| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 02/04/2003 | US6513564 Nozzle for cleaving substrates |
| 01/30/2003 | US20030022508 Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method |
| 01/30/2003 | US20030019897 Method for separating a brittle material |
| 01/29/2003 | CN1394161A Device and method for separating materials |
| 01/23/2003 | WO2003006391A1 Flat display panel and method of dividing the flat display panel |
| 01/22/2003 | CN2531932Y Small type drilling machine for board material |
| 01/21/2003 | US6507984 Cutters having frame supports, rotation tables and pivots for semiconductor machining |
| 01/16/2003 | WO2003004210A1 Method of ablating an opening in a hard, non-metallic substrate |
| 01/16/2003 | CA2451077A1 Method of ablating an opening in a hard, non-metallic substrate |
| 01/15/2003 | CN1099134C Method for forming partially separation in thin film elements and thin film elements rows |
| 01/15/2003 | CN1098760C Manufacture of vibrating sheets |
| 01/14/2003 | US6505394 Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| 01/09/2003 | WO2003002471A1 Device and method for breaking fragile material substrate |
| 01/09/2003 | US20030006220 Method of ablating an opening in a hard, non-metallic substrate |
| 01/09/2003 | US20030005919 Device and method for separating materials |
| 01/02/2003 | US20030000917 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| 01/02/2003 | US20030000915 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same |
| 01/01/2003 | CN1387979A Automatically controlled high-precision crystal wire electrode cutting machine |
| 01/01/2003 | CN1387978A 切割机 Cutting Machine |
| 12/31/2002 | US6501047 Laser-scribing brittle substrates |
| 12/31/2002 | US6500047 Semiconductor wafer cutting machine |
| 12/26/2002 | US20020197757 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers |
| 12/26/2002 | US20020194968 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby |
| 12/25/2002 | CN1386606A Method and device for cutting nonmetal substrate using laser beam |
| 12/24/2002 | US6498075 Dicing method |
| 12/19/2002 | WO2002100619A1 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| 12/19/2002 | US20020193049 Substrate dicing method |
| 12/18/2002 | CN1385288A Method for cutting slice from workpiece |
| 12/17/2002 | US6494197 Dicing machine for cutting CSP plate into pellets |
| 12/17/2002 | US6494122 Alignment method and apparatus for aligning cutting blade |
| 12/17/2002 | US6493934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 12/12/2002 | US20020185121 Group encapsulated dicing chuck |
| 12/12/2002 | US20020184982 Bidrectional singulation saw and mehtod |
| 12/11/2002 | CN1096108C Appts. for making silicon chip |
| 12/10/2002 | US6491574 Complete blade and wafer handling and support system without tape |
| 12/05/2002 | WO2002096612A1 Substrate and method of separating components from a substrate |
| 12/05/2002 | WO2002096611A1 Method for treating an exhausted glycol-based slurry |
| 12/05/2002 | US20020182025 Detailing tool for substrates having a self-alignment feature |
| 12/05/2002 | US20020179079 Cutting machine |
| 12/05/2002 | US20020178883 Semiconductor wafer cutting method |
| 12/04/2002 | CN1382571A Cut-off appts. and cut-off method |
| 12/03/2002 | US6489588 Method and apparatus for separating non-metallic materials |
| 12/03/2002 | US6488021 Method and apparatus for producing semiconductor element |
| 11/28/2002 | WO2002094528A1 Dual laser cutting of wafers |
| 11/28/2002 | US20020174861 Method for cutting slices from a workpiece |
| 11/28/2002 | US20020174757 Wire saw |
| 11/26/2002 | US6485532 Superabrasive wheel with active bond |
| 11/21/2002 | US20020173871 Cutting and sorting automation system and method for manufacturing a liquid crystal device using the same |
| 11/21/2002 | US20020170896 Method and apparatus for cutting a non-metallic substrate using a laser beam |
| 11/21/2002 | US20020170895 Method and device for cutting flat work pieces made of a brittle material |
| 11/21/2002 | DE10122628A1 Separating plates from workpiece, especially semiconducting wafers from rod or block semiconducting material, involves measuring/regulating workpiece temperature during sawing |
| 11/14/2002 | WO2002090075A1 Bidirectional singulation saw and method |
| 11/14/2002 | US20020168929 Cutting blade |
| 11/14/2002 | US20020168921 Dicing machine |
| 11/14/2002 | US20020166909 Cutting solution supplying and controlling apparatus for dicing machine |
| 11/14/2002 | US20020166552 Dicing machine with interlock |
| 11/14/2002 | US20020166428 Wafer sawing apparatus |
| 11/13/2002 | CN1379708A Method and device for isolating plate-like substrates |
| 11/07/2002 | WO2001038039A9 Method and apparatus for separating non-metallic materials |
| 11/07/2002 | US20020162438 Bi-directional singulation system and method |
| 11/06/2002 | EP1255283A2 Cutting apparatus and cutting method |
| 11/06/2002 | EP1255280A2 Apparatus and method for dicing semiconductor wafers |
| 11/05/2002 | US6475878 Method for singulation of integrated circuit devices |
| 11/05/2002 | US6475398 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing same |
| 11/05/2002 | US6475073 Inner diameter grinding wheel and grinding apparatus using the wheel for grinding a cylindrical workpiece |
| 10/31/2002 | US20020160695 Cutting apparatus and cutting method |
| 10/31/2002 | US20020158158 Dicing machine |
| 10/31/2002 | US20020157657 Dicing method and apparatus for cutting panels or wafers into rectangular shaped die |
| 10/30/2002 | CN1377070A Locating ring for chip carrier |
| 10/24/2002 | WO2002083387A1 Substrate- layer cutting device and method associated therewith |
| 10/22/2002 | US6468879 Method and device for separating a plate of material, in particular semiconductor material, into two wafers |
| 10/22/2002 | US6467666 Method of producing a semiconductor device |
| 10/22/2002 | US6467278 Cooling for singulation of composite materials in molded semiconductor packages |
| 10/17/2002 | WO2002081392A1 Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel |
| 10/17/2002 | WO2002081149A1 Polishing pad and system |
| 10/15/2002 | US6463920 Work cutting apparatus and work cutting method |
| 10/10/2002 | US20020144372 Polishing pad and system |
| 10/10/2002 | US20020144371 Polishing pad and system |
| 10/08/2002 | US6461940 Dicing blade and method of producing an electronic component |
| 10/08/2002 | US6460257 Scribing method and apparatus |
| 10/03/2002 | WO2002076699A1 Laser scribing of wafers |
| 10/03/2002 | WO2000024549A3 Stiffly bonded thin abrasive wheel |
| 10/03/2002 | US20020139235 Singulation apparatus and method for manufacturing semiconductors |
| 10/03/2002 | EP1144158A3 Stiffly bonded thin abrasive wheel |
| 10/02/2002 | EP1246228A1 Method and apparatus for detaching a semiconductor wafer from a support member |
| 10/01/2002 | US6459105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 09/25/2002 | EP1242322A2 Method and device for cutting flat work pieces made of a brittle material |
| 09/18/2002 | EP0980303B1 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers |
| 09/17/2002 | US6451120 Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers |
| 09/12/2002 | US20020125232 Laser cutting apparatus and method |
| 09/12/2002 | DE10210024A1 Production of semiconductor wafers comprises preparing a crystal of semiconductor material with an axially extending hollow chamber, removing the wafers using a wire cutter |
| 09/11/2002 | EP1238743A1 Process to bring a breakable edge on a workpiece |
| 09/11/2002 | EP1237691A1 Method for separating a machining suspension into fractions |
| 09/11/2002 | EP1237673A2 Rocking apparatus and method for slicing a work piece utilizing a diamond impregnated wire |
| 09/10/2002 | US6448156 Techniques for maintaining alignment of cut dies during substrate dicing |
| 09/10/2002 | US6448151 Process for producing a large number of semiconductor chips from a semiconductor wafer |
| 09/03/2002 | US6444310 Dicing tape and a method of dicing a semiconductor wafer |
| 09/03/2002 | US6443143 Method and apparatus for cutting rare earth alloy |
| 09/03/2002 | US6442852 Scribe device |
| 08/29/2002 | WO2002067300A2 Singulation apparatus and method for manufacturing semiconductors |