| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 01/02/2001 | US6168500 Monitoring system for dicing saws |
| 12/27/2000 | EP1062068A2 Superabrasive wire saw and method for making the saw |
| 12/27/2000 | EP0885083B1 Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method |
| 12/26/2000 | US6165051 Monitoring system for dicing saws |
| 12/19/2000 | US6162730 Method for fabricating semiconductor wafers |
| 12/19/2000 | US6161533 Slurry managing system and slurry managing method |
| 12/14/2000 | WO2000075983A1 A method for dicing wafers with laser scribing |
| 12/14/2000 | DE19930353A1 Method for slicing semiconductor bars with grinding suspension continuously refreshed |
| 12/12/2000 | US6159285 Converting <100> and <111> ingots to <110> ingots |
| 12/12/2000 | US6159284 Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| 12/06/2000 | CN1275468A Device fr method for cutting magnetic element |
| 12/05/2000 | US6155247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 11/29/2000 | EP1054748A1 Wire sawing device for cutting fine slices using angular crossing of at least two sawing yarn layers |
| 11/28/2000 | US6152803 Substrate dicing method |
| 11/15/2000 | EP0976457B1 Method for treating semiconductor material |
| 11/14/2000 | US6146252 Method of machining a thermosetting laminate |
| 11/14/2000 | US6145499 Wire saw |
| 11/14/2000 | US6145422 Method of positioning work piece and system therefor |
| 11/07/2000 | US6142138 High speed method of aligning cutting lines of a workpiece using patterns |
| 10/31/2000 | US6139591 Wafer separating and cleaning apparatus and process |
| 10/31/2000 | US6138659 Method of preparing end faces on integrated circuits |
| 10/24/2000 | US6136137 System and method for dicing semiconductor components |
| 10/24/2000 | US6135102 Wafer collecting apparatus |
| 10/19/2000 | WO2000061324A2 Rocking apparatus and method for slicing a work piece utilizing a diamond impregnated wire |
| 10/18/2000 | CN1057485C Method of spliting ceramic substrate and spliting device |
| 10/10/2000 | US6130401 Device and method for machining transparent medium by laser |
| 10/04/2000 | EP1041649A1 Method of manufacturing a tin film solar module and an apparatus for cutting |
| 10/04/2000 | EP0651693B1 Method and apparatus for separating circuit dies from a wafer |
| 09/20/2000 | EP1036773A2 Scribing method and apparatus |
| 09/19/2000 | US6120360 Apparatus for processing a planar structure |
| 09/19/2000 | US6119675 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/19/2000 | US6119673 Wafer retrieval method in multiple slicing wire saw |
| 09/07/2000 | DE10010865A1 Notch-cutting of e.g. thinly-layered laminate forming ceramic capacitors, employs computerized optical examination of first cut to determine alignment of second precision cut, all executed on only one machine |
| 09/07/2000 | DE10004595A1 Waferpoliervorrichtung und Waferherstellungsverfahren Wafer polishing apparatus and wafer manufacturing technology |
| 09/05/2000 | US6113489 Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus |
| 09/05/2000 | US6113473 Method and apparatus for improved wire saw slurry |
| 09/05/2000 | US6112740 Method for reducing damage to wafer cutting blades during wafer dicing |
| 09/05/2000 | US6112738 Method of slicing silicon wafers for laser marking |
| 09/05/2000 | US6112737 Wire saw and method of cutting work |
| 09/05/2000 | US6112735 Complete blade and wafer handling and support system without tape |
| 08/31/2000 | DE19905751A1 Innenlochsäge und Verfahren zum Justieren einer Düse und eines Sensors einer Innenlochsäge relativ zu einem Sägeblatt der Innenlochsäge Keyhole saw and method for adjusting a nozzle and a sensor relative to an annular saw a saw blade of the annular saw |
| 08/29/2000 | US6109253 Method using a wire feeding device for a multi-wire saw |
| 08/23/2000 | CN1264341A Method for marking diamond |
| 08/22/2000 | US6107163 Method of manufacturing a semiconductor chip |
| 08/22/2000 | US6106365 Method and apparatus to control mounting pressure of semiconductor crystals |
| 08/22/2000 | US6105567 Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation |
| 08/17/2000 | WO2000047383A1 Apparatus and process for the slicing of monocrystalline silicon ingots |
| 08/17/2000 | DE10003240A1 Control procedure for wire saw involves controlling feed rate of workpiece based on comparison between calculated cutting load and predetermined reference value |
| 08/17/2000 | DE10003239A1 Wire saw abnormality transmitting system for cutting silicon, ceramic, has modem that dials call number of user's pager to indicate abnormality of wire saw |
| 08/16/2000 | EP1028455A2 Cutting-and-transferring system and pellet transferring apparatus |
| 08/16/2000 | EP1027949A1 Internal diameter saw and method for adjusting a nozzle and a sensor relative to a saw blade of same |
| 08/15/2000 | US6102267 Method and apparatus for non-contact pulsating jet cleaving of a semiconductor material |
| 08/15/2000 | US6102023 Precision cutting apparatus and cutting method using the same |
| 08/10/2000 | DE19904834A1 Mechanism for detaching, separating, and storing thin, fragile disc-shaped substrates for solar cells etc. manufacture |
| 08/08/2000 | US6100166 Process for producing semiconductor article |
| 08/08/2000 | US6098862 Incrementally continuous laser cleaving process |
| 08/08/2000 | US6098861 Breaking apparatus for ceramic board |
| 08/08/2000 | US6098514 Ultrasonic vibration cutter |
| 08/02/2000 | CN1261568A Ultrasonic vibrative cutting method and its device |
| 08/01/2000 | US6095899 Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
| 07/27/2000 | WO2000043180A1 Drill and drilling method, stage working method, and method of manufacturing exposure device |
| 07/27/2000 | WO2000043162A1 Wire saw and cutting method |
| 07/26/2000 | EP1022100A1 Ultrasonic vibration cutting method and apparatus |
| 07/26/2000 | CN1261163A Automatic system for cutting and sorting workpieces and control method thereof |
| 07/25/2000 | CA2101467C Decorative cracked glass mirror tile and method |
| 07/21/2000 | CA2296621A1 Ultrasonic vibration cutting method and apparatus |
| 07/20/2000 | WO2000041862A1 Scribe device |
| 07/20/2000 | DE19900671A1 System for separating disc-shaped substrates for wafer prodn. etc. which are fixed together in sequence on carrier |
| 07/19/2000 | EP1020271A1 A saw wire cleaning apparatus |
| 07/13/2000 | WO2000040371A1 Superabrasive wheel with active bond |
| 07/13/2000 | CA2353624A1 Superabrasive wheel with active bond |
| 07/05/2000 | CN1054210C Wafer-like processing after sawing DMDS |
| 07/04/2000 | US6082239 Hydrodynamic blade guide |
| 06/29/2000 | WO2000038023A1 Method for controlling a sawing process |
| 06/29/2000 | WO2000037216A1 Wire saw having cutter for slicing base |
| 06/29/2000 | WO2000037208A1 Cutting of ultra-hard materials |
| 06/29/2000 | DE19859291A1 Verfahren zur Kontrolle eines Sägeprozesses A method for controlling a sawing |
| 06/28/2000 | EP1013190A1 Cut cornered square mixed-cut gemstone |
| 06/28/2000 | CN1258311A Aqueous composition, aqueous cutting fluid using same, method for preparation thereof, and cutting method using cutting fuid |
| 06/21/2000 | EP1009569A2 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 06/14/2000 | CN1256509A Cutting device |
| 06/13/2000 | US6073878 Method and device for unwinding or winding up a sawing wire |
| 06/08/2000 | DE19958227A1 Production of semiconductor wafers comprises turning the wheel of a grinding machine to remove the resin coating from the wafer exposing the wafer up to its bumps |
| 05/31/2000 | EP1004653A1 Aqueous cutting fluid, aqueous cutting agent, and process for cutting hard brittle materials with the same |
| 05/30/2000 | US6067977 Apparatus and method for reducing damage to wafer cutting blades during wafer dicing |
| 05/30/2000 | US6067976 Wafer cut method with wire saw apparatus and apparatus thereof |
| 05/25/2000 | DE19953157A1 Cutter for ceramic workpieces, e.g. with honeycomb structures, has translation and vertically movable arms holding cutting wire with reciprocal cutting drive mechanism |
| 05/23/2000 | US6066562 Method for fabricating silicon semiconductor discrete wafer |
| 05/23/2000 | US6065461 Ingot slicing method and apparatus therefor |
| 05/18/2000 | DE19851070A1 Method for simultaneous separation of several discs of brittle, hard workpiece; involves rotating workpiece and using wire saw |
| 05/17/2000 | EP1001006A1 Aqueous composition, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid |
| 05/16/2000 | US6063697 Crushing of silicon on ultrapure ice |
| 05/16/2000 | US6062209 Method of slicing a workpiece through use of a wire saw, and a wire saw |
| 05/11/2000 | WO2000026000A1 Method and device for separating into two slices a wafer of material, in particular semiconductor material |
| 05/11/2000 | WO2000025978A1 Monitoring system for dicing saws |
| 05/11/2000 | DE19849939A1 Procedure for comminuting brittle material, especially semi-conductor rods, entails directing HP fluid onto rod from HP jets in ring in direct vicinity of angled holder and from HP jets in pressure plate |
| 05/09/2000 | US6059877 Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type |
| 05/04/2000 | WO2000024549A2 Stiffly bonded thin abrasive wheel |
| 05/04/2000 | CA2346660A1 Stiffly bonded thin abrasive wheel |
| 05/02/2000 | US6056795 Stiffly bonded thin abrasive wheel |