| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 02/25/1992 | US5090848 Device for producing drilled holes with undercut |
| 02/06/1992 | DE4024751A1 Inner hole cutting of rod-like workpieces - e.g. semiconductor rods, and removing disks produced and risks arising from final cutting stage |
| 01/08/1992 | EP0464668A1 Tensioning device for an inner diameter saw blade and its use for sawing rods, in particular from semiconductor material, into wafers |
| 12/24/1991 | US5074276 Slicing method by a slicing machine |
| 12/11/1991 | EP0460437A2 Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device composed of the substrate |
| 12/03/1991 | US5069195 Apparatus for automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
| 11/27/1991 | EP0457998A1 Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets |
| 11/27/1991 | EP0328610B1 Process for cropping bars of hard materials and equipment for carrying out the process |
| 11/21/1991 | EP0457626A2 Method of using an ID saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method |
| 11/21/1991 | EP0457533A2 A wafer slicing and grinding system |
| 11/13/1991 | EP0456223A1 A slicing machine and a slicing method by the same |
| 10/01/1991 | US5052366 Wire saw |
| 09/18/1991 | EP0446811A1 Method and apparatus for grinding diamond and diamond product using the same |
| 09/05/1991 | WO1991012915A1 Industrial device for sawing parts into thin slices |
| 08/21/1991 | EP0442104A2 Device for drilling undercutted holes |
| 07/30/1991 | US5036274 Method of monitoring the path of an annular blade through a semiconductor material |
| 07/09/1991 | US5030910 Method and apparatus for slicing crystalline wafers aided by magnetic field monitoring means |
| 07/09/1991 | US5029418 Sawing method for substrate cutting operations |
| 07/03/1991 | EP0435442A2 Method and apparatus for cutting inorganic materials |
| 06/26/1991 | EP0433956A1 Wire saws for slicing shaped workpieces from rod or block and their use |
| 06/19/1991 | EP0432637A1 Device for dressing the cutting edge of a cutting-off tool for severing slices from an ingot or block-like workpiece, especially semiconductor material, use and sewing method for the same |
| 06/19/1991 | EP0432422A2 Method and apparatus for mounting slice base on wafer of semiconductor |
| 06/19/1991 | EP0432288A1 Brittle material cutting method |
| 06/18/1991 | US5024207 Heating apparatus and method for semiconductor material slicing process |
| 05/21/1991 | US5016800 Method of cutting workpiece |
| 05/08/1991 | EP0426007A2 Apparatus for loading and re-slicing semiconductor wafer |
| 04/23/1991 | US5009735 Process for peeling protective film off a wafer |
| 04/18/1991 | WO1991004839A1 Method and device for tensioning a cutting wire in a cutting machine-tool |
| 04/04/1991 | DE3928684A1 Sonotrode Sonotrode |
| 04/03/1991 | EP0419834A1 Device for the cutting of a workpiece by chip removal |
| 03/24/1991 | CA2026432A1 Apparatus for slicing a workpiece |
| 03/21/1991 | WO1991003211A1 Process for producing a tooth crown with the aid of two sonotrodes, device for shaping workpieces using a sonotrode and process for making a sonotrode usable in dental technology |
| 03/20/1991 | EP0417644A2 Method of slicing cylindrical material into wafers |
| 03/19/1991 | US5000156 Method and device for dressing an inner peripheral blade in a slicing machine |
| 02/26/1991 | US4995539 Method and apparatus for cleaving wafers |
| 02/20/1991 | EP0413515A1 A housing for mounting a spindle of an internal diameter saw blade |
| 02/14/1991 | DE3926311A1 Separator for strip mounted switches and electric components - has rotary assembly of several saw blades on common, motor driven shaft |
| 02/12/1991 | US4991475 Method and apparatus for sawing bar-shaped workpieces into slices |
| 02/05/1991 | US4989578 Method for forming diamond cutting elements for a diamond drill bit |
| 02/05/1991 | US4989372 Precision radial arm saw for composite materials |
| 12/26/1990 | CN1048000A Method of and apparatus for cleaving gemstones |
| 12/12/1990 | EP0402230A1 Process and device for marking and cleaving mono-crystalline semiconductor wafers |
| 12/04/1990 | US4974578 In a wafering machine |
| 12/04/1990 | US4974577 Apparatus for collecting wafers |
| 11/22/1990 | EP0398467A2 A slicing and grinding system for a wafer slicing machine |
| 11/14/1990 | EP0396711A1 Abrasion-type splitting unit |
| 11/06/1990 | US4967725 Method and apparatus for manufacturing semiconductor wafers and cutting wire apparatus for use therein |
| 11/06/1990 | US4967461 Method for manufacturing and handling thin wafers |
| 10/10/1990 | EP0391418A1 A diamond for a wire drawing die, dresser or heat-sink, a process for its manufacture, and a wire drawing die made therefrom |
| 10/09/1990 | US4961804 Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same |
| 10/02/1990 | US4960495 Process for precise processing of workpiece using free radicals |
| 09/19/1990 | EP0387660A1 Method for monitoring the cutting of semiconductor material with an internal-hole saw blade and eddy current sensor therefor |
| 09/12/1990 | EP0387130A1 Device for marking the crystal orientation and the rectification of a rod |
| 09/11/1990 | US4955357 Method and apparatus for cutting polycrystalline silicon rods |
| 09/05/1990 | EP0385324A2 Method for cutting rod-shaped work pieces into discs using an internal hole saw, and internal hole saw for this purpose |
| 08/21/1990 | US4950463 Purple diamond and method of producing the same |
| 08/21/1990 | US4949700 Ingot support device in slicing apparatus |
| 08/21/1990 | US4949605 Cutting apparatus with workpiece rotation control |
| 07/31/1990 | US4944121 Coolant supply nozzle apparatus for slicing machine |
| 07/24/1990 | US4942795 Precision cutter with automated pressure control |
| 07/10/1990 | US4940176 Apparatus for cutting workpieces of glass, ceramics, and like material |
| 06/19/1990 | US4934199 Method and apparatus for preparing specimens for destructive testing of graphite epoxy composite material |
| 06/19/1990 | US4934104 Cone tail chuck apparatus, and a method for using the same apparatus |
| 06/12/1990 | US4932389 Slicing apparatus with work-feeding mechanism in feedback control |
| 06/06/1990 | CN1042685A Diamond sawing process |
| 06/05/1990 | US4930486 Blade cutting method for hard brittle material |
| 05/31/1990 | WO1990005624A1 Diamond sawing process |
| 05/29/1990 | US4928432 Rods precision cutting-off and end surface grinding machine |
| 05/17/1990 | WO1990005053A1 Abrasion-type splitting unit |
| 05/09/1990 | EP0367536A2 Rod base material for providing wafers used for electronic devices and a method of manufacturing wafers used for electronic device |
| 05/01/1990 | US4920946 Blade cutting apparatus for hard brittle material |
| 04/18/1990 | EP0363548A1 Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils |
| 04/04/1990 | EP0361802A2 A cone tail chuck apparatus, and a method for using the same apparatus |
| 02/28/1990 | EP0355196A1 Rod cut-off and end surface grinding machine |
| 02/27/1990 | US4903682 Wire saw |
| 02/27/1990 | US4903681 Method and apparatus for cutting a cylindrical material |
| 02/27/1990 | US4903437 Slicing machine for cutting semiconductor material |
| 02/13/1990 | US4899719 Apparatus for collecting wafers |
| 02/07/1990 | EP0353745A2 Method and device for the control of saw balde excursions during the cutting-off of wafers of non-magnetizable work pieces |
| 02/07/1990 | EP0353415A1 Cutting device |
| 01/30/1990 | US4897141 Bonding ingot to cutting beam with epoxy adhesive |
| 01/30/1990 | US4896459 Apparatus for manufacturing thin wafers of hard, non-metallic material such as for use as semiconductor substrates |
| 01/24/1990 | EP0352093A2 Abrading ultra-hard stones |
| 01/23/1990 | US4894956 Apparatus and method for slicing a wafer |
| 01/03/1990 | EP0348783A2 Process of making discrete type substrates |
| 12/26/1989 | US4889588 Plasma etch isotropy control |
| 12/20/1989 | EP0346997A2 Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits |
| 12/12/1989 | CA1263812A1 Mounting beam for preparing wafers |
| 12/07/1989 | DE3917895A1 Processing system for semiconductor wafers |
| 11/29/1989 | EP0343279A1 Internal peripheral edge type blade holding device |
| 11/22/1989 | CN2048014U Semi-automatic multi-shaft drilling machine used for precessing of agate and jade |
| 11/21/1989 | US4881518 Apparatus for manufacturing and handling thin wafers |
| 11/16/1989 | WO1989010825A1 Device for improved sawing of a piece into thin slices |
| 11/15/1989 | EP0341942A2 Cutting brittle materials |
| 11/01/1989 | CN2046801U Hole drilling machine for agate and jade |
| 10/24/1989 | US4875461 Automatic dendritic silicon web separation machine |
| 10/03/1989 | US4871117 Low-contamination method for comminuting solid silicon fragments |
| 09/27/1989 | EP0334751A1 Method and device for cleaving a silicon wafer |
| 09/21/1989 | DE3908153A1 Internally effective cutting disc |
| 09/14/1989 | DE3844520A1 Method and apparatus for splitting up semiconductor ingots into semiconductor wafers with at least one plane surface |