| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 05/19/2004 | CN1150594C Process for producing semiconductor article |
| 05/18/2004 | US6737606 Wafer dicing device and method |
| 05/18/2004 | US6736703 Cutting apparatus and cutting method |
| 05/13/2004 | US20040092048 Angle control system including a display device configured with two imaging windows that simultaneously display the same image captured by a single camera |
| 05/13/2004 | US20040089282 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus |
| 05/12/2004 | CN1496580A Method for mfg. semiconductor chip |
| 05/11/2004 | US6734391 Method and apparatus for cutting nonmetallic substrate |
| 05/11/2004 | US6734083 Dicing method and dicing apparatus for dicing plate-like workpiece |
| 05/11/2004 | US6733377 Dicing machine |
| 05/11/2004 | US6732612 Blade exchanging device and blade exchanging method therefor |
| 05/06/2004 | US20040087112 Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| 05/06/2004 | US20040084042 Apparatus, system and method for cutting a crystal ingot |
| 05/06/2004 | US20040083863 Method for cutting hard and brittle material |
| 05/06/2004 | EP1415959A1 Flat display panel and method of dividing the flat display panel |
| 05/05/2004 | CN1493443A Orientation method used in cutting crystal |
| 05/05/2004 | CN1148798C Locating ring for chip carrier |
| 05/04/2004 | US6729215 Dicing machine |
| 04/29/2004 | DE10296621T5 Polierkissen und System Polishing pad and system |
| 04/28/2004 | EP1412149A1 Machine for cutting wafers |
| 04/27/2004 | US6726526 Cutting machine |
| 04/22/2004 | US20040075717 Wafer processing apparatus and method |
| 04/22/2004 | US20040074366 Apparatus for cutting liquid crystal display panel |
| 04/22/2004 | DE10296690T5 Verfahren zur Herstellung eines Sintermagneten A process for producing a sintered magnet |
| 04/21/2004 | EP1409192A1 Method of ablating an opening in a hard, non-metallic substrate |
| 04/20/2004 | US6723952 Laser cutting apparatus and method |
| 04/15/2004 | WO2003103893A9 A monolithic rotating tool |
| 04/15/2004 | US20040072501 Polishing method and polishing apparatus used for the same |
| 04/15/2004 | US20040072388 Method of manufacturing semiconductor chip |
| 04/15/2004 | DE10296522T5 Verfahren zur Herstellung eines Halbleiterchips A process for producing a semiconductor chip |
| 04/14/2004 | EP1408012A1 SCRIBE HEAD, SCRIBE APPARATUS AND SCRIBE METHOD USING THE SCRIBE HEAD |
| 04/08/2004 | WO2004028988A1 Mechanical scribe device |
| 04/01/2004 | WO2003028949A3 Method of machining substrates |
| 03/31/2004 | CN1486285A Scribing and breaking apparatus, system therefor, and scribing and breaking method |
| 03/31/2004 | CN1143762C Ultrasonic vibrative cutting method and the device thereof |
| 03/31/2004 | CN1143754C Abrasive-bladed multiple cutting wheel assembly |
| 03/30/2004 | US6713720 Method for cutting a non-metallic substrate |
| 03/30/2004 | US6711979 Cutting method of ceramic honeycomb formed body |
| 03/25/2004 | US20040058626 Surface preparation for receiving processing treatments |
| 03/25/2004 | US20040056008 Apparatus for cutting a non-metallic substrate using a laser beam |
| 03/25/2004 | US20040055634 Cutting method and apparatus for ingot, wafer, and manufacturing method of solar cell |
| 03/25/2004 | US20040055433 Test piece cutter and splitting method thereof |
| 03/24/2004 | EP1399306A1 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| 03/17/2004 | CN1482199A Mass ultraprecise processing mucilage glue for Ultrathin monocrystal single substrate and its process |
| 03/11/2004 | US20040045637 A method for manufacturing a sintered magnet includes the steps of producing a green compact of powder for the sintered magnet, machining the green compact with a wire-saw, and sintering the green compact. |
| 03/10/2004 | EP1395406A1 Substrate and method of separating components from a substrate |
| 03/04/2004 | WO2004018144A1 Method of breaking a brittle substrate |
| 03/04/2004 | WO2003026857A3 Coaxial spindle cutting saw |
| 03/04/2004 | US20040040997 Scribing and breaking apparatus, system therefor, and scribing and breaking method |
| 03/04/2004 | US20040040655 Substrate processing device and processing method |
| 03/04/2004 | DE10237247A1 Semiconductor wafer made from silicon as base material used in the production of electronic components has specified luminosity and roughness |
| 03/03/2004 | CN1140421C Method for marking diamond |
| 03/02/2004 | US6699105 Method and apparatus for cutting and grinding single crystal SiC |
| 02/26/2004 | US20040038629 Internal diameter cutting blades and methods |
| 02/25/2004 | EP1390184A1 Method for treating an exhausted glycol-based slurry |
| 02/25/2004 | EP1090725B1 Scribe device |
| 02/25/2004 | CN1478011A Machine for cutting wafers |
| 02/19/2004 | WO2004015753A1 Laser machinining |
| 02/19/2004 | WO2004014626A1 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 02/19/2004 | WO2003082542B1 Parting method for fragile material substrate and parting device using the method |
| 02/19/2004 | US20040031476 Group encapsulated dicing chuck |
| 02/19/2004 | US20040031136 Method and apparatus for manufacturing electronic parts |
| 02/18/2004 | EP1389158A1 Dual laser cutting of wafers |
| 02/17/2004 | US6692633 Of aluminum metallization layer; installing a dicing blade having a sacrificial anode, flooding the work surface with cooling high purity water solution, dicing the wafer |
| 02/17/2004 | US6691697 Method for cutting thin film filter work pieces |
| 02/17/2004 | US6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 02/12/2004 | US20040029491 Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw |
| 02/12/2004 | US20040029362 Method and apparatus for cutting devices from substrates |
| 02/12/2004 | DE10232667A1 Wire saw and process for separating discs from a workpiece such as a semiconductor has tension equalizer for wires having cutting particles |
| 02/11/2004 | CN1138299C Rubber belt for cutting and method for cutting semiconductor chip |
| 02/11/2004 | CN1137809C Equipment for sticking resistant pieces |
| 02/10/2004 | US6688300 Techniques for dicing substrates during integrated circuit fabrication |
| 02/10/2004 | US6687990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby |
| 02/05/2004 | DE10232768A1 Process and device for feed control of a wire saw for hard materials such as silicon wafers monitors the wire bending throughout the cut |
| 02/04/2004 | EP1386891A1 Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| 02/04/2004 | EP1385683A1 Substrate- layer cutting device and method associated therewith |
| 02/04/2004 | CN1473087A Laser beam machining method and laser beam machining device |
| 02/04/2004 | CN1472032A Layout liner |
| 02/04/2004 | CN1137503C Cutting device |
| 01/29/2004 | WO2003103893A3 A monolithic rotating tool |
| 01/27/2004 | US6683378 System for singulating semiconductor components utilizing alignment pins |
| 01/22/2004 | WO2004007164A1 Pasted base board cutting system and base board cutting method |
| 01/22/2004 | US20040014408 Method of mounting a rotating tool to a spindle |
| 01/22/2004 | US20040011176 Cutting machine having aligned dual spindles |
| 01/22/2004 | US20040011171 Blade assembly cover |
| 01/21/2004 | EP0923438B1 Method for obtaining a wafer in semiconducting material of large dimensions |
| 01/21/2004 | CN1469942A Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 01/15/2004 | DE10223937A1 Zweischichtverklebung von Sägehilfen auf Siliciumeinkristallstäben Zweischichtverklebung of sawing aids on Siliciumeinkristallstäben |
| 01/08/2004 | WO2004002705A1 Device and method for scribing substrate of brittle material |
| 01/08/2004 | US20040003807 Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle |
| 01/07/2004 | CN1466505A Cutting method using wire saw, wire saw device, and method of mfg. rareearth magnet |
| 01/06/2004 | US6673754 Solutions containing acrylic, maleic and/or methacrylic acid (co)polymers, group i metal or ammonium salts, polyethers and abrasive particles used as lubricants for cutters and tools |
| 01/06/2004 | US6673699 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers |
| 01/06/2004 | US6671940 Method and apparatus for manufacturing electronic parts |
| 01/01/2004 | US20040002199 Laser processing method and laser processing apparatus |
| 12/31/2003 | CN1464866A Device and method for breaking fragile material substrate |
| 12/31/2003 | CN1132970C Chip sawing machine |
| 12/30/2003 | US6669537 Resin diamond blade and optical waveguide manufacturing method using the blade |
| 12/24/2003 | WO2003068450A3 Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device |
| 12/24/2003 | CN1463218A Substrate and method of separating compsns. from substrate |
| 12/18/2003 | WO2003103893A2 A monolithic rotating tool |