| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/08/2005 | US6864460 Method of ablating an opening in a hard, non-metallic substrate |
| 03/08/2005 | US6863061 Row slicing method in tape head fabrication |
| 03/03/2005 | WO2005018874A1 Method for the production of components |
| 03/03/2005 | US20050045009 Processing apparatus provided with backpressure sensor |
| 03/03/2005 | DE10335063A1 Automatic process for locking semiconductor bars onto a saw base determines dimensions suitable holder and orientation of the bar and brings up holder to grasp the bar |
| 02/24/2005 | WO2004113041A3 Method for producing a ceramic/metal substrate |
| 02/24/2005 | US20050042805 Method of forming a scribe line on a passive electronic component substrate |
| 02/24/2005 | DE10358872A1 Breaking flat or bent brittle material along notched closed free form contour, e.g. flat glass, comprises placing brittle material with notch lying underneath on soft substrate, and further processing |
| 02/22/2005 | US6857939 Dicing machine with interlock |
| 02/17/2005 | WO2005015626A1 Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 02/17/2005 | US20050035100 Method of dividing a plate-like workpiece |
| 02/17/2005 | US20050035099 Method of dividing a plate-like workpiece |
| 02/17/2005 | DE10391795T5 Verfahren zum Bearbeiten eines Halbleiterwafers A method of processing a semiconductor wafer |
| 02/17/2005 | CA2521513A1 Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 02/16/2005 | CN2678862Y Diamond fret-saw for cutting-off hard and fragile material |
| 02/16/2005 | CN1582221A Substrate layer cutting device and method |
| 02/16/2005 | CN1579728A Method for dividing disc-like workpiece |
| 02/10/2005 | US20050029239 Method for scribing substrate of brittle material and scriber |
| 02/10/2005 | DE102004029094A1 Verfahren zum Herstellen eines Halbleiterchips A method of manufacturing a semiconductor chip |
| 02/10/2005 | DE10136181B4 Verfahren zum Brechen eines eingeschnittenen Werkstückes aus Glas mit einer Wandstärke von 6mm oder mehr A method of breaking a cut workpiece made of glass with a wall thickness of 6mm or more |
| 02/09/2005 | CN1579013A Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| 02/03/2005 | WO2003101695A3 Machining apparatus and methods |
| 02/03/2005 | US20050023260 Semiconductor wafer dividing apparatus and semiconductor device manufacturing method |
| 02/02/2005 | EP1502695A1 Finishing machine using laser beam |
| 02/02/2005 | EP1425248B1 Method for breaking a cut workpiece |
| 02/02/2005 | CN1574235A Process for manufacturing a semiconductor chip |
| 02/02/2005 | CN1572738A Lining method for fragile material base plate and apparatus therefor |
| 01/27/2005 | WO2005008849A2 Method of forming a scribe line on a passive electronic component substrate |
| 01/27/2005 | WO2005007335A1 Laser processing method and device, and processed product |
| 01/27/2005 | CA2532033A1 Method of forming a scribe line on a passive electronic component substrate |
| 01/26/2005 | CN2673597Y Splinter |
| 01/20/2005 | WO2005005096A1 Perforated plate for wafer chuck |
| 01/20/2005 | WO2004007164A8 Pasted base board cutting system and base board cutting method |
| 01/20/2005 | DE19930639B4 Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands Means for dividing a plate-shaped object |
| 01/20/2005 | DE10330179A1 Verfahren zum Trennen flacher Werkstücke aus Keramik A method for separating flat ceramic workpieces |
| 01/19/2005 | EP1498216A1 Method of cutting processed object |
| 01/19/2005 | EP1498215A1 Laser processing method |
| 01/13/2005 | WO2005002779A1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/13/2005 | US20050009297 Device and method for cutting an assembly |
| 01/13/2005 | US20050009235 Method of forming a scribe line on a ceramic substrate |
| 01/13/2005 | US20050005641 Diamond cutting method, enneahedral-cut diamonds and assembly of enneahedral-cut diamonds |
| 01/12/2005 | CN1564730A Apparatus and method for splitting substrates |
| 01/06/2005 | US20050003635 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
| 01/06/2005 | US20050000649 Substrate cutting device and method |
| 01/05/2005 | DE10327360A1 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate |
| 01/05/2005 | CN1182945C Automatically controlled high-precision crystal wire electrode cutting machine |
| 01/04/2005 | US6837778 Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| 12/30/2004 | US20040266138 Process for manufacturing a semiconductor chip |
| 12/30/2004 | US20040262274 Novel laser diamond sawing machine |
| 12/30/2004 | DE102004020270A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine |
| 12/29/2004 | WO2004114387A1 Method for producing semiconductor single crystal wafer and laser processing device used therefor |
| 12/29/2004 | WO2004113041A2 Method for producing a ceramic/metal substrate |
| 12/29/2004 | EP1491309A1 Parting method for fragile material substrate and parting device using the method |
| 12/29/2004 | EP1490191A1 System and method for the manufacture of surgical blades |
| 12/29/2004 | EP1320438B1 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire |
| 12/29/2004 | CN1182424C Automatic system for cutting and sorting workpieces and cutting and sorting equipment |
| 12/29/2004 | CA2508733A1 Method for producing semiconductor single crystal wafer and laser processing device used therefor |
| 12/23/2004 | US20040259329 Machining substrates, particulary semiconductor wafers |
| 12/23/2004 | US20040255924 Cutting method using wire saw, wire saw device, and method of manufacturing rare-earth magnet |
| 12/21/2004 | US6832606 Wire saw and cutting method thereof |
| 12/21/2004 | US6832439 Scribing device |
| 12/09/2004 | US20040245913 Flat display panel and method of dividing the flat display panel |
| 12/09/2004 | US20040244789 Sawing wire |
| 12/08/2004 | EP1484791A1 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
| 12/07/2004 | US6826986 Bi-directional singulation system and method |
| 12/02/2004 | DE10311693B3 Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness |
| 12/01/2004 | CN1550303A Method for controlling cutting and sorting workpieces |
| 11/25/2004 | US20040231134 Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| 11/23/2004 | US6821437 Forming reusable cutting fluid; complete removal of abrasive grains and attrition material |
| 11/18/2004 | WO2004100240A1 Method and device for dividing plate-like member |
| 11/18/2004 | WO2004098848A1 Method for cleaning sic particles |
| 11/17/2004 | EP1476289A1 A novel laser diamond sawing machine |
| 11/17/2004 | CN1175961C Method and device for cutting rare-earth alloy |
| 11/11/2004 | WO2004067243B1 Substrate dividing apparatus and method for dividing substrate |
| 11/10/2004 | EP1475357A1 Fragile material substrate scriber, fragile material substrate processing machine, fragile material substrate polishing device, and fragile material substrate parting system |
| 11/10/2004 | EP1474273A1 Laser machine for examination, planning and marking raw diamond |
| 11/03/2004 | CN1543386A A novel laser diamond blocking machine for faceting the bottom of the diamond |
| 10/28/2004 | US20040214408 Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| 10/28/2004 | US20040212027 Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| 10/28/2004 | US20040211762 Laser beam processing machine |
| 10/28/2004 | US20040211218 Method and apparatus for cutting a glass sheet and method for manufacturing a PDP |
| 10/27/2004 | EP1469981A1 Device for cutting a substrate layer, and corresponding method |
| 10/27/2004 | CN2650965Y Automatic shot drilling machine for agate and jade ball |
| 10/27/2004 | CN1541193A Cutter wheel, device and method using cutter wheel, method of dividing laminated substrate, and method and device for mfg. cutter wheel |
| 10/27/2004 | CN1541154A Laser machine for checking planning and marking natural diamond |
| 10/27/2004 | CN1539590A Laser working machine |
| 10/26/2004 | US6807705 Polishing pad and system |
| 10/21/2004 | US20040209443 Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations |
| 10/21/2004 | US20040205970 Glass cutter |
| 10/21/2004 | DE102004012012A1 Verfahren zum Teilen eines Halbleiterwafers A method for dividing a semiconductor wafer |
| 10/19/2004 | US6806544 Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| 10/14/2004 | WO2004087390A1 Laser cutting method of fragile material |
| 10/14/2004 | US20040200814 Laser machine for examination, planning and marking raw diamond |
| 10/12/2004 | US6802928 Method for cutting hard and brittle material |
| 10/07/2004 | US20040194773 Wire sawing process and device |
| 10/07/2004 | DE10314179A1 Brechvorrichtung für das Vereinzeln von Keramikleiterplatten Breaking device for the separation of ceramic circuit boards |
| 10/06/2004 | EP1464461A1 Process and device for wire sawing |
| 10/06/2004 | CN1535213A Forming mark on gemstone or industrial diamond |
| 10/06/2004 | CN1535212A Mounting and preparing gemstone or industrial diamond for formation of mark on surface thereof |
| 10/06/2004 | CN1534763A Method for cutting semiconductor wafer |