| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/18/1986 | US4576139 Rigid wire saw wheel apparatus for very hard materials |
| 03/11/1986 | US4574769 Multi-wire vibratory cutting method and apparatus |
| 02/25/1986 | US4572886 Optical method for integrated circuit bar identification |
| 02/18/1986 | US4571486 Heating method of semiconductor wafer |
| 02/11/1986 | US4569326 Dicing apparatus |
| 02/04/1986 | US4567797 Ultrasonic cutting apparatus and methods |
| 01/21/1986 | US4565913 Method for the disintegration of silicon for semiconductor |
| 01/14/1986 | US4564494 Encapsulant of CdTe boules for multiblade wafering |
| 01/14/1986 | US4564000 Precision cutting of millimeter wave ferrite materials |
| 01/02/1986 | EP0166064A1 Cutting machine with measuring device and utilization of this measuring device |
| 12/10/1985 | US4557244 Method of machine cutting silicon metal particulates with Si3 N4 |
| 10/24/1985 | WO1985004617A1 METHOD OF MACHINE CUTTING SILICON METAL PARTICULATES WITH Si3N4 |
| 09/24/1985 | US4543464 Apparatus for scribing semiconductor wafer with laser beam |
| 09/10/1985 | US4539972 Method for the multiple lap-cutting of crystal blocks with continuous shortening of the blade excursion |
| 08/27/1985 | US4537177 Balanced rotary saw assembly and a method of balancing the same |
| 06/26/1985 | EP0146197A2 Removal of semiconductor wafers from dicing film |
| 06/11/1985 | US4522679 Apparatus for sticking adhesive film on a ring and a thin article |
| 05/02/1985 | EP0139067A1 Method of and device for testing the initial tensions of an annular cutting-off wheel |
| 04/30/1985 | US4513544 Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method |
| 03/20/1985 | EP0134606A2 Carrier film with conductive adhesive for dicing of semiconductor wafers |
| 03/05/1985 | US4502459 Control of internal diameter saw blade tension in situ |
| 03/05/1985 | US4502225 Mechanical scriber for semiconductor devices |
| 02/26/1985 | US4501258 Kerf loss reduction in internal diameter sawing |
| 02/12/1985 | US4498451 Cutting articles along known planes |
| 02/12/1985 | US4498345 Method for measuring saw blade flexure |
| 01/29/1985 | US4495871 Table sliding apparatus |
| 01/29/1985 | US4495732 Semiconductor wafer sectioning machine |
| 01/23/1985 | EP0131809A1 Dicing apparatus |
| 01/22/1985 | US4494523 Wire saw |
| 01/02/1985 | EP0129732A1 Wafer transferring chuck assembly |
| 12/25/1984 | US4490441 Encapsulated CDTe boules for multiblade wafering |
| 12/18/1984 | US4488930 Process for producing circular gallium arsenide wafer |
| 11/27/1984 | US4484502 Wire saw |
| 11/27/1984 | US4484412 Method and apparatus for cutting hard and brittle material using system for applying vibration in two directions |
| 11/07/1984 | EP0124306A1 A balanced rotary saw assembly and a method of balancing the same |
| 11/06/1984 | CA1177584A1 Process and apparatus for supporting crystalline wafers |
| 10/09/1984 | US4475527 Ingot slicing machine and method |
| 09/04/1984 | US4469500 Method of cleaving a crystal to produce a high optical quality corner |
| 08/14/1984 | US4465550 Method and apparatus for slicing semiconductor ingots |
| 05/01/1984 | US4445494 Apparatus for supporting crystalline wafers |
| 05/01/1984 | US4445413 Slicing cutter blade |
| 04/10/1984 | US4442178 Silicon on sapphire |
| 01/18/1984 | EP0098575A1 Support with actuating means for applying a torque to threaded bolts |
| 01/17/1984 | US4425769 Applying photoresist and photographic film, development, then removal and cathode bombardment |
| 12/20/1983 | US4420909 Wafering system |
| 11/29/1983 | CA1157635A1 Method of manufacturing a pernament magnet which is to be arranged in an air gap of a transformer core |
| 11/16/1983 | EP0094213A1 A balanced rotary saw blade assembly and a method for balancing the same |
| 11/09/1983 | EP0093406A1 Method of sawing crystal bars and plural-blade saw with annular members for carrying out this method |
| 10/18/1983 | US4410168 Apparatus for manipulating a stretched resilient diaphragm |
| 10/11/1983 | US4409075 Method for cutting a semiconductor crystal into wafers |
| 10/04/1983 | US4407262 Wafer dicing apparatus |
| 09/21/1983 | EP0088902A2 Wire saw |
| 08/30/1983 | US4401876 Working gemstones |
| 08/09/1983 | CA1151500A1 Mechanically polishing semi-conductor wafers with silica sols and products useful therefor |
| 06/14/1983 | US4387698 Slurry saw blade head assembly |
| 06/08/1983 | EP0080765A1 Method and device for subdividing ceramic plates |
| 06/07/1983 | US4387287 Method for a shaping of polycrystalline synthetic diamond |
| 05/25/1983 | EP0079744A2 Clutch assembly for removing a severed wafer from an ingot |
| 01/25/1983 | US4369567 Method of manufacturing a permanent magnet which is to be arranged in an air gap of a transformer core |
| 11/17/1982 | EP0064780A1 Process for treating a gem, and gem so treated |
| 11/02/1982 | US4356944 Method and apparatus for breaking prescored ceramic substrate plates |
| 10/12/1982 | USRE31053 Apparatus and method for holding and planarizing thin workpieces |
| 10/05/1982 | US4352446 Substrate separating machine and method |
| 09/14/1982 | US4349178 Wire blades |
| 08/17/1982 | US4344260 Method for precision shaping of wafer materials |
| 08/10/1982 | US4343662 Manufacturing semiconductor wafer devices by simultaneous slicing and etching |
| 08/10/1982 | US4343287 Crystal cleaving machine |
| 05/25/1982 | US4331452 Apparatus for crystal shaping |
| 05/25/1982 | US4330915 Technique for uniform stylus configuration |
| 05/04/1982 | US4328553 Method and apparatus for targetless wafer alignment |
| 04/27/1982 | US4326494 Wafer and boule protection during the blade return stroke of a wafer saw |
| 04/07/1982 | EP0048995A2 Method of picking up crystal disks |
| 04/06/1982 | US4323050 Machine for cutting precious stones |
| 04/06/1982 | US4323049 Quartz wafering machine |
| 03/16/1982 | CA1119811A1 Cutting apparatus for semi-conductor materials |
| 02/23/1982 | US4316757 Vacuum |
| 02/10/1982 | EP0045446A1 Process for dividing a single semiconductor crystal into wafers |
| 10/27/1981 | US4296542 Control of small parts in a manufacturing operation |
| 09/16/1981 | EP0035963A1 Apparatus for sawing disk-like material |
| 09/08/1981 | US4287869 Charging system for cutting blade |
| 09/01/1981 | US4287256 Wafer and boule protection during the blade return stroke of a wafer saw |
| 08/18/1981 | CA1107152A1 Cooling manifold for multiple solenoid operated punching apparatus |
| 06/23/1981 | US4274389 Cutting apparatus for semi-conductor materials |
| 06/23/1981 | CA1103558A1 Wire blades |
| 04/14/1981 | US4261781 Process for forming compound semiconductor bodies |
| 04/01/1981 | EP0026014A1 Method of manufacturing a permanent magnet assembly which is to be arranged in an air gap of a transformer core |
| 03/17/1981 | US4256079 Wire blades |
| 02/03/1981 | US4248369 Laser cutting of ceramic tubing |
| 01/27/1981 | US4247031 Method for cracking and separating pellets formed on a wafer |
| 01/20/1981 | US4246003 Lap cutting abrasive |
| 01/13/1981 | US4244348 Process for cleaving crystalline materials |
| 12/23/1980 | US4240311 Quartz crystal resonator |
| 11/25/1980 | US4235357 Substrate separating machine and method |
| 10/21/1980 | US4228937 Cleaving apparatus |
| 10/21/1980 | US4228782 System for regulating the applied blade-to-boule force during the slicing of wafers |
| 10/21/1980 | US4228578 Method for off-orientation point rotation sawing of crystalline rod material |
| 10/14/1980 | US4227348 Method of slicing a wafer |
| 10/14/1980 | US4227347 Two motor drive for a wafer processing machine |
| 09/17/1980 | EP0015423A1 Device for splitting hard, brittle material, especially semi-conductor material |
| 09/03/1980 | EP0014824A1 Process for making a composite semiconductor body and semiconductor body so produced |