| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 08/21/2001 | US6276355 Cutting method and apparatus for sectioning multilayer electronic devices |
| 08/16/2001 | DE10004876A1 Process for separating flat workpieces made of quartz crystal along a separating line comprises forming a heat radiation mark on the surface of the workpiece, moving the mark |
| 08/14/2001 | US6274458 Method of gas cleaving a semiconductor product |
| 08/09/2001 | DE10062179A1 Manufacturing a semiconductor wafer using a mechanically releasable fixing |
| 08/08/2001 | CN1307517A Method for separation, regeneration and reuse of exhausted glycol-based slurry |
| 08/07/2001 | US6271102 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
| 08/02/2001 | US20010010112 Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
| 08/01/2001 | EP1120217A2 Apparatus and method for cutting ingots |
| 07/31/2001 | US6267282 Method and apparatus for handling laser bars |
| 07/25/2001 | CN1304821A Cut off method of rare earth alloy and cut off device |
| 07/24/2001 | US6264535 Wafer sawing/grinding process |
| 07/24/2001 | US6263941 Nozzle for cleaving substrates |
| 07/18/2001 | EP1116563A1 Method of cutting ceramic honeycomb molded article |
| 07/17/2001 | US6261166 Wire cleaning apparatus |
| 07/12/2001 | US20010007812 Inner diameter grinding wheel and grinding apparatus using the wheel for grinding a cylindrical workpiece |
| 07/12/2001 | US20010007254 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/10/2001 | US6257224 Process for working a preform made of an oxide single crystal, and a process for producing functional devices |
| 07/05/2001 | DE19960380A1 Verfahren zum Fraktionieren einer Zerspanungssuspension Method for fractionating a machining suspension |
| 07/03/2001 | US6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/03/2001 | US6253758 Apparatus for reducing damage to wafer cutting blades during wafer dicing |
| 07/03/2001 | US6253755 Method for reducing damage to wafer cutting blades during wafer dicing |
| 06/28/2001 | US20010004891 Device for simultaneously separating a multiplicity of wafers from a workpiece |
| 06/27/2001 | EP1110669A2 Apparatus and method for cutting workpieces by flushing working liquid to the tool-and-workpiece interface |
| 06/27/2001 | EP1110652A1 A wire sawing machine with saw wire tension control |
| 06/26/2001 | US6250990 CSP plate cutting apparatus |
| 06/26/2001 | US6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 06/26/2001 | US6250188 Ultrasonic vibration cutting method and apparatus |
| 06/21/2001 | WO2001043933A1 Method for separating a machining suspension into fractions |
| 06/21/2001 | DE19959414A1 Device for simultaneously separating number of discs from workpiece has framesaw with number of individual wires and device for holding workpiece and turning it about longitudinal axis |
| 06/21/2001 | DE10062069A1 Cutting method for rare earth metal alloy involves cutting object with tensioned cutting wire whilst feeding slurry between wire and object, using organic polymer wire drive device surface |
| 06/21/2001 | CA2392399A1 Method for separating a machining suspension into fractions |
| 06/19/2001 | US6247625 Anvil pad configuration for laser cleaving |
| 06/14/2001 | WO2001043168A2 Method for handling semiconductor substrates during processing and/or machining |
| 06/14/2001 | WO2001042152A2 Method and device for cutting flat work pieces made of a brittle material |
| 06/14/2001 | WO2001041959A2 Monitoring system for dicing saws |
| 06/13/2001 | DE10054165A1 Separating discs from workpiece using saw wire moving in three phases in each direction with constant speed phase less than half as long as acceleration and braking phases |
| 06/13/2001 | CN1067022C Marking diamond |
| 06/07/2001 | US20010002561 Wire saw apparatus and method |
| 06/07/2001 | DE19954349A1 Semiconductor wafer production comprises abrasive friction cutting of semiconductor rods, in which cylindrical semiconductor rod is cut with elliptical basal plane |
| 06/07/2001 | DE10044463A1 Dicing procedure for semiconductor wafer, involves rotating blade to align base with exposure area so as to form orthogonal cutting lines on wafer |
| 05/31/2001 | WO2001038039A1 Method and apparatus for separating non-metallic materials |
| 05/31/2001 | US20010002356 Superabrasive wheel with active bond |
| 05/30/2001 | CN1296879A Equipment for sticking resistant pieces |
| 05/30/2001 | CN1296871A Workpiece cutting device and method |
| 05/29/2001 | US6237585 Wire-sawing machine |
| 05/29/2001 | CA2202203C Ultrasonic vibration cutter |
| 05/23/2001 | DE10045770A1 Method of cutting rare-earth metal alloy for manufacture of voice-coil motor, by using abrasive wire and applying cutting oil of predetermined kinematic viscosity |
| 05/22/2001 | US6234160 Abnormality transmission system for wire saw |
| 05/22/2001 | US6234159 Wire saw and process for cutting off shaped articles |
| 05/15/2001 | US6231673 Manufacturing method of semiconductor wafer, semiconductor manufacturing apparatus, and semiconductor device |
| 05/15/2001 | US6231628 Method for the separation, regeneration and reuse of an exhausted glycol-based slurry |
| 05/10/2001 | DE10064066A1 Simultaneous separation of numerous discs from hard, brittle workpiece with longitudinal axis and peripheral surface |
| 05/09/2001 | EP1097782A1 Wire saw and cutting method |
| 05/08/2001 | US6228816 Aqueous cutting fluid, aqueous cutting agent, and process for cutting hard brittle materials with the same |
| 05/01/2001 | US6223961 Apparatus for cleaving crystals |
| 05/01/2001 | US6223638 Slicing apparatus |
| 04/26/2001 | WO2001028745A1 Method and device for isolating plate-like substrates |
| 04/26/2001 | DE19950068A1 Device for separating/removing thin, breakable, plate-shaped substrates of various formats removes plates using shaking motion in arc about rotation point at base of plate, adhesion point |
| 04/26/2001 | CA2388730A1 Method and device for isolating plate-like substrates |
| 04/25/2001 | CN1292546A Method and accessories for manufacturing slider |
| 04/24/2001 | US6221814 Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid |
| 04/24/2001 | US6221740 Substrate cleaving tool and method |
| 04/18/2001 | CN1291768A Manufacturing method of slipper and device used |
| 04/17/2001 | US6216682 Cutting apparatus |
| 04/12/2001 | DE10043212A1 Cutting a workpiece, e.g. a semiconductor wafer comprises a cutting step and a whisker removal step |
| 04/11/2001 | EP1090725A1 Scribe device |
| 04/03/2001 | US6209532 Soft handling process tooling for low and medium volume known good die product |
| 03/28/2001 | CN1288799A Method and apparatus for grinding magnetic components and method and apparatus for treatment of waste liquid |
| 03/28/2001 | CN1288798A Method and device for cutting rare-earth alloy |
| 03/27/2001 | US6205994 Scriber adapter plate |
| 03/22/2001 | DE10029239A1 Magnetic component processing device, including grinding device with heat-resistant resin and superhard grinding grain |
| 03/21/2001 | CN1063378C Method and apparatus for processing reference plane of Si III crystal ingot with one-step process |
| 03/15/2001 | DE10019472A1 Reinigungsvorrichtung Cleaning device |
| 03/13/2001 | US6200208 Superabrasive wheel with active bond |
| 03/08/2001 | WO2000061324A3 Rocking apparatus and method for slicing a work piece utilizing a diamond impregnated wire |
| 03/06/2001 | US6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 03/01/2001 | DE19938339A1 Saw suspension for brittle semiconductors comprises cut grain, mineral oils, glycols and polysiloxanes |
| 03/01/2001 | DE10030183A1 Semiconductor wafer cutting apparatus has chuck table to convey wafer from wafer mounting area to cutting area in X-axis direction |
| 02/22/2001 | DE10027086A1 Method for cutting permanent magnets involves providing the cutting blade with a cutting edge consisting of grinding grains and a heat resistant resin, and cutting the magnet with supply of a coolant at controlled temperature |
| 02/15/2001 | WO2001010644A1 Method and apparatus for cleaving a substrate |
| 02/15/2001 | DE19936834A1 Sägedraht und Verfahren zum Trennläppen von sprödharten Werkstücken Saw wire and method for Trennläppen of hard brittle workpieces |
| 02/14/2001 | EP1076044A1 Sheet glass working machine |
| 02/13/2001 | US6187654 Techniques for maintaining alignment of cut dies during substrate dicing |
| 02/13/2001 | US6187213 Marking diamond |
| 02/07/2001 | EP1074366A1 Saw wire and abrasive cutting method for brittle workpieces |
| 02/06/2001 | US6182729 System and method for processing ingots |
| 02/06/2001 | US6182357 Method and apparatus for dicing electronic substrate |
| 02/01/2001 | WO2001007224A1 Method of cutting ceramic honeycomb molded article |
| 02/01/2001 | WO2000075983B1 A method for dicing wafers with laser scribing |
| 01/31/2001 | CN2417457Y Jade Processing clamp with angle measuring device |
| 01/30/2001 | US6179909 Work crystal orientation adjusting method and apparatus |
| 01/30/2001 | US6178962 Saw wire assembly, cutting method utilizing the same, and system therefor |
| 01/30/2001 | US6178961 Wire saw control method and wire saw |
| 01/24/2001 | CN1280906A Technology and equipment for machining inside of solid material |
| 01/23/2001 | US6176762 Method of cutting a ceramic base plate |
| 01/18/2001 | DE10023001A1 Process for mechanically processing monocrystals used in the production of semiconductor wafers comprises rotating the monocrystal about its crystallographic longitudinal axis and treating with ultrasound |
| 01/17/2001 | EP1068920A2 Wire saw |
| 01/11/2001 | DE19930639A1 Method to separate glass ceramic substrates for electronic circuits; involves holding substrate on support, guiding cutting wheel through slit in support to form score line and bending substrate |
| 01/10/2001 | EP1066937A1 Method and device for cutting and mirror finishing single crystal silicon carbide |
| 01/09/2001 | US6171933 Semiconductor wafer cleaving method and apparatus |