| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 08/29/2002 | WO2002067295A1 Method and device for separating a semiconductor wafer from a carrier |
| 08/29/2002 | WO2002066263A2 Mounting and preparing a gemstone or industrial diamond for the formation of a mark on the surface thereof |
| 08/29/2002 | WO2002066262A2 Forming a mark on a gemstone or industrial diamond |
| 08/29/2002 | DE10108369A1 Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger Method and apparatus for peeling a semiconductor wafer from a carrier |
| 08/27/2002 | US6441504 Precision aligned and marked structure |
| 08/22/2002 | US20020115390 Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| 08/21/2002 | EP1232038A1 Method and apparatus for separating non-metallic materials |
| 08/21/2002 | CN2506815Y Loop shape swing device for hole enlarging motor |
| 08/15/2002 | US20020108398 Diamond etching |
| 08/15/2002 | US20020108260 Thermo-mechanical breaking of round, elliptical or annular shaped bodies |
| 08/08/2002 | US20020104422 Dual-cutting method devoid of useless strokes |
| 08/07/2002 | CN1362627A Method for cutting mother-material bar-shape lens and lens group-block for holding same |
| 08/06/2002 | US6428393 Method of providing semiconductor wafers each having a plurality of bumps exposed from its resin coating |
| 08/06/2002 | US6427676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 08/01/2002 | WO2002058903A1 Method and apparatus for cutting workpieces |
| 08/01/2002 | US20020100354 Wire sawing device |
| 08/01/2002 | DE10103592A1 Anordnung zur Einspannung und Bewegung von Wenigstens einem Trennbauteil für das Zerteilen von Materialien Arrangement for clamping and movement of at least one component separation for the cutting of materials |
| 07/25/2002 | WO2002057192A1 Separator and separating system |
| 07/25/2002 | US20020096167 Diamond cutting method, enneahedral-cut diamonds and assembly of enneahedral-cut diamonds |
| 07/25/2002 | US20020096165 Method and apparatus for cutting workpieces |
| 07/24/2002 | EP1224067A1 Device and method for separating materials |
| 07/23/2002 | US6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/23/2002 | US6422793 Separating means for producing a thin-film solar module |
| 07/23/2002 | US6422227 Dicing apparatus, kerf inspecting method and kerf inspecting system |
| 07/23/2002 | US6422067 Slurry useful for wire-saw slicing and evaluation of slurry |
| 07/18/2002 | WO2002055246A2 Coated saw blade |
| 07/16/2002 | US6421456 Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks |
| 07/16/2002 | US6420245 Method for singulating semiconductor wafers |
| 07/16/2002 | US6418921 Method and apparatus for cutting workpieces |
| 07/11/2002 | US20020088450 Diamond cutting method and new-cut diamond shape |
| 07/10/2002 | EP1220739A1 Method and device for isolating plate-like substrates |
| 07/04/2002 | US20020085746 Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks |
| 07/04/2002 | US20020083938 Techniques for dicing substrates during integrated circuit fabrication |
| 07/03/2002 | EP1219397A1 Method and apparatus for loading, unloading and transferring semiconductor bars |
| 07/03/2002 | EP1219383A2 Method for cutting a mother rod lens and lens block for supporting mother rod lens |
| 07/03/2002 | CN1356194A Method for cutting off rare-earth alloy, process for preparing rare-earth magnet and fret saw |
| 07/02/2002 | US6413150 Dual dicing saw blade assembly and process for separating devices arrayed a substrate |
| 07/02/2002 | US6412377 Method for maintaining a cutting blade centered in a kerf |
| 06/27/2002 | US20020081776 Of aluminum metallization layer; installing a dicing blade having a sacrificial anode, flooding the work surface with cooling high purity water solution, dicing the wafer |
| 06/27/2002 | US20020078806 Method for cutting mother rod lens and lens block for supporting mother rod lens |
| 06/27/2002 | CA2366176A1 Method for cutting mother rod lens and lens block for supporting mother rod lens |
| 06/25/2002 | US6408840 Method and apparatus for cutting a rare earth alloy |
| 06/25/2002 | US6408839 Wire sawing device for cutting fine slices using angular crossing of at least two sawing yarn layers |
| 06/20/2002 | WO2002048059A1 Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone |
| 06/20/2002 | US20020077043 Wafer dicing blade consisting of multiple layers |
| 06/19/2002 | CN2495400Y Diamond drill bit with edges |
| 06/18/2002 | US6407360 Laser cutting apparatus and method |
| 06/18/2002 | US6406357 Grinding method, semiconductor device and method of manufacturing semiconductor device |
| 06/12/2002 | CN1086164C 超声波振动刀具 Ultrasonic vibration tool |
| 06/11/2002 | US6401580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/05/2002 | EP1054748B1 Wire sawing device for cutting fine slices using angular crossing of at least two sawing yarn layers |
| 06/04/2002 | US6397832 Diamond cutting method and new-cut diamond shape |
| 05/30/2002 | US20020063115 Vertical wafer sawing apparatus |
| 05/29/2002 | DE10157433A1 Process for cutting a rare earth metal alloy used in the production of rare earth metal magnets comprises using a wire with abrasive grains to cut the alloy in such a way that one section of the alloy is immersed in water |
| 05/23/2002 | DE10055286A1 Monocrystal separating device based on annular sawing has device to supply gas to cutting disk |
| 05/21/2002 | US6390896 Method and device for cutting a multiplicity of disks from a hard brittle workpiece |
| 05/21/2002 | US6390889 Holding strip for a semiconductor ingot |
| 05/16/2002 | WO2002038349A1 Device and method for separating materials |
| 05/14/2002 | US6386948 Magnet member cutting method and magnet member cutting |
| 05/14/2002 | US6386466 Cleaning apparatus |
| 05/14/2002 | US6386191 CSP plate holder |
| 05/09/2002 | US20020053586 Dicing machine |
| 05/09/2002 | US20020053137 Method and apparatus for manufacturing slider |
| 05/08/2002 | DE10052154A1 Verfahren und Vorrichtung zum Trennen von Einkristallen, Justiervorrichtung und Testverfahren zum Ermitteln einer Orientierung eines Einkristalls für ein derartiges Verfahren Method and apparatus for separating crystals, adjusting and testing method for determining an orientation of a single crystal for such a method |
| 05/07/2002 | US6381830 Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| 05/02/2002 | WO2002034973A1 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 05/01/2002 | CN1347139A Method and device for mfg. electronic parts |
| 04/23/2002 | US6374820 Manufacturing method for monolithic ceramic part and cutting device for ceramic laminate |
| 04/23/2002 | US6374479 Method and apparatus for manufacturing slider |
| 04/18/2002 | US20020045414 Cutting machine |
| 04/18/2002 | US20020043707 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| 04/17/2002 | EP0983152B1 Marking diamond |
| 04/17/2002 | CN1082865C Method and device for cutting ingot |
| 04/16/2002 | US6371840 Method and apparatus for processing a planar structure |
| 04/16/2002 | US6371102 Device for cutting interconnected rectangular plate-shaped workpieces into a plurality or individual rectangular units |
| 04/16/2002 | US6371101 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers |
| 04/16/2002 | US6371100 Machining apparatus capable of saving different fluids in machining |
| 04/09/2002 | US6367467 Holding unit for semiconductor wafer sawing |
| 04/04/2002 | WO2002026431A1 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire |
| 04/03/2002 | EP1193738A2 Method and apparatus for manufacturing chips |
| 04/02/2002 | US6363745 Cut cornered square mixed-cut gemstone |
| 03/28/2002 | WO2002025706A2 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers |
| 03/28/2002 | WO2001091981A9 Wire saw and process for slicing multiple semiconductor ingots |
| 03/28/2002 | US20020035782 Method and apparatus for manufacturing electronic parts |
| 03/26/2002 | US6361404 Precision cutting apparatus and cutting method using the same |
| 03/26/2002 | US6360755 Method for processing semiconductor material |
| 03/21/2002 | WO2002022301A1 Laser beam machining method and laser beam machining device |
| 03/21/2002 | US20020033171 Holding unit for semiconductor wafer sawing |
| 03/21/2002 | US20020033087 Cutter wheel for brittle sheets |
| 03/20/2002 | EP1187696A2 Monitoring system for dicing saws |
| 03/19/2002 | US6358427 Marking diamond |
| 03/19/2002 | US6358115 Dicing apparatus |
| 03/19/2002 | US6357433 Machine for cutting brittle materials |
| 03/19/2002 | US6357330 Method and apparatus for cutting a wafer |
| 03/14/2002 | US20020031899 Apparatus and method for singulating semiconductor wafers |
| 03/14/2002 | DE10007642C2 Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen A method of separating substrates in the panel format with predetermined breaking points |
| 03/12/2002 | US6354912 Workpiece cutting method for use with dicing machine |
| 03/12/2002 | US6354909 Substrate dicing method |
| 03/07/2002 | WO2002019404A1 Method of processing silicon single crystal ingot |
| 03/07/2002 | US20020026931 Semiconductor manufacturing equipment |