| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/05/2015 | WO2015029987A1 Dicing blade |
| 03/05/2015 | WO2015029888A1 Glass film ribbon manufacturing method and glass film ribbon manufacturing device |
| 03/05/2015 | WO2015029323A1 Ingot cutting method and wire saw |
| 03/05/2015 | US20150064879 Separation of Chips on a Substrate |
| 03/05/2015 | US20150060509 Method of Controlled Crack Propagation for Material Cleavage using Electromagnetic Forces |
| 03/05/2015 | DE102012201938B4 Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück A method for simultaneously separating a plurality of wafers from a workpiece |
| 03/04/2015 | EP2842676A1 Wire saw device |
| 03/03/2015 | US8969761 Method of cutting a wafer-like object and semiconductor chip |
| 03/03/2015 | US8969752 Laser processing method |
| 03/03/2015 | US8968054 Method for cooling a workpiece made of semiconductor material during wire sawing |
| 02/26/2015 | DE102013219900B3 Verfahren zum Rillieren der Drahtführungsrollen für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück A method for grooving the wire guide rollers for wire saws for cutting wafers from a workpiece |
| 02/25/2015 | EP2839912A1 Wire saw device with sensor arrangement and method for monitoring the operation of the wire saw device |
| 02/24/2015 | US8960657 Systems and methods for connecting an ingot to a wire saw |
| 02/24/2015 | US8960177 Wiresaw cutting method |
| 02/12/2015 | WO2015018425A1 Method for processing a plate-like workpiece having a transparent, glass, glass-like, ceramic, and/or crystalline layer, severing device for such a workpiece, and product from such a workpiece |
| 02/12/2015 | US20150040884 Fixed abrasive grain wire saw, its manufacturing method, and method of cutting workpiece by using it |
| 02/11/2015 | EP2835361A1 Glass film fracturing method and glass film laminate body |
| 02/11/2015 | EP2834036A1 Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel |
| 02/11/2015 | CN204149348U 一种负压缓冲器 One kind of negative buffers |
| 02/11/2015 | CN204149344U 切割用波纹单丝型钢丝 Cutting corrugated steel monofilament type |
| 02/11/2015 | CN204149343U 一种加长导向轮 One kind of guide wheels extended |
| 02/11/2015 | CN104339463A 具备振动装置的晶锭倾翻装置 Provided with vibrating means ingot tilting device |
| 02/11/2015 | CN104339462A 积层陶瓷基板的切断方法 The method of cutting the laminated ceramic substrate |
| 02/11/2015 | CN104339461A 积层陶瓷基板的切断方法 The method of cutting the laminated ceramic substrate |
| 02/11/2015 | CN103302754B 金刚石线锯切割方法及切割设备 Diamond wire saw cutting methods and cutting equipment |
| 02/11/2015 | CN102712077B 用于从磨削油泥中分离研磨油的方法、用于实施该方法的分离站以及工艺流程设备 Method for separating grinding oil for sludge from grinding, for carrying out the method of separating stations and process equipment |
| 02/04/2015 | CN204136260U 带有保护装置的线切机晶托 Wire cutting machine with a protective device crystal tray |
| 02/04/2015 | CN204136258U 一种切割机卡具 A cutting machine fixtures |
| 02/04/2015 | CN204136257U 去铁粉砂浆罐 To iron mortar tank |
| 02/04/2015 | CN204136256U 一种硅棒切割用的主辊 A silicone rods cutting master roll |
| 02/04/2015 | CN204136255U 一种带树脂挡块的硅棒切割单元 Ingot cutting unit with a resin stopper |
| 02/04/2015 | CN204136254U 一种切割晶片用线锯机中切割线的绕行结构 A cutting wafer dicing bypass structure in line with the line Saw |
| 02/04/2015 | CN204136253U 预变形电镀金刚石线锯 Predeformation electroplated diamond wire saw |
| 02/04/2015 | CN204136252U 环形金刚石线锯 Ring diamond wire saws |
| 02/04/2015 | CN204136251U 一种金刚石切割线 A line of diamond cutting line |
| 02/04/2015 | CN204136250U 水晶、玻璃三角条循化打孔机 Crystal, glass triangle strip Xunhua punch |
| 02/04/2015 | CN104325569A 一种可降低生产成本的砂浆桶 One kind can reduce the production cost of the mortar barrel |
| 02/04/2015 | CN104325568A 一种摇摆切割动力头 A rocking cutting power head |
| 02/04/2015 | CN104325567A 除砂浆杂质的硅块切割装置及方法 In addition to mortar impurity silicon block cutting apparatus and method |
| 02/04/2015 | CN103065935B 一种采用挤压方式去除igbt用硅晶圆抛光片边缘氧化膜的方法 One kind is removed by using extrusion igbt with silicon oxide film is polished edge method |
| 02/04/2015 | CN102873772B 多线切割机辊轮组的调线方法 Transfer line roller groups MWS method |
| 02/04/2015 | CN102581967B 带有v型槽的微小硅片的切断方法 V-groove cutting method with tiny silicon |
| 02/03/2015 | US8946592 Laser processing method and laser processing apparatus |
| 02/03/2015 | US8946591 Method of manufacturing a semiconductor device formed using a substrate cutting method |
| 02/03/2015 | US8946589 Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| 02/03/2015 | US8946055 Laser processing method for cutting substrate and laminate part bonded to the substrate |
| 02/03/2015 | US8945316 Method for shaping and slicing ingots using an aqueous phosphate solution |
| 01/29/2015 | US20150027990 Holding apparatus, holding method thereof, wire electrical discharge machining apparatus, and machining method thereof |
| 01/29/2015 | US20150027290 Semiconductor die singulation methods |
| 01/28/2015 | CN204123544U 分体组合式硅片脱胶防倒塌插片挡板 Split combined silicon unglued anti collapse baffle inserts |
| 01/28/2015 | CN204123543U 防转硅片脱胶防倒塌插片挡板 Anti-rotation silicon unglued anti collapse baffle inserts |
| 01/28/2015 | CN204123542U 晶棒线切割机 Cutting ingot |
| 01/28/2015 | CN204123541U 一种用平行光确定宝石晶体径向掏棒位置的装置 One kind of gem crystals with parallel light to determine the radial position of the device dig stick |
| 01/28/2015 | CN204123540U 晶管切割装置 Crystal tube cutting device |
| 01/28/2015 | CN204120382U 一种分支架钻穿一体的穿珠机 One kind of sub-bracket drilled one wearing beads machine |
| 01/28/2015 | CN104309018A 一种硅片切割用树脂条结构 One kind of resin strip structure wafering |
| 01/28/2015 | CN104309017A 超精密kdp晶体机床的进给机构 Ultra-precision machine tools kdp crystal feeding mechanism |
| 01/28/2015 | CN104309016A 一种大直径多晶棒料的加工方法 One kind of large-diameter rod polycrystalline material processing methods |
| 01/28/2015 | CN104309015A 一种钻石加工方法 One kind of diamond processing method |
| 01/28/2015 | CN104309013A 超硬材料切割方法及切割装置 Superhard material cutting method and cutting device |
| 01/28/2015 | CN104309003A 一种复合振动超声铣削主轴 A composite ultrasonic vibration milling spindle |
| 01/28/2015 | CN102729346B 折断装置 Breaking device |
| 01/28/2015 | CN102398318B 蓝宝石硅棒的切割方法 Sapphire Ingot cutting methods |
| 01/28/2015 | CN101973082B 一种定位精确的单晶切方机 A positioning precision of single crystal cut side machine |
| 01/28/2015 | CN101906346B 水性切削液和浆 Water-based cutting fluid and plasma |
| 01/22/2015 | US20150020670 Cutting apparatus |
| 01/22/2015 | US20150020667 Cutting apparatus |
| 01/22/2015 | US20150020666 Cutting apparatus |
| 01/21/2015 | CN204109161U 蓝宝石晶棒切割装置 Sapphire Ingot cutting device |
| 01/21/2015 | CN204109153U 具有复合结构镀层的金刚石切割工具 Diamond has a composite structure coated cutting tool |
| 01/21/2015 | CN204109152U 一种超声波雕刻机 An ultrasonic engraving machine |
| 01/21/2015 | CN204105068U 一种双功能新型穿珠机 Bead a dual function of new machines |
| 01/21/2015 | CN104290319A 利用超短脉冲激光的透明材料加工 The use of an ultrashort pulse laser transparent material processing |
| 01/21/2015 | CN104290208A 一种金刚石线锯切割机差动运丝装置 A line of diamond wire saw cutting machine differential op wire device |
| 01/21/2015 | CN104290207A 一种单丝式的钢丝锯线 A single-wire type of wire saw wire |
| 01/21/2015 | CN104290206A 一种线切割机砂浆装置 Cutting one kind of mortar device |
| 01/21/2015 | CN104290205A 丝锯装置和制造丝锯装置的方法 Wire sawing device and a method of manufacturing the wire saw unit |
| 01/21/2015 | CN104290204A 一种切片粘胶工序中硅棒粘胶方法 One kind of slicing silicon rods viscose rayon process method |
| 01/21/2015 | CN104290201A 用于超硬材料加工的带锯切割装置 Band saw for cutting superhard materials processing equipment |
| 01/21/2015 | CN104290199A 具有复合结构镀层的金刚石切割工具及其制作方法 Diamond cutting tools and a method of preparing a composite structure Coating |
| 01/21/2015 | CN102825668B 一种含介电层的半导体原件的切割方法 A method of cutting a semiconductor-containing dielectric layer of the original |
| 01/21/2015 | CN102615722B 具备断线感测单元的锭块切割用线锯装置及利用该装置的断线感测方法 Includes disconnection sensing unit ingot with a wire saw cutting apparatus and method of use of the disconnection sensing means |
| 01/21/2015 | CN102581973B 硅棒加热器 Ingot heater |
| 01/21/2015 | CN101687342B 脆性材料基板的加工方法及用于该方法的裂痕形成装置 Brittle material substrate processing method and cracks forming apparatus used in the method |
| 01/20/2015 | US8937264 Laser processing method and laser processing apparatus |
| 01/15/2015 | WO2015004835A1 Splitting method and splitting device for panel of brittle material |
| 01/14/2015 | EP2823944A1 Scribing wheel and method for manufacturing same |
| 01/14/2015 | CN204102872U 晶圆切割定位装置 Wafer Cutting positioning device |
| 01/14/2015 | CN204094971U 一种单丝式的钢丝锯线 A single-wire type of wire saw wire |
| 01/14/2015 | CN204094970U 多线切割机导轮结构 MWS guide wheel structure |
| 01/14/2015 | CN103201354B 用于制备光伏晶片和磨料浆料的方法 A method for producing a photovoltaic wafer and the abrasive slurry |
| 01/14/2015 | CN103056730B 一种电磨削多线切割进电方法及装置 An electrical multi-line grinding method and apparatus for cutting into electricity |
| 01/14/2015 | CN102079112B 应用于金刚线开方机的切割方法 Diamond wire cutting method applies prescribing machines |
| 01/13/2015 | US8934606 Intelligent machines and process for production of monocrystalline products with goniometer continual feedback |
| 01/13/2015 | US8933369 Method of cutting a substrate and method of manufacturing a semiconductor device |
| 01/07/2015 | CN204076549U 一种硅片切割装置 One kind of wafer cutting device |
| 01/07/2015 | CN204076546U 一种多线切片机的断线报警装置 A multi-wire slicer break alarm device |
| 01/07/2015 | CN204076545U 一种硅片切片机的切割线防跳线装置 An anti-cut line jumper device wafers slicer |
| 01/07/2015 | CN204076544U 一种开方机的挡浆板装置 Block device for prescribing pulp machine |
| 01/07/2015 | CN204076543U 一种硅片切割砂浆循环系统 One kind of wafering mortar circulatory system |