| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 05/18/1999 | US5904136 Wire saw and slicing method thereof |
| 05/11/1999 | US5902171 For enhancing the accuracy of a wafer cut from a work |
| 05/11/1999 | US5901694 To facilitate cuts |
| 05/04/1999 | US5899744 Method of manufacturing semiconductor wafers |
| 04/29/1999 | DE19746533A1 Forming coolant stream for wafer processing during cutting with saw |
| 04/28/1999 | CN1214988A Method for processing through-hole on crystal chip with transparent cover |
| 04/28/1999 | CN1214987A Method for processing through-hole on crystal chip with protective layer |
| 04/27/1999 | US5896851 Wire saw |
| 04/13/1999 | US5893308 Method of positioning work piece and system therefor |
| 04/06/1999 | US5890481 Method and apparatus for cutting diamond |
| 03/31/1999 | CN1212644A Method of cutting blocks of hard substances into plates by means of wire saw, and wire saw for carrying out this method |
| 03/30/1999 | US5888606 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet |
| 03/30/1999 | US5888127 Apparatus to hold and remove an integrated circuit chip on a cutting chuck |
| 03/24/1999 | EP0903210A1 Bar for mounting crystal for sawing and method of wire sawing wafers from crystal |
| 03/23/1999 | US5885051 Workpiece transfer equipment in dicing machine |
| 03/18/1999 | DE19739966A1 Wire saw for slicing shaped bodies from a workpiece |
| 03/09/1999 | US5878737 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 03/02/1999 | US5875770 Method of cutting semiconductor ingots and apparatus for cutting thereof |
| 03/02/1999 | US5875769 Method of slicing semiconductor single crystal ingot |
| 02/24/1999 | EP0897778A1 Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
| 02/24/1999 | CN1209034A Device and method for reducing size of semiconductor material |
| 02/24/1999 | CN1208682A Apparatus and method for machining workpieces |
| 02/17/1999 | EP0897021A1 Process and device for marking gems and product obtained |
| 02/02/1999 | US5865162 Wire saw and work slicing method |
| 01/21/1999 | WO1999002295A2 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 01/21/1999 | DE19729922C1 Method for producing metal-coated diamond thermal conductors |
| 01/12/1999 | US5857454 Wire saw and method of slicing ingot by wire saw |
| 12/30/1998 | EP0887105A1 Device and method for comminution of semiconductive material |
| 12/30/1998 | CN2302108Y Glass carving tool |
| 12/23/1998 | EP0885679A1 wire saw and method of cutting work |
| 12/23/1998 | EP0885083A1 Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method |
| 12/10/1998 | DE19723630A1 Winding of a saw wire onto and off a spool |
| 12/09/1998 | CN1201083A Chip sawing machine |
| 12/08/1998 | US5845630 Process and apparatus for fabricating a semiconductor wafer |
| 12/03/1998 | DE19748055A1 Apparatus for cutting out platelets |
| 12/02/1998 | CN1040955C Method for producing indicia on diamonds |
| 12/01/1998 | US5842462 Method and apparatus to produce a radial cut profile |
| 12/01/1998 | US5842461 Dicing machine |
| 11/26/1998 | WO1998052773A1 Marking diamond |
| 11/26/1998 | CA2291042A1 Marking diamond |
| 11/24/1998 | US5839425 Method for cutting a workpiece with a wire saw |
| 11/24/1998 | US5839424 Process for the orientation of several single crystals disposed side by side on a cutting support for their simultaneous cutting in a cutting machine and device for practicing this process |
| 11/17/1998 | US5836808 Slicing machine with built-in grinder |
| 11/12/1998 | WO1998050209A1 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers |
| 11/10/1998 | US5832914 Method of cutting a semiconductor ingot at a desired cut location |
| 11/03/1998 | US5829658 Method and device for carrying out the cleavage in ultra-high vacuum environment of portions of a processed semiconductor wafer |
| 11/03/1998 | US5829424 Device for wire sawing provided with a system for directing wire permitting use of spools of wire of very great length |
| 10/28/1998 | CN1197284A Pulverizing superpureness silicon on ice |
| 10/27/1998 | US5827113 Cutting machine |
| 10/22/1998 | DE19716374A1 Protecting semiconductor material against contamination |
| 10/14/1998 | CN1196018A Marking diamond |
| 10/13/1998 | US5820006 Apparatus for scribing and/or breaking semiconductor wafers |
| 10/06/1998 | US5817711 Aqueous working liquid composition for wire saw |
| 09/30/1998 | CN1194198A Invisible setting method for jewelry |
| 09/24/1998 | DE19811579A1 cutting crystal blank with wire saw of roller type |
| 09/24/1998 | DE19734243A1 Parting-off slices from workpiece |
| 09/22/1998 | US5810643 Wire saw cutting method synchronizing workpiece feed speed with wire speed |
| 09/22/1998 | US5809987 Apparatus for reducing damage to wafer cutting blades during wafer dicing |
| 09/09/1998 | EP0863231A1 A process for dicing a preform made of an oxide single crystal, and a process for producing functional devices |
| 09/08/1998 | US5803797 Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
| 09/01/1998 | US5799644 Semiconductor single crystal ingot cutting jig |
| 09/01/1998 | US5799643 Slurry managing system and slurry managing method for wire saws |
| 08/12/1998 | CN1190248A Process for producing semiconductor article |
| 08/11/1998 | US5792566 Single crystal wafers |
| 08/05/1998 | EP0856388A2 Method of slicing a workpiece through use of a wire saw, and a wire saw |
| 08/04/1998 | US5787872 Wire sawing device |
| 08/04/1998 | CA2114255C Magnetic transfer device |
| 07/29/1998 | EP0854775A1 Method of machining a thermosetting laminate |
| 07/28/1998 | US5786266 Multi cut wafer saw process |
| 07/28/1998 | US5785225 Frangible semiconductor wafer dicing apparatus which employs scribing and breaking |
| 07/14/1998 | US5778869 Wire saw slicing apparatus and slicing method using the same |
| 07/01/1998 | EP0850737A2 Multistep method of manufacturing semiconductor wafers |
| 06/30/1998 | US5771876 Wire saw for and method of cutting off slices from a workpiece |
| 06/24/1998 | EP0849788A2 Process for producing semiconductor article by making use of a substrate having a porous semiconductor layer |
| 06/24/1998 | CN1185367A Method for cutting ingot and apparatus thereof |
| 06/23/1998 | US5769297 Apparatus and method for dicing semiconductor wafers |
| 06/02/1998 | US5758633 Wire sawing device |
| 05/26/1998 | US5756399 Process for making semiconductor wafer |
| 05/07/1998 | DE19748856A1 Cutting procedure for object to be mechanically machined held on table esp. ceramic wafer, chip |
| 05/06/1998 | EP0839098A1 Marking diamond |
| 05/06/1998 | CN1180726A Sawing suspension and method for cutting wafers from crystal |
| 05/05/1998 | US5747364 Mirror chamfering or etching the periferal portions of the wafers after the non-wax polishing step |
| 05/05/1998 | US5746645 Working a natural or synthetic hard stone such as a gemstone |
| 04/29/1998 | CN1180328A Wire type cutting work apparatus and method therefor |
| 04/22/1998 | EP0837115A1 Slicing slurry and method for cutting wafers from a crystal |
| 04/21/1998 | US5741173 Method and apparatus for machining semiconductor material |
| 04/21/1998 | US5740953 Method and apparatus for cleaving semiconductor wafers |
| 04/14/1998 | US5739048 Method for forming rows of partially separated thin film elements |
| 04/07/1998 | US5736453 Method for dividing plural semiconductor devices formed on single wafer into individual semiconductor devices |
| 04/07/1998 | US5735258 Cutting machine |
| 04/01/1998 | CN2277335Y Frame of gem faceting machine |
| 03/11/1998 | EP0827822A1 Wire type cutting work apparatus and method therefor |
| 03/05/1998 | WO1998008664A1 Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type |
| 02/24/1998 | US5720271 Process for the orientation of single crystals for cutting in a cutting machine and device for practicing this process |
| 02/18/1998 | EP0824144A1 Aqueous working liquid composition for wire saw |
| 02/18/1998 | EP0824056A2 Dicing machine |
| 02/18/1998 | EP0824055A1 Method and apparatus for cutting an ingot |
| 02/18/1998 | CN1173421A Method for mixing and continuous extrusion of polymer materials with dry pre-mixing of material and associated machine |
| 02/17/1998 | US5719077 Fixture and method for laser fabrication by in-situ cleaving of semiconductor bars |
| 02/17/1998 | US5718615 Semiconductor wafer dicing method |