| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 02/23/1994 | CN2157009Y U-canal shaper |
| 02/22/1994 | US5288663 Method for extending wafer-supporting sheet |
| 02/22/1994 | US5287843 Slicing machine employing an axial force to provide rigidity to a rotary blade |
| 02/22/1994 | US5287774 Method and device for producing seamless ribbon and wire loops, and their use as cuttings tools in ribbon and wire saws |
| 02/15/1994 | US5285597 Method and arrangement for subdividing semiconductor bars into semiconductor wafers |
| 02/03/1994 | WO1994002299A1 Method and apparatus for separating circuit dies from a wafer |
| 01/20/1994 | WO1994001256A1 Ultrasonic drilling machine |
| 01/19/1994 | EP0579227A1 Method and apparatus for slicing semiconductor wafer |
| 01/18/1994 | US5279077 Method for producing semiconductor wafer |
| 01/11/1994 | US5278685 Method for dividing substrates of liquid crystal displays using repeated measurements |
| 01/11/1994 | US5277952 Decorative cracked glass mirror tile and method |
| 12/29/1993 | EP0575757A1 A method of slicing a semiconductor wafer and an apparatus therefor |
| 12/21/1993 | US5272114 Method for cleaving a semiconductor crystal body |
| 12/15/1993 | EP0573855A1 Process for contamination free comminuting of semi-conductor material, especially of silicon |
| 12/14/1993 | US5269285 Wire saw and slicing method using the same |
| 11/30/1993 | US5266528 Method of dicing semiconductor wafer with diamond and resin blades |
| 11/23/1993 | US5264919 Apparatus for positioning a semiconductor wafer |
| 10/27/1993 | EP0567129A2 Method of working diamond |
| 10/19/1993 | US5254833 Brittle material cleavage-cutting apparatus |
| 09/30/1993 | DE4220284C1 Cutting method for dicing multilayer wafers into individual chips - using two blades of material and thickness matched to substrate on each side |
| 09/29/1993 | EP0561770A1 Diamond sawing process |
| 09/28/1993 | US5247923 Method of forming a diamond drill bit element using laser trimming |
| 09/21/1993 | US5246524 Semiconductor wafer processing system |
| 09/21/1993 | CA2043173C Method for batch cleaving semiconductor wafers and for coating the cleaved facets |
| 09/15/1993 | EP0559986A2 Method for producing semiconductor wafer and substrate used for producing the semiconductor |
| 09/08/1993 | EP0559006A1 Spacer for mounting multiple circular saw blades on a single spindle and set of saw blades using the spacer |
| 08/31/1993 | US5240882 Process and apparatus for making discrete type substrates by re-slicing a wafer |
| 08/24/1993 | US5238876 Method of dividing semiconductor wafer using ultraviolet sensitive tape |
| 08/17/1993 | US5235960 Clamping system for an annular-saw blade and its use in the sawing of bars, in particular of semiconductor material, into wafers |
| 08/04/1993 | EP0552321A4 Methods for producing indicia on diamonds |
| 07/28/1993 | EP0552663A1 Device for controlling the geometry of thin plates cut by means of a wire saw |
| 07/28/1993 | EP0552321A1 Methods for producing indicia on diamonds. |
| 07/21/1993 | CN2138554Y Cutter frame for multiple knife cutter sliding along position plate |
| 07/13/1993 | US5227339 Forming ingot of semiconductor cylindrical crystal, slicing into disks, flattening |
| 07/13/1993 | US5226403 Method of using an id saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method |
| 07/13/1993 | US5226343 Ultrasonic cutting apparatus |
| 07/07/1993 | EP0549893A1 Wire saw and slicing method using the same |
| 06/23/1993 | EP0547399A1 Frangible semiconductor wafer dicing method which employs scribing and breaking |
| 06/17/1993 | DE4141072A1 Stamping tool for perforated ceramic substrates - has perforations formed by pin mounted in ejection stamp which is matched by corresponding hole in cutting stamp |
| 06/17/1993 | DE4141071A1 Stamping tool for perforated ceramic substrates - perforations produced by pin in head plate of press and waste removed by pressurised air feed |
| 06/16/1993 | CN2136123Y Mirror polisher |
| 06/15/1993 | US5218948 Inside diameter blade |
| 05/19/1993 | CN2133434Y Multi-tool cutting machine tool damping jionting axle |
| 05/18/1993 | US5210979 Cutting method with a rotary sheet hone |
| 05/13/1993 | DE4136567A1 Cutting ring for producing disc-shaped pieces from rod - has hydrodynamic slides compensating for any deflection of the ring to ensure precision cutting using diamond cutting edge |
| 04/22/1993 | DE4134110A1 Slicing of hard, brittle materials, esp. semiconductor rods - by rotary sawing process avoiding centre damage |
| 04/13/1993 | US5201305 Brittle material cutting method |
| 04/07/1993 | EP0535296A1 Slicing machine |
| 04/01/1993 | DE4133150A1 Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove |
| 04/01/1993 | DE4132311A1 Sawing method for separating components of semiconductor wafer or glass compound - using frozen liquid to secure wafer to base, and applying coolant for saw blade |
| 03/31/1993 | EP0534499A2 Method for slicing a wafer |
| 03/24/1993 | EP0533551A1 Process for manufacturing thin film layers of semiconductor material |
| 03/23/1993 | US5195410 Cutting brittle materials |
| 03/04/1993 | WO1993004497A1 Method and apparatus for cleaving semiconductor wafers |
| 03/04/1993 | CA2115744A1 Method and apparatus for cleaving semiconductor wafers |
| 03/02/1993 | US5190024 Diamond sawing process |
| 03/02/1993 | US5189843 Wafer slicing and grinding machine and a method of slicing and grinding wafers |
| 02/16/1993 | US5185956 Wafer slicing and grinding system |
| 01/19/1993 | US5180469 Method for slicing a semiconductor silicon single crystal |
| 01/13/1993 | EP0522542A1 Method for producing continuous seamless wire belts |
| 12/29/1992 | US5174270 Slicing machine and a slicing method by the same |
| 12/29/1992 | US5174188 Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials |
| 12/15/1992 | US5171717 Method for batch cleaving semiconductor wafers and coating cleaved facets |
| 12/08/1992 | CA1311314C Apparatus for separating semiconductor chips |
| 11/25/1992 | EP0515036A2 An apparatus for chamfering the peripheral edge of a wafer to specular finish |
| 11/19/1992 | EP0513437A1 Blade position correction device for slicing machine |
| 10/13/1992 | US5154873 Method and apparatus for mounting slice base on wafer of semiconductor |
| 10/13/1992 | US5154333 Semiconductor bar from a cell |
| 10/13/1992 | US5154022 Aligning a cutting wire with cross sectional dimensions |
| 10/07/1992 | EP0507438A2 A blade mount for an inner diameter saw blade |
| 09/30/1992 | EP0506533A1 Sawing apparatus |
| 09/29/1992 | US5150641 Apparatus for slicing a workpiece |
| 09/22/1992 | US5149938 Methods for producing indicia on diamonds |
| 09/22/1992 | US5148797 Mounting for an internal diameter saw blade |
| 09/08/1992 | US5144938 Method and device for resharpening saws especially used for making semiconductor wafers |
| 09/01/1992 | US5142756 Apparatus for loading and re-slicing semiconductor wafer |
| 08/06/1992 | WO1992009876A3 Methods for producing indicia on diamonds |
| 08/05/1992 | EP0497497A2 Low-contaminate work surface for processing semiconductor grade silicon |
| 08/04/1992 | US5135727 Neck clamp, cutter, visual cutting monitor mounted on chuck assembly |
| 07/28/1992 | US5133491 Substrate breaker |
| 07/15/1992 | CN1062691A Sapphire treating technology |
| 07/01/1992 | EP0492779A1 Substrate breaker |
| 06/23/1992 | US5123636 Low-contaminate work surface for processing semiconductor grade silicon |
| 06/17/1992 | EP0490842A1 Vibrating system for treating lapideous materials by means of abrasives |
| 06/17/1992 | EP0490324A1 Cutting system |
| 06/17/1992 | CN1061929A Methods for producing indicia on diamonds |
| 06/03/1992 | EP0488785A1 An automatic device for cutting the neck of a pulled single crystal ingot |
| 05/12/1992 | US5111622 Slicing and grinding system for a wafer slicing machine |
| 04/14/1992 | US5105254 Rod assembly for manufacturing large wafer for electronic devices |
| 04/14/1992 | US5104023 Apparatus for fabrication semiconductor device |
| 04/12/1992 | WO1992009876A2 Methods for producing indicia on diamonds |
| 04/01/1992 | EP0477698A1 Method for slicing a semiconductor silicon single crystal |
| 03/31/1992 | US5100839 Method of manufacturing wafers used for electronic device |
| 03/31/1992 | US5099820 Abrasion-type splitting unit |
| 03/26/1992 | DE4029974A1 Piezoelectric elements are cut from wafer - by using diamond coated saw and sawing through wafer thickness in 3 patterns of parallel lines to give regular hexagonal elements |
| 03/26/1992 | DE4029973A1 Sawn or scored wafer breaking device - for sepg. individual chips, esp. led chips |
| 03/25/1992 | EP0476952A2 Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein |
| 03/19/1992 | DE4029285A1 Ultrasonic machining appts. for hard brittle work - has silicon machining tool pref. with protective layer of silicon nitride in holder, and ultrasonic transducer |
| 03/18/1992 | CN2099016U Electroplated dimond saw blade |
| 03/11/1992 | EP0474329A2 Method and machine for slicing and grinding wafers |