| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
|---|
| 08/26/1980 | US4219199 Molybdenum insoluble in hydrogen peroxide |
| 08/19/1980 | CA1084172A1 Process for slicing boules of single crystal material |
| 07/23/1980 | EP0013327A1 Punching device for thin plate-shaped workpieces |
| 07/22/1980 | US4213698 Apparatus and method for holding and planarizing thin workpieces |
| 07/08/1980 | US4211040 Process for machining silicon rods and tubes by abrasion |
| 06/24/1980 | US4209129 Cooling manifold for multiple solenoid operated punching apparatus |
| 06/24/1980 | US4209005 Apparatus for cutting silicon having a pivoted work carriage utilizing an air bearing |
| 05/27/1980 | US4204515 Apparatus for machining workpieces by abrasion |
| 05/27/1980 | CA1078531A1 Device for taking-off slices |
| 04/01/1980 | US4195758 Apparatus for separating snapstrates into individual hybrid substrates |
| 03/18/1980 | US4193783 Method of treating a silicon single crystal ingot |
| 03/04/1980 | US4191159 System for slicing silicon wafers |
| 02/19/1980 | US4188936 Method for increasing the cutting performance of reciprocating slurry saws and a reciprocating slurry saw for carrying out this method |
| 02/12/1980 | US4187828 Cutting |
| 02/12/1980 | US4187827 Process for multiple lap cutting of solid materials |
| 01/22/1980 | US4184472 Method and apparatus for slicing crystals |
| 01/09/1980 | EP0006827A1 Method of working polycristalline synthetic diamond |
| 12/25/1979 | US4180048 For dicing semiconductor wafers |
| 12/25/1979 | CA1068793A Method and apparatus for cutting insulating material |
| 12/18/1979 | US4178670 Process of forming a wire pack |
| 09/11/1979 | US4167174 Method and apparatus for aligning the streets of a semiconductor wafer |
| 09/04/1979 | US4166574 Apparatus for marking identification symbols on wafer |
| 07/17/1979 | US4161167 Lap cutting blades |
| 07/10/1979 | US4160439 Cutting-off machine for hard bodies |
| 06/05/1979 | CA1055907A1 Snapping of sheets of glass |
| 05/15/1979 | US4154025 Method for preparing oxide piezoelectric material wafers |
| 05/08/1979 | US4153662 Casting in a contoured vulcanized mold |
| 04/24/1979 | US4150912 Twin blade mounting and tensioning apparatus |
| 04/24/1979 | CA1053383A1 Semiconductor wafer dicing fixture |
| 04/04/1979 | EP0001326A1 A rotatable sleeve for guiding a web of wire strands |
| 03/27/1979 | US4146262 Device for taking-off slices |
| 02/20/1979 | US4140260 System for separating a semiconductor wafer with discrete pellets |
| 02/06/1979 | US4138304 Semiconductors, pelletization |
| 01/16/1979 | US4134384 Wire saw with rotatable guide sleeve |
| 12/26/1978 | US4131267 Apparatus for holding workpiece by suction |
| 12/05/1978 | US4127969 Method of making a semiconductor wafer |
| 10/17/1978 | CA1040748A1 Apparatus and method for orienting monocrystalline material for sawing |
| 08/08/1978 | US4105012 Apparatus for cutting up hard and brittle material |
| 06/06/1978 | US4092972 Process of cutting wafers |
| 06/06/1978 | US4092971 Self-contained, multi-blade package for slurry saws and the like |
| 04/18/1978 | US4084354 Process for slicing boules of single crystal material |
| 04/11/1978 | US4083352 Method for cutting ornamental transparent gemstones and products produced therefrom |
| 04/11/1978 | US4083351 Fluted diamond drill |
| 02/28/1978 | US4076007 Gemstone drill |
| 01/24/1978 | US4069805 Wire apparatus for abrasive powder machining |
| 01/17/1978 | US4068788 Method for cracking brittle material |
| 12/20/1977 | US4063482 Machine tool indexing mechanism |
| 11/15/1977 | US4058223 Article handling device |
| 10/04/1977 | US4052584 Method and apparatus for cutting insulating material |
| 10/04/1977 | US4052132 Method and apparatus for drilling fine holes in frangible workpieces |
| 09/13/1977 | US4047828 Core drill |
| 08/30/1977 | US4044937 Multiple ball element wafer breaking apparatus |
| 07/26/1977 | US4037830 Wafer handler |
| 04/12/1977 | US4016855 Grinding method |
| 01/11/1977 | US4002410 Apparatus and method for orienting monocrystalline material for sawing |
| 08/24/1976 | US3976288 Semiconductor wafer dicing fixture |
| 07/20/1976 | US3970819 Backside laser dicing system |
| 07/13/1976 | US3969004 Air bearing piston assembly for semiconductor mask-to-wafer aligner |
| 05/25/1976 | US3958733 Method for simultaneously breaking a plurality of frangible sheets |
| 05/18/1976 | US3957028 Wire-type cutting machine |
| 05/04/1976 | US3954096 Method of working, forming and finishing single crystals |
| 03/09/1976 | US3942508 Wire-saw |