| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 09/12/1989 | US4865241 Method and apparatus for subdividing into pieces a ceramic plate |
| 09/12/1989 | US4864895 Method and apparatus for adjusting the true running of the cutting edge of annular saw blades |
| 09/12/1989 | US4864779 Grinding method and apparatus of orientation flat |
| 08/23/1989 | EP0329163A2 Method for forming presized particles from silicon rods |
| 08/23/1989 | EP0329087A1 Method and device for dressing an inner peripheral blade in a slicing machine |
| 08/23/1989 | EP0328610A1 Process for cropping bars of hard materials and equipment for carrying out the process |
| 08/01/1989 | US4852304 Apparatus and method for slicing a wafer |
| 07/11/1989 | US4846623 Wafer transferring device |
| 07/04/1989 | US4844047 Process for sawing crystal rods or blocks into thin wafers |
| 06/28/1989 | EP0187737B1 Method of machine cutting silicon metal particulates with si3n4 |
| 06/21/1989 | EP0320972A2 Ingot support device in slicing apparatus |
| 06/14/1989 | EP0320090A2 Shaping silicon semiconductor wafers |
| 06/13/1989 | US4839300 Method of manufacturing semiconductor device having trapezoidal shaped substrate sections |
| 06/13/1989 | US4838238 Internal peripheral edge type blade holding device |
| 06/07/1989 | EP0318806A2 Process for peeling protective film off a wafer |
| 05/30/1989 | US4834062 Multiblade inner hole saw for the sawing of crystal rods into thin blades |
| 05/24/1989 | EP0316856A1 Purple diamond and method of producing the same |
| 05/17/1989 | EP0316039A2 Machine for machining close parallel score lines on plane sheets |
| 05/17/1989 | CN2037675U Double-head round scraper |
| 05/09/1989 | US4828052 Ultrasonic drilling apparatus |
| 05/03/1989 | EP0313714A1 Apparatus and method for slicing a wafer |
| 05/02/1989 | US4826143 Method of manufacturing a spring of the cylindrical type to be used at high temperature |
| 04/26/1989 | EP0313524A1 Method of treatment for natural and artificial lapideous materials and the like by means of abrasives |
| 04/26/1989 | CN2036480U Minitype portable drilling machine |
| 04/11/1989 | US4819387 Method of slicing semiconductor crystal |
| 03/22/1989 | EP0307901A2 Gang saw for the multiple lap-cutting of rod-like or block-like work pieces into discs |
| 03/21/1989 | US4814296 Method of fabricating image sensor dies for use in assembling arrays |
| 03/14/1989 | US4811722 Process for sharpening cutting-off tools and cutting-off process |
| 03/01/1989 | EP0305204A1 Method of fabricating image sensor dies for use in assembling arrays |
| 02/23/1989 | WO1989001395A1 Process for cropping bars of hard materials and equipment for carrying out the process |
| 02/08/1989 | CN2032129U Jade cutter |
| 01/25/1989 | EP0300224A2 Strainless precision after-treatment process by radical reaction |
| 01/18/1989 | EP0299451A1 Apparatus for adjusting the concentricity of the cutting edge of annular internal-hole saw blades |
| 01/11/1989 | CN2030540U Single-head circle scraper |
| 12/08/1988 | DE3716943A1 Process and device for separating material, in particular in bar form |
| 12/07/1988 | EP0293941A1 Method for the sharpening of parting tools for parting off slices of rod- or blockshaped works, and cutting process |
| 12/06/1988 | CA1245949A1 Process and apparatus for multiple lap cutting of solid materials |
| 11/30/1988 | CN88100817A Process for manufacture of semiconductor device |
| 11/29/1988 | US4787951 Method and apparatus for adhering a tape or sheet to a semiconductor wafer |
| 11/08/1988 | CA1244294A1 Carrier film with conductive adhesive for dicing of semiconductor wafers |
| 11/03/1988 | WO1988008363A1 Wafering device and method of using same |
| 11/02/1988 | EP0289045A2 Apparatus for fabricating semiconductor devices |
| 10/18/1988 | US4777926 Device for clamping the blades in a gang saw for sawing crystal rods |
| 10/11/1988 | US4776316 Wafering device and method of using same |
| 10/04/1988 | US4775085 Semiconductor wafer breaking apparatus |
| 09/27/1988 | US4773951 Method of manufacturing wafers of semiconductor material |
| 09/20/1988 | US4771759 Method for severing a rod in slices, slicing machine for carrying out the method and use of the slicing machine |
| 08/31/1988 | EP0280245A2 Method and apparatus for cutting a cylindrical material |
| 08/31/1988 | EP0279949A1 Process for manufacturing semiconductor components |
| 07/12/1988 | US4756796 Method of producing wafer |
| 07/05/1988 | US4755340 Method for producing packs of blades used for cutting crystal bars into wafers |
| 06/08/1988 | EP0269997A2 Process and device for the correction of the cutting direction for sawing crystal rods or blocks |
| 05/17/1988 | US4744550 Vacuum wafer expander apparatus |
| 04/19/1988 | US4738573 Silicon wafer processing boat carrier slot plunge cutter |
| 04/19/1988 | US4738240 Process for cutting a diamond to provide an invisible mounting |
| 03/30/1988 | EP0261695A1 Apparatus for driving and controlling wire in wire saw |
| 03/29/1988 | US4733649 Process and apparatus for multiple lap cutting of solid materials |
| 03/01/1988 | US4727852 In a cutting machine |
| 02/02/1988 | US4722130 Method of manufacturing a semiconductor device |
| 01/05/1988 | CA1230971A1 Precision cutting of millimeter wave ferrite materials |
| 12/15/1987 | US4712535 Method and apparatus for severing wafers |
| 12/08/1987 | US4711014 Method for handling semiconductor die and the like |
| 10/28/1987 | EP0242489A1 Process for separating a rod into segments, cutter grinding machine for carrying out this process, and its use |
| 09/29/1987 | US4696712 Semiconductor wafer mounting and cutting system |
| 08/25/1987 | US4688540 Semiconductor wafer dicing machine |
| 08/19/1987 | EP0232920A2 Internal hole saw with a plurality of blades for sawing of crystal bars as well as methods executed by that saw |
| 07/22/1987 | EP0229687A2 Method of manufacturing wafers of semiconductor Material |
| 07/15/1987 | EP0228863A2 Method of dividing a substrate into a plurality of substrate portions |
| 07/09/1987 | EP0187737A4 METHOD OF MACHINE CUTTING SILICON METAL PARTICULATES WITH Si3N4. |
| 06/09/1987 | US4671835 Applying adhesive film to annular frame |
| 05/27/1987 | EP0223249A2 Mounting beam for preparing wafers |
| 05/26/1987 | US4667944 Means for handling semiconductor die and the like |
| 05/26/1987 | US4667650 Mounting beam for preparing wafers |
| 05/13/1987 | EP0221454A1 Method of producing wafers |
| 05/12/1987 | US4664739 Removal of semiconductor wafers from dicing film |
| 05/06/1987 | EP0220769A1 Process for the manufacture of a cylindrical type high-temperature spring |
| 04/29/1987 | CN86107119A Method of producing wafer |
| 04/07/1987 | US4655191 Wire saw machine |
| 03/31/1987 | US4653680 Apparatus for breaking semiconductor wafers and the like |
| 03/31/1987 | US4653361 Measuring system in an annular slicing machine |
| 03/26/1987 | DE3532718A1 Wire saw |
| 03/24/1987 | US4652135 Article holding apparatus and its use |
| 03/11/1987 | EP0213166A1 Cleaving machine |
| 03/03/1987 | US4646710 Multi-wafer slicing with a fixed abrasive |
| 02/24/1987 | US4644639 Method of supporting an article |
| 02/03/1987 | US4640259 Device for feeding work to machine tool |
| 01/20/1987 | US4637369 Apparatus for spanning a center-opening saw blade |
| 01/06/1987 | US4633847 Multiple-blade internal-hole saw for sawing crystalline rods |
| 11/12/1986 | EP0201394A1 Process for cutting a diamond to otain an invisible setting, polishing process and device for producing it |
| 11/12/1986 | CA1213865A Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method |
| 09/25/1986 | WO1986005435A1 Cleaving machine |
| 08/13/1986 | CN85100706A Cutting machine for piezo-electric ceramic crystal slices |
| 07/30/1986 | EP0188862A1 Device for feeding work to a machine tool |
| 07/23/1986 | EP0187737A1 METHOD OF MACHINE CUTTING SILICON METAL PARTICULATES WITH Si3N4. |
| 07/16/1986 | EP0187428A1 Mechanism for generating reciprocal rotary motion |
| 07/02/1986 | EP0186201A2 Semiconductor wafer dicing machine |
| 06/25/1986 | EP0185355A1 Method of manufacturing blade stacks for dividing crystal bars into wafers |
| 05/28/1986 | EP0182218A2 Method for dicing semiconductor wafer |
| 05/27/1986 | US4590667 For mass producing semiconductor devices |
| 04/29/1986 | US4585379 Precision positioning device |