| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 07/10/1996 | EP0720521A1 Apparatus and method for dicing semiconductor wafers |
| 07/10/1996 | CN2230654Y Precious Stone binder |
| 06/25/1996 | US5529051 Method of preparing silicon wafers |
| 06/19/1996 | EP0716910A2 Multi-wire saw device, slice method using the same and cassette for housing a wafer sliced with the same |
| 06/19/1996 | EP0716899A1 Laser finishing and measurement of diamond surfaces |
| 06/18/1996 | US5527744 Wafer method for breaking a semiconductor |
| 06/11/1996 | US5524604 Method and apparatus for slicing semiconductor wafers |
| 06/05/1996 | EP0715341A1 Method of preventing a transfer of adhesive substance to a ring frame in a dicing process, pressure-sensitive adhesive sheet and wafer support comprising said pressure-sensitive adhesive sheet |
| 05/22/1996 | EP0712677A1 Wire sawing device with monobloc frame |
| 05/15/1996 | CN1122518A Method for formjing rows of partially separated thin film elements |
| 05/07/1996 | US5514025 Apparatus and method for chamfering the peripheral edge of a wafer to specular finish |
| 04/17/1996 | EP0444182B1 Process for producing a tooth crown with the aid of two sonotrodes |
| 04/11/1996 | WO1996010470A1 Wire saw |
| 04/02/1996 | US5504303 For measuring and ablating the surface of a hard material |
| 03/20/1996 | CN1118732A Producing method for silicon crystal unit |
| 02/27/1996 | US5494698 Teflon filled resinoid dicing blades for fabricating silicon die modules |
| 02/27/1996 | US5494549 Dicing method |
| 02/13/1996 | US5490810 Process and device for manufacturing a structural part, especially of a ceramic tooth restoration, and a process of making sonotrode crowns |
| 02/01/1996 | WO1996002362A1 Apparatus and method for dicing semiconductor wafers |
| 02/01/1996 | DE19526711A1 Silicon@ wafer mfr. for VLSI mfr. |
| 01/31/1996 | EP0694366A1 Wire saw apparatus |
| 01/18/1996 | DE4425091A1 Method of to breaking ceramic tile material |
| 01/16/1996 | US5484326 Semiconductor ingot machining method |
| 01/11/1996 | DE4425879A1 Scoring system for separating components is essentially single crystal substrates |
| 01/10/1996 | EP0599937B1 Method and apparatus for cleaving semiconductor wafers |
| 01/09/1996 | US5483038 Method of working diamond with ultraviolet light |
| 01/09/1996 | US5482899 Leveling block for semiconductor demounter |
| 01/03/1996 | EP0689891A1 A roller |
| 12/20/1995 | CN2215399Y Machine for working round and arc oilstone |
| 12/13/1995 | EP0686684A1 Slicing slurry |
| 12/07/1995 | CA2150856A1 Sawing suspension |
| 12/06/1995 | EP0685838A2 Method of producing thin film elements |
| 11/23/1995 | DE19517107A1 Workpiece positioning method for e.g. semiconductor wafer cutting process |
| 11/14/1995 | US5465892 Method and apparatus for cutting plate-shaped brittle material |
| 11/07/1995 | US5464159 Method for the contamination-free size reduction of semiconductor material, especially silicon |
| 10/31/1995 | US5462474 Method of facetting a gem |
| 10/25/1995 | EP0678904A1 Multicut wafer saw process |
| 10/17/1995 | US5458526 Method of slicing a semiconductor wafer and an apparatus |
| 10/17/1995 | US5458269 Frangible semiconductor wafer dicing method which employs scribing and breaking |
| 10/11/1995 | EP0676253A1 A chamfered hub blade |
| 10/11/1995 | CN2209585Y Perforating locator for jade buttons |
| 10/10/1995 | US5456147 Precision cutter saw |
| 09/28/1995 | DE4409748A1 Method of separating material for use in laboratories |
| 09/19/1995 | US5451549 Semiconductor dicing method which uses variable sawing speeds |
| 08/29/1995 | US5445559 Wafer-like processing after sawing DMDs |
| 08/08/1995 | US5439723 Substrate for producing semiconductor wafer |
| 08/02/1995 | EP0665083A1 Improvement relating to cutting |
| 08/01/1995 | US5437215 Ultrasonic cutting device |
| 07/20/1995 | WO1995019247A1 Method and apparatus for scribing and/or breaking semiconductor wafers |
| 06/28/1995 | CN1104341A Wafer-like processing after sawing dmds |
| 06/27/1995 | US5427644 Method of manufacturing semiconductor wafer and system therefor |
| 06/14/1995 | EP0657759A2 Wafer-like processing after sawing DMDS |
| 06/14/1995 | CA2137843A1 Working a natural or synthetic hard stone such as a gemstone |
| 06/13/1995 | CA1335902C Cutting brittle materials |
| 05/23/1995 | US5418190 Method of fabrication for electro-optical devices |
| 05/17/1995 | EP0653395A1 Ceramic sintered body and method of processing surface of body |
| 05/10/1995 | EP0651693A1 Method and apparatus for separating circuit dies from a wafer |
| 05/09/1995 | US5413521 Inner diameter saw slicing machine |
| 04/25/1995 | US5410125 Methods for producing indicia on diamonds |
| 04/11/1995 | CA1335172C Cutting |
| 03/21/1995 | US5398857 Method and apparatus for cutting plate-shaped brittle material |
| 02/28/1995 | US5393707 Semiconductor - slice cleaving |
| 02/28/1995 | US5393706 Integrated partial sawing process |
| 02/28/1995 | US5392758 Bracing device for the blades of a saw mill, saw mill using a device of this type |
| 02/21/1995 | US5391036 Magnetic transfer device |
| 02/07/1995 | US5387776 Method of separation of pieces from super hard material by partial laser cut and pressure cleavage |
| 01/24/1995 | US5383444 For cutting a workpiece into slices |
| 01/11/1995 | EP0633086A1 Inner diameter saw slicing machine |
| 01/03/1995 | US5377568 Device for controlling the cutting geometry of fine slices obtained by thread sawing |
| 12/25/1994 | CA2126111A1 Wafer-like processing after sawing dmds |
| 12/20/1994 | US5374564 Process for the production of thin semiconductor material films |
| 12/08/1994 | WO1994027930A1 Ceramic sintered body and method of processing surface of body |
| 11/29/1994 | US5369060 Method for dicing composite wafers |
| 11/17/1994 | EP0624423A2 Method of separation of pieces from super hard material |
| 11/08/1994 | US5362681 Method for separating circuit dies from a wafer |
| 10/25/1994 | US5358590 Method of manufacturing individual element arrays |
| 10/18/1994 | CA2001934C Rod assembly for manufacturing large wafers for electronic devices |
| 10/04/1994 | US5351446 Method and apparatus for the rotary sawing of brittle and hard materials |
| 09/21/1994 | EP0615824A1 Magnetic transfer device |
| 09/14/1994 | CN1092013A Method of splitting ceramic substrate and splitting device |
| 09/07/1994 | EP0613765A1 Method for the manufacture of subdividable tiles from a brittle material and device for fixing and grinding the edges of the tiles |
| 08/17/1994 | EP0610967A2 Slicing machine |
| 08/17/1994 | EP0610657A2 Integrated partial sawing process |
| 08/17/1994 | EP0610563A2 Semiconductor ingot machining method |
| 07/26/1994 | US5332406 Apparatus for producing semiconductor device |
| 07/19/1994 | US5329733 Wafer slicing and grinding machine and a method of slicing and grinding wafers |
| 07/05/1994 | US5325840 Watch crystal cutting machine |
| 06/29/1994 | EP0604061A1 Semiconductor fabrication |
| 06/16/1994 | DE4342078A1 Ultrasonic machining sonotrode mfg. system for dental prosthesis mfr - uses negative mould of ultrasonic sonotrode crown to mfr. machining sonotrode |
| 06/14/1994 | US5321303 Semiconductor device having linearly arranged semiconductor chips |
| 06/08/1994 | EP0599937A1 Method and apparatus for cleaving semiconductor wafers. |
| 05/24/1994 | US5314844 Forming a groove in parallel to the crystal plane by grinding-cutting, breaking along the scribe line and the groove |
| 05/24/1994 | US5313742 Highly rigid composite shaped abrasive cutting wheel |
| 05/24/1994 | US5313741 Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein |
| 05/10/1994 | US5310104 Method and apparatus for cleaving a semiconductor wafer into individual die and providing for low stress die removal |
| 04/19/1994 | US5303687 Blade mount for an inner diameter saw blade |
| 03/31/1994 | DE4332065A1 Ceramic tooth prosthesis mfg system - using ultrasonic machining process with two successively activated profiled sonotrode crowns |
| 03/23/1994 | EP0588681A1 Method for cutting a wafer hard to cut |
| 03/02/1994 | EP0584670A1 Ultrasonic cutting device |
| 03/01/1994 | CA2104428A1 Cutting device |