| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 02/11/1998 | EP0823308A1 Method for fabricating silicon semiconductor discrete wafer |
| 02/10/1998 | US5716876 Method for manufacturing completely circular semiconductor wafers |
| 02/10/1998 | US5715807 For cutting a workpiece |
| 02/10/1998 | US5715806 Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same |
| 02/04/1998 | EP0822054A1 Method and apparatus for mixing and continuous extrusion of polymer materials with dry pre-mixing of the material |
| 02/02/1998 | CA2210268A1 Method for the mixing and continuous extrusion of polymer materials with dry pre-mixing of the material and associated machine |
| 01/29/1998 | WO1998003315A1 Hydrodynamic blade guide |
| 01/27/1998 | US5711287 Reciprocating slurry saw |
| 01/20/1998 | US5710065 Method and apparatus for breaking and separating dies from a wafer |
| 01/20/1998 | US5709823 Accurately forming dental restorations, ceramics, metals |
| 01/08/1998 | WO1998000273A1 Method and apparatus to produce a radial cut profile |
| 01/06/1998 | US5705016 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet |
| 12/31/1997 | CN2271439Y Positioner for engraving and grinding gemstone |
| 12/29/1997 | EP0813943A2 Cutting center |
| 12/24/1997 | CN1168534A Method for producing wafer and apparatus employed therein |
| 12/23/1997 | US5699782 Wire saw apparatus |
| 12/17/1997 | CN1167665A 超声波振动刀具 Ultrasonic vibration tool |
| 12/11/1997 | DE19723083A1 Moving wire saw apparatus for cutting of silicon@, glass, and ceramic material |
| 12/11/1997 | DE19723078A1 Wire saw cut wafer cleaning method for semiconductor, magnetic or ceramic material |
| 12/10/1997 | CN2269949Y Diamond strip saw bit |
| 11/26/1997 | EP0808701A2 Wire saw |
| 11/12/1997 | CN1164461A Method of manufacturing resonator pieces |
| 11/05/1997 | CN1163817A Method for processing jade |
| 10/29/1997 | EP0803336A2 Wire saw and work slicing method |
| 10/29/1997 | CN1163476A Processing device for fine nanometer-level plane structure |
| 10/28/1997 | US5681204 Device for detecting a displacement of a blade member of a slicing apparatus |
| 10/22/1997 | EP0802029A2 Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method |
| 10/22/1997 | EP0802028A2 Device for detaching wafers from ingot support and stocking individualized wafers |
| 10/21/1997 | US5678744 Method for cutting a hard to cut wafer |
| 10/15/1997 | EP0800900A1 Ultrasonic vibration cutter |
| 10/08/1997 | EP0799914A2 A method and apparatus for producing semiconductor wafers |
| 10/08/1997 | EP0799680A2 Method and apparatus for cutting diamond |
| 10/08/1997 | EP0799655A1 Method of Manufacturing wire for use in a wire saw and wire for use in a wire saw |
| 10/01/1997 | EP0798092A2 Method of slicing semiconductor single crystal ingot |
| 10/01/1997 | EP0798091A2 Wire saw and method of slicing a cylindrical workpiece, e.g. an ingot |
| 10/01/1997 | EP0798090A2 Method of cutting a workpiece with a wire saw |
| 09/16/1997 | US5667423 Method and apparatus for slicing workpiece |
| 09/12/1997 | WO1997032681A1 Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method |
| 09/04/1997 | WO1997031765A1 Wire type cutting work apparatus and method therefor |
| 09/03/1997 | CN1158289A Method of producing semiconductor wafers |
| 08/27/1997 | EP0791444A1 Wafer manufacturing process |
| 08/13/1997 | EP0788859A1 Wire sawing device |
| 08/13/1997 | EP0788858A2 Wire sawing device |
| 08/13/1997 | EP0788857A1 Wire sawing device |
| 07/09/1997 | EP0782907A1 System and method for processing ingots |
| 06/19/1997 | DE19546988A1 Semiconductor material treatment with grinding and ultrasonic cleaning |
| 06/18/1997 | EP0779647A1 Method and apparatus for treatment of semiconductor material |
| 06/04/1997 | CN2255346Y Spherical forming machine for button of hard stone material |
| 05/07/1997 | EP0771628A2 A fixture and method for laser fabrication by in-situ cleaving of semiconductor bars |
| 05/07/1997 | DE19638991A1 Machine for wire cutting ceramic, glass or silicon workpiece |
| 05/06/1997 | US5626777 Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate |
| 04/29/1997 | US5623916 Method and apparatus for cutting grooves into diamonds and precious stones |
| 04/23/1997 | EP0740598A4 Method and apparatus for scribing and/or breaking semiconductor wafers |
| 04/22/1997 | CA2105236C Method for cutting a wafer hard to cut |
| 04/17/1997 | WO1997013626A1 Method of machining a thermosetting laminate |
| 04/09/1997 | EP0767036A1 Wire saw having a wire management system allowing for wire rollers of very large length |
| 04/09/1997 | EP0767035A1 Slurry managing system and slurry managing method for wire saws |
| 04/08/1997 | US5618759 Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof |
| 04/01/1997 | US5616065 Wire saw and method for cutting wafers from a workpiece |
| 03/27/1997 | DE19638990A1 Cutting machine, esp. for wire slicing of blocks |
| 03/27/1997 | DE19627479A1 Device for drilling hole through glass plate for e.g. sign mount |
| 03/26/1997 | EP0552321B1 Methods for producing indicia on diamonds |
| 03/19/1997 | CN1145531A Method and appts. for making silicon chip |
| 03/12/1997 | EP0762483A1 Wafer processing system |
| 03/11/1997 | US5609148 Method and apparatus for dicing semiconductor wafers |
| 03/11/1997 | CA2093216C Methods for producing indicia on diamonds |
| 02/25/1997 | US5605489 Method of protecting micromechanical devices during wafer separation |
| 02/06/1997 | WO1997003846A1 Marking diamond |
| 01/30/1997 | WO1997002905A1 Method and apparatus for washing silicon ingot with water to remove particulate matter |
| 01/28/1997 | US5597345 Apparatus for making an aperture in a tile |
| 01/15/1997 | CN1140124A Method and apparatus for processing reference plane of Si 111 crystal ingot with one-step process |
| 01/02/1997 | EP0750972A1 Ingot slicing machine with built-in grinder |
| 12/27/1996 | EP0749817A1 Wire saw slicing apparatus and slicing method |
| 12/27/1996 | EP0749799A2 Die insert method and method for producing same |
| 12/18/1996 | EP0720521A4 Apparatus and method for dicing semiconductor wafers |
| 12/11/1996 | EP0747187A2 Apparatus and method for wire cutting glass-ceramic wafers |
| 12/10/1996 | US5582536 Apparatus and method for manufacturing wafer |
| 12/04/1996 | EP0745464A2 Wire saw slicing apparatus and slicing method using the same |
| 12/04/1996 | EP0745447A1 Wire saw apparatus |
| 11/27/1996 | EP0744796A1 Method and device for carrying out the cleavage in ultra-high-vacuum environment of portions of a processed semiconductor wafer |
| 11/27/1996 | EP0744236A1 Wire saw and method for cutting wafers from an ingot |
| 11/20/1996 | EP0743140A2 Wire saw |
| 11/19/1996 | US5575189 Roller having grooves for wire saw |
| 11/13/1996 | EP0742066A2 Wire saw |
| 11/12/1996 | US5573684 Methods for producing indicia on diamonds |
| 11/06/1996 | EP0740598A1 Method and apparatus for scribing and/or breaking semiconductor wafers |
| 11/05/1996 | US5571040 Method and device for detecting blade flexure and blade flexure control device for use with a slicing machine |
| 10/23/1996 | EP0738572A1 Method for orienting monocrystals for cutting in a cutting machine and device for performing the method |
| 10/15/1996 | US5564409 Apparatus and method for wire cutting glass-ceramic wafers |
| 10/08/1996 | US5561912 Three axis goniometer |
| 10/02/1996 | EP0734824A2 Method and apparatus for dicing semiconductor wafers |
| 10/02/1996 | EP0734823A1 Method and apparatus for slicing workpiece |
| 10/01/1996 | US5560241 Synthetic single crystal diamond for wire drawing dies |
| 09/25/1996 | EP0733429A1 Wire saw and method for cutting wafers from a workpiece |
| 09/18/1996 | EP0732173A1 Wire saw |
| 09/04/1996 | EP0729815A1 Method of producing slices |
| 09/03/1996 | US5551618 Apparatus for cutting plate-shaped brittle material |
| 08/14/1996 | CN2232832Y Verticle spherical ruling engine |
| 07/25/1996 | DE19501852A1 One=dimensional micro lens mfr. for esp. high power diode laser technology |
| 07/10/1996 | EP0721208A2 Integrated circuit processing |