2003WO2003026857A2 Coaxial spindle cutting saw
04/03/2003US20030062348 Method for cutting a non-metallic substrate
04/03/2003US20030061921 Internal, active, and compensatory method and device for the rotational main-shaft of a cutting tool with axial bias-and-swing
04/01/2003US6539932 Apparatus and method for cutting ingots
03/2003
03/27/2003US20030060025 Techniques for maintaining alignment of cut dies during substrate dicing
03/27/2003US20030060022 Method for cutting semiconductor wafers
03/27/2003US20030056628 Coaxial spindle cutting saw
03/26/2003CN1405287A Non-combustible water-series cutting fluid composition and non-combustible water-series cutting fluid
03/26/2003CN1104041C Method for producing wafer and apparatus employed therein
03/20/2003US20030055577 Method and system for approximating properties of laser interaction with materials
03/20/2003US20030052098 Method and apparatus for cutting substrate using coolant
03/20/2003US20030051353 Formation of a disk from a fracturable material
03/19/2003EP1293316A1 Dicing method and apparatus
03/18/2003US6534382 Process for producing semiconductor article
03/13/2003US20030047543 Wafer dicing device and method
03/13/2003US20030047177 Method for cutting ingots for use with a wire cutting apparatus
03/12/2003EP1291456A1 Polycrystalline silicon rod and method for processing the same
03/12/2003EP1291408A1 Nonflammable water-based cutting fluid composition
03/12/2003CN1401467A Method for separating thin sheet from hard and friable workpiece, and wire saw for carrying out said method
03/12/2003CN1102876C Method of cutting blocks of hard substances into plates by means of wire saw, and wire saw for carrying out the method
03/06/2003WO2003018276A1 Method of processing brittle material and processing device
03/06/2003US20030045031 Dicing method and dicing apparatus for dicing plate-like workpiece
03/05/2003EP1287958A1 Wire saw and method of slicing a cylindrical workpiece
03/04/2003US6526958 Method of cutting ceramic green block
02/2003
02/26/2003EP1284847A1 Wire saw and process for slicing multiple semiconductor ingots
02/25/2003US6524162 Slicing center
02/25/2003US6523215 Polishing pad and system
02/20/2003WO2003013815A1 Device for detaching substrates and the associated method
02/20/2003US20030034022 Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method
02/18/2003US6520061 Cutting apparatus for ceramic green bodies
02/13/2003WO2003011793A2 Method for manufacturing sintered magnet
02/13/2003WO2003011777A1 Scribe head, scribe apparatus and scribe method using the scribe head
02/13/2003WO2003011546A1 Machine for cutting wafers
02/13/2003US20030030130 Semiconductor device with mechanical stress protection during wafer cutting, and manufacturing process thereof
02/13/2003US20030030122 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
02/12/2003EP1283549A1 Semiconductor device with mechanical stress protection during wafer cutting, and manufacturing process thereof
02/11/2003US6517427 Abrasive-bladed multiple cutting wheel assembly
02/06/2003WO2003010102A1 Cutting method for brittle non-metallic materials (two variants)
02/06/2003WO2003010101A2 Method for breaking a cut workpiece
02/06/2003US20030027494 Apparatus for cutting a wafer
02/06/2003US20030024909 Method and apparatus for separating non-metallic materials
02/06/2003US20030024522 Wafer dicing blade consisting of multiple layers
02/04/2003US6513694 Semiconductor wafer cleaving method and apparatus
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