| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 10/06/2004 | CN1534601A Improved bar cutting methond and device used in magnetic tape nead manufacture |
| 10/05/2004 | US6800018 Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device |
| 09/30/2004 | WO2004082911A1 Breaking device for separating ceramic printed circuit boards |
| 09/30/2004 | WO2004082730A2 Protective sheath for a cannula |
| 09/30/2004 | US20040188487 Apparatus and method for splitting substrates |
| 09/30/2004 | US20040188400 Wafer dicing device and method |
| 09/30/2004 | US20040187659 Glass cutting method |
| 09/30/2004 | DE10253250B4 Automatisches Präzisionsausrichtungsverfahren für eine Halbleiterwaferschneidevorrichtung Automatic precision alignment method for a semiconductor wafer cutter |
| 09/29/2004 | EP1461190A1 Device for cutting a substrate layer, and corresponding method |
| 09/29/2004 | EP1332247B1 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 09/29/2004 | CN1533594A Dicing method, inspecting method for integrated circuit chip, and substrate-retaining apparatus and adhesive film |
| 09/29/2004 | CN1532158A 切割玻璃的方法 The method of cutting glass |
| 09/28/2004 | US6796145 Method for cutting mother rod lens |
| 09/23/2004 | WO2004082006A1 Laser beam machining method |
| 09/23/2004 | WO2004080643A1 Laser beam machining method |
| 09/23/2004 | WO2004080642A1 Laser beam machining method |
| 09/22/2004 | EP1458534A1 Separating device and method for creating point contacts |
| 09/22/2004 | CN1531030A Machining apparatus with rotary cutter |
| 09/16/2004 | US20040180473 Method of dividing a semiconductor wafer |
| 09/16/2004 | DE102004003858A1 Bearbeitungsvorrichtung, die mit einem drehbaren bzw. Drehwerkzeug ausgerüstet ist Processing apparatus, which is equipped with a rotatable or rotating tool |
| 09/15/2004 | CN1529680A Cutting method for brittle non-metallic materials |
| 09/15/2004 | CN1529647A Device and method for determining orintation of crystallographic plane in relation to crystal surface and device for cutting single crystal in cutting machine |
| 09/14/2004 | US6791197 Reducing layer separation and cracking in semiconductor devices |
| 09/09/2004 | DE10237247B4 Verfahren zur Herstellung einer Halbleiterscheibe aus Silicium A process for producing a semiconductor wafer of silicon |
| 09/08/2004 | CN1527802A Flat display panel and method of dividing the flat display panel |
| 09/07/2004 | US6787382 Method and system for singulating semiconductor components |
| 09/02/2004 | WO2004073946A1 Substrate-processing table and device |
| 09/02/2004 | US20040168682 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| 08/31/2004 | US6782883 Cutting device for breaking fragile materials such as semiconductor wafers or the like |
| 08/26/2004 | US20040166654 Panel, liquid crystal projector, image pickup device, and digital image recognition device |
| 08/26/2004 | US20040164061 Finishing machine using laser beam |
| 08/25/2004 | CN1524030A Polishing pad and system |
| 08/24/2004 | CA2322421C Superabrasive wire saw and method for making the saw |
| 08/19/2004 | WO2003028949A8 Method of machining substrates |
| 08/19/2004 | US20040159316 Wire sawing device |
| 08/18/2004 | EP1140413B1 Cutting of ultra-hard materials |
| 08/18/2004 | CN1522185A Method of ablating an opening in a hard, non-metallic substrate |
| 08/17/2004 | US6776078 Cutting machine |
| 08/12/2004 | WO2004067243A1 Substrate dividing apparatus and method for dividing substrate |
| 08/12/2004 | US20040154456 Scribing head, and scrbing apparatus and scribing method using the scribing head |
| 08/11/2004 | CN1519092A Method for preparing agate of emulating natural grape |
| 08/10/2004 | US6773333 Method for cutting slices from a workpiece |
| 08/05/2004 | US20040149110 Machining apparatus equipped with rotary tool |
| 08/04/2004 | CN1518491A Novel laser diamond sawing machine |
| 08/04/2004 | CN1160765C Method and device for mfg. electronic parts |
| 08/04/2004 | CN1160177C Method and device for isolating plate-like substrates |
| 07/29/2004 | WO2004062868A1 Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 07/29/2004 | US20040144824 Substrate and method of separating components from a substrate |
| 07/29/2004 | US20040144722 Separating the exhausted slurry into a first liquid fraction and a first solids fraction, mixing the first solids fraction with a first etchant to form a first solid/etchant mixture in which silicon particulate and metal particulate is dissolved |
| 07/29/2004 | US20040144487 Substrate layer cutting device and method |
| 07/29/2004 | DE10326576A1 Correcting method for translatoric axial deflection of semiconductor rod relative to cutting plane during sawing of semiconductor rod, e.g. of ruby or gallium-gadolinium garnet, using sensors for determining deflection |
| 07/28/2004 | EP1441385A1 METHOD OF FORMING SCRIBE LINE ON SEMICONDUCTOR WAFER, AND SCRIBE LINE FORMING DEVICE |
| 07/28/2004 | EP1224067B1 Device and method for separating materials |
| 07/22/2004 | DE10317115A1 Halbleiter-Waferteilungsanordnung und Halbleitereinrichtungs-Herstellungsverfahren Semiconductor wafer dividing device and semiconductor device manufacturing method |
| 07/21/2004 | CN1515025A Method for dividing semiconductor wafer |
| 07/20/2004 | US6763823 Machining method not causing any damage to major cut surfaces of cut objects |
| 07/15/2004 | US20040137700 Method for dividing semiconductor wafer |
| 07/15/2004 | US20040135467 Method of manufacturing thin quartz crystal wafer |
| 07/15/2004 | US20040134477 Row slicing method in tape head fabrication |
| 07/14/2004 | EP1437209A1 Wire sawing device |
| 07/14/2004 | CN1157277C Cut off method of rare earth alloy and cut off device |
| 07/13/2004 | US6761615 In-situ wear measurement apparatus for dicing saw blades |
| 07/08/2004 | DE10147634B4 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 07/06/2004 | US6757964 Apparatus for manufacturing sliders |
| 07/01/2004 | US20040126996 Method and apparatus for machining substrate |
| 07/01/2004 | US20040123717 Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| 06/30/2004 | EP1433582A1 Method and apparatus for cutting a semiconductor wafer |
| 06/30/2004 | EP1433195A2 Method of machining substrates |
| 06/30/2004 | CN1509222A Cutting process for rare-earth alloy |
| 06/30/2004 | CN1508850A Method and apparatus for cutting devices from conductive substrated |
| 06/30/2004 | CN1507993A Jewelry decorants, diamond and square zirconium and their cutting method |
| 06/29/2004 | US6756562 Semiconductor wafer dividing apparatus and semiconductor device manufacturing method |
| 06/29/2004 | US6754949 Method and apparatus for manufacturing electronic parts |
| 06/24/2004 | WO2004052586A1 Device and method for laser processing |
| 06/24/2004 | US20040118338 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 06/22/2004 | US6752688 Cutting solution supplying and controlling apparatus for dicing machine |
| 06/17/2004 | WO2004050291A1 Laser processing device |
| 06/17/2004 | US20040115903 Method of processing a semiconductor wafer |
| 06/17/2004 | US20040112360 Substrate dicing method |
| 06/17/2004 | DE10253250A1 Automatic precision alignment method for a semiconductor wafer cutting device in which the wafer is aligned with a virtual line through its center, determined using a key pattern, parallel to the wafer cutting direction |
| 06/16/2004 | EP1428640A1 Method for scribing substrate of brittle material and scriber |
| 06/16/2004 | CN1504309A Abrasion granule and slicing up method of semiconductor block using the abrasion granule |
| 06/16/2004 | CN1154160C Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| 06/15/2004 | US6750118 Process and apparatus to subdivide objects |
| 06/10/2004 | WO2004048057A1 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| 06/09/2004 | EP1425248A2 Method for breaking a cut workpiece |
| 06/08/2004 | US6747725 Device for cutting liquid crystal display panel and method for cutting using the same |
| 06/08/2004 | US6746022 Chuck for holding a workpiece |
| 06/03/2004 | WO2003059590A8 Device for cutting a substrate layer, and corresponding method |
| 06/02/2004 | EP1423244A1 Device for detaching substrates and the associated method |
| 06/01/2004 | US6744009 Combined laser-scribing and laser-breaking for shaping of brittle substrates |
| 06/01/2004 | US6743076 Dicing machine |
| 06/01/2004 | US6742424 Cutting apparatus for ceramic green bodies |
| 05/26/2004 | EP1422201A2 Cutting method for brittle non-metallic materials (two variants) |
| 05/26/2004 | EP1422034A1 Method for machining a work piece |
| 05/25/2004 | US6739326 Semiconductor manufacturing equipment |
| 05/20/2004 | US20040094593 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus |
| 05/20/2004 | US20040094010 Cutting device for breaking fragile materials such as semiconductor wafers or the like |
| 05/19/2004 | CN1496967A Block cutting method, cover plate, liquid crystal plate, liquid crystal projector camera device and digital image recognition device |
| 05/19/2004 | CN1496798A Equipment for cutting liquid crystal display panel |