Patents
Sitemap › B28 - Working cement, clay, or stone › B28D - Working stone or stone-like materials › B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
12/2003
12/17/2003EP1371467A1 Wire saw and method of slicing a cylindrical workpiece
12/17/2003EP1371438A1 Superabrasive wire saw and method for making it
12/16/2003US6662799 Vertical wafer sawing apparatus
12/11/2003WO2003101695A2 Machining apparatus and methods
12/11/2003WO2003083186A3 Laser diamond blocking machine for faceting the bottom of a diamond
12/11/2003US20030226832 Scribing sapphire substrates with a solid state UV laser
12/11/2003US20030226830 Scribing sapphire substrates with a solid state UV laser
12/10/2003EP1368172A1 Method and apparatus for cutting workpieces
12/10/2003CN1460574A Slurry cyclic method
12/10/2003CN1130273C Supergrinding wheel with active bonding agent
12/09/2003US6660963 Method and apparatus for separating non-metallic materials
12/09/2003US6659843 Substrate dicing method
12/03/2003EP1365930A2 Mounting and preparing a gemstone or industrial diamond for the formation of a mark on the surface thereof
12/02/2003US6656029 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
11/2003
11/27/2003US20030220055 Slurry recycling method
11/25/2003US6653210 Method and apparatus for cutting a non-metallic substrate using a laser beam
11/25/2003US6652356 Wire saw and cutting method
11/20/2003WO2003095169A1 Bi-directional singulation saw system and method
11/20/2003WO2003095139A1 Finishing machine using laser beam
11/19/2003EP1361961A2 Forming a mark on a gemstone or industrial diamond
11/13/2003US20030211707 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
11/13/2003US20030209528 Laser cutting apparatus and method
11/12/2003EP1062068B1 Superabrasive wire saw and method for making the saw
11/12/2003CN1455271A Method of cutting workpiece of film filter
11/06/2003US20030205221 Method for cutting thin film filter work pieces
11/06/2003US20030205119 Work cutting apparatus and method for cutting work
11/05/2003CN2584388Y Chip cutting machine
11/05/2003CN1126639C Method for grinding semiconductor chip
11/04/2003US6641381 Wafer dicing blade consisting of multiple layers
11/04/2003US6640796 Method for separating slices from a hard brittle workpiece, and wire saw for carrying out the method
10/2003
10/30/2003WO2003004210B1 Method of ablating an opening in a hard, non-metallic substrate
10/30/2003US20030203547 Process for producing semiconductor article
10/30/2003US20030203538 Method and apparatus for cutting semiconductor wafers
10/30/2003US20030200855 System for singulating semiconductor components utilizing alignment pins
10/28/2003US6638791 Techniques for maintaining alignment of cut dies during substrate dicing
10/23/2003US20030199165 System and method for the manufacture of surgical blades
10/21/2003US6635848 Method and device for cutting flat work pieces of a brittle material
10/16/2003US20030194864 Use of a U-groove as an alternative to using a V-groove for protecting silicon against dicing induced damage
10/14/2003US6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions
10/09/2003WO2003083186A2 Laser diamond blocking machine for faceting the bottom of a diamond
10/09/2003WO2003082542A1 Parting method for fragile material substrate and parting device using the method
10/09/2003WO2003082523A1 Fluid mixing device and cutting device
10/09/2003US20030188613 Blade assembly cover
10/07/2003US6629484 Cutter wheel for brittle sheets
10/02/2003US20030183162 Polycrystalline silicon rod and method of processing the same
09/2003
09/25/2003WO2003078091A1 System and method for the manufacture of surgical blades
09/25/2003US20030181023 Method of processing silicon single crystal ingot
09/25/2003CA2478329A1 System and method for the manufacture of surgical blades
09/24/2003EP1001006B1 Aqueous composition, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid
09/18/2003WO2003076152A1 Method and apparatus for slicing semiconductor wafers
09/18/2003WO2003076120A1 Laser processing method
09/18/2003WO2003076119A1 Method of cutting processed object
09/18/2003WO2003076118A1 Semiconductor substrate, semiconductor chip, and semiconductor device manufacturing method
09/18/2003WO2003010101A3 Method for breaking a cut workpiece
09/16/2003US6620028 Apparatus for cutting a wafer
09/12/2003WO2003075331A1 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
09/12/2003WO2003074229A1 Method of cutting rare earth alloy
09/11/2003US20030170948 Method and apparatus for slicing semiconductor wafers
09/10/2003EP1341730A1 Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone
09/10/2003CN1441040A Water-base cutting liquid, its producing method, and cutting method using sach cutting liquid
09/09/2003US6615817 Recycling system of wire saw abrasive grain slurry and centrifugal separators therefor
09/04/2003WO2003072329A1 Automated control of wafer slicing process
09/04/2003WO2003010102B1 Cutting method for brittle non-metallic materials (two variants)
09/03/2003CN1439495A Method for accurate-oriented cutting crystals
09/02/2003US6612906 Vibratory material removal system and method
08/2003
08/28/2003WO2003071591A1 Method for dividing semiconductor wafer
08/28/2003WO2003070441A1 A novel laser diamond sawing machine
08/27/2003EP1338371A1 Laser beam machining method and laser beam machining device
08/26/2003US6609965 Cutting blade
08/21/2003WO2003068471A1 Laser machine for examination, planning and marking raw diamond
08/21/2003WO2003068450A2 Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
08/21/2003US20030157784 Process and apparatus to subdivide objects
08/20/2003CN1436642A Device for cutting liquid crystal display screen and method for cutting by the same device
08/20/2003CN1118837C Method for cutting rare earth alloy with scroll saw and method for producing rare earth alloy plate
08/19/2003US6608359 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
08/19/2003US6606985 Dual-cutting method devoid of useless strokes
08/14/2003US20030153247 Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
08/13/2003CN1435291A Method and device for cutting non-metal substrate
08/12/2003US6605798 Cutting of ultra-hard materials
08/12/2003US6604382 New-cut diamond shape
08/07/2003WO2003065430A1 Method of processing semiconductor wafer
08/07/2003US20030147035 Device for cutting liquid crystal display panel and method for cutting using the same
08/07/2003US20030146197 Method and apparatus for cutting nonmetallic substrate
08/07/2003US20030145844 Multiwire saw with improved bearing
08/07/2003US20030145707 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire
08/06/2003EP1332247A1 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation
07/2003
07/31/2003WO2002025706A3 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
07/30/2003EP1144160B1 Superabrasive wheel with active bond
07/30/2003CN1433488A Polycrystalline silicon rod and method for processing the same
07/29/2003US6600213 Semiconductor structure and package including a chip having chamfered edges
07/24/2003WO2003059591A1 Device for cutting a substrate layer, and corresponding method
07/24/2003WO2003059590A1 Device for cutting a substrate layer, and corresponding method
07/24/2003WO2003011793A3 Method for manufacturing sintered magnet
07/24/2003WO2002055246A3 Coated saw blade
07/24/2003WO1999046077A3 Superabrasive wire saw and method for making the saw
07/24/2003US20030136394 Dicing saw having an annularly supported dicing blade
07/24/2003EP1062068A3 Superabrasive wire saw and method for making the saw
07/23/2003EP1242322B1 Method and device for cutting flat work pieces made of a brittle material
07/22/2003US6596088 On a semiconductor wafer, ring cutting, cleaning with water jets
07/22/2003US6595094 Working cutting apparatus and method for cutting work
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