| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 07/28/2005 | DE10054165B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück A method for separating a plurality of wafers from a workpiece |
| 07/27/2005 | EP1511597B1 Laser diamond blocking machine for faceting the bottom of the diamond |
| 07/27/2005 | CN2712591Y Localizer for gem stone cutting machine |
| 07/27/2005 | CN1646282A Parting method for fragile material substrate and parting device using the method |
| 07/27/2005 | CN1646245A System and method for the manufacture of surgical blades |
| 07/27/2005 | CN1645563A Semiconductor wafer processing method |
| 07/21/2005 | US20050159081 Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw |
| 07/21/2005 | US20050155954 Semiconductor wafer processing method |
| 07/21/2005 | US20050155595 Method of cutting rare earth alloy |
| 07/20/2005 | EP1555101A1 Wire saw device |
| 07/20/2005 | CN1642688A Laser machining method |
| 07/20/2005 | CN1642687A Cutting method for workpiece |
| 07/14/2005 | US20050153525 Method and apparatus for cutting devices from substrates |
| 07/14/2005 | US20050150597 Apparatus and method for controlled cleaving |
| 07/13/2005 | CN2709139Y Diamond cutting knife for optical glass and jade precision processing |
| 07/13/2005 | CN1638920A 流体混合装置及切削装置 Fluid mixing device and cutting device |
| 07/13/2005 | CN1638904A Sawing wire |
| 07/12/2005 | US6915795 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
| 07/12/2005 | US6915663 Diamond cutting method, enneahedral-cut diamonds and assembly of enneahedral-cut diamonds |
| 07/07/2005 | WO2005062376A1 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 07/07/2005 | US20050145238 Laser diamond blocking machine for faceting the bottom of a diamond |
| 07/07/2005 | DE102004051180A1 Waferteilungsverfahren Wafer dividing method |
| 07/07/2005 | CA2546632A1 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 07/06/2005 | EP1549472A1 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 07/06/2005 | CN1635981A Method for manufacturing sintered magnet |
| 07/06/2005 | CN1209642C Method for cutting mother-material bar-shape lens and lens group-block for holding same |
| 07/05/2005 | US6913009 Diamond cutting method, enneahedral-cut diamonds and assembly of enneahedral-cut diamonds |
| 06/30/2005 | US20050139047 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus |
| 06/30/2005 | DE10392232T5 Fluidmischvorrichtung und Schneidvorrichtung Fluid mixing device and cutting device |
| 06/29/2005 | CN1208443C Water-base cutting liquid, its producing method, and cutting method using such cutting liquid |
| 06/29/2005 | CN1208174C Orientation method used in cutting crystal |
| 06/28/2005 | US6910839 Internal, active, and compensatory method and device for the rotational main-shaft of a cutting tool with axial bias-and-swing |
| 06/28/2005 | US6910473 Method of cutting ceramic green block |
| 06/23/2005 | US20050136801 Cutting machine for plate-shaped material |
| 06/22/2005 | EP1544172A1 Mechanical scribe device |
| 06/16/2005 | WO2005053925A1 Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| 06/16/2005 | US20050130390 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 06/15/2005 | EP1541311A1 Pasted base board cutting system and base board cutting method |
| 06/15/2005 | CN1206623C Method and accessories for manufacturing slider |
| 06/09/2005 | US20050124141 Row slicing method in tape head fabrication |
| 06/09/2005 | DE10352562A1 Industrial processing device for separating a printed circuit board panel has an electric motor to drive a separating tool |
| 06/08/2005 | CN1624877A Method for dicing semiconductor wafers |
| 06/07/2005 | US6901670 Scribing head, and scribing apparatus and scribing method using the scribing head |
| 06/02/2005 | US20050118921 Method for cutting liquid crystal display panel |
| 06/02/2005 | US20050118790 Method for dicing semiconductor wafers |
| 06/02/2005 | US20050115078 Diamond scriber |
| 06/01/2005 | EP1534463A1 Method of breaking a brittle substrate |
| 06/01/2005 | CN1621895A Method for cutting liquid crystal display panel |
| 06/01/2005 | CN1621211A Fixing method for improving yield rate of wafer cutting |
| 06/01/2005 | CN1203966C Cutting method using wire saw, wire saw device, and method of mfg. Rare earth magnet |
| 05/26/2005 | WO2005048340A1 Vacuum chuck |
| 05/26/2005 | US20050113176 Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle |
| 05/25/2005 | CN1620713A Machining substrates, particularly semiconductor wafers |
| 05/25/2005 | CN1619778A Processing apparatus using laser beam |
| 05/24/2005 | US6897571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 05/24/2005 | US6896595 Method for cutting rare earth alloy, method for manufacturing rare earth magnet, and wire-saw machine |
| 05/18/2005 | CN1201915C Method for accurate-oriented cutting crystals |
| 05/17/2005 | US6892917 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus |
| 05/12/2005 | WO2005042421A1 Glass cutting method |
| 05/12/2005 | US20050098548 Processing apparatus using laser beam |
| 05/11/2005 | EP1529309A1 Laser machinining |
| 05/11/2005 | CN1613625A Preparation of activated jade |
| 05/11/2005 | CN1200796C Slurry cyclic method |
| 05/10/2005 | US6889684 Apparatus, system and method for cutting a crystal ingot |
| 05/10/2005 | US6889586 Work cutting apparatus and method for cutting work |
| 05/06/2005 | WO2005039824A1 Multi-wire saw |
| 05/05/2005 | US20050095819 Method and apparatus for cutting devices from substrates |
| 05/04/2005 | CN1612304A Wafer dividing method |
| 05/03/2005 | US6886550 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire |
| 05/03/2005 | US6886441 Blade assembly cover |
| 04/28/2005 | WO2005037968A1 Slurry for slicing silicon ingot and method for slicing silicon ingot using same |
| 04/28/2005 | WO2005037509A1 Work cutting device and work cutting method |
| 04/28/2005 | US20050090077 Wafer dividing method |
| 04/28/2005 | US20050087181 Method and apparatus of cutting crystalline material |
| 04/27/2005 | EP1220739B1 Method and device for isolating plate-like substrates |
| 04/21/2005 | US20050082644 Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same |
| 04/20/2005 | EP1523401A2 Machining apparatus and methods |
| 04/14/2005 | DE10391811T5 Verfahren zum Zerlegen eines Halbleiterwafers A method for decomposing a semiconductor wafer |
| 04/13/2005 | EP1522099A1 Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 04/07/2005 | DE10335062A1 Semiconductor bar scribing/cutting method, involves removing saw/scribing base by immersion in purification bath |
| 04/06/2005 | CN1604280A Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same |
| 04/06/2005 | CN1196106C Manufacturing method of slipper and device used |
| 03/31/2005 | WO2005028172A1 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| 03/31/2005 | US20050070074 Method for dicing semiconductor wafer |
| 03/30/2005 | EP1237691B1 Method for separating a machining suspension into fractions |
| 03/30/2005 | CN1601705A Method for dicing semiconductor wafer |
| 03/29/2005 | CA2113019C Integrated partial sawing process |
| 03/24/2005 | WO2005027213A1 Semiconductor chip manufacturing method, semiconductor chip, semiconductor thin-film chip, electron tube, and optical sensor |
| 03/24/2005 | US20050064615 Method for separating sapphire wafer into chips using dry-etching |
| 03/24/2005 | DE10338520A1 Method for separating material splitting suspension of cooling lubricant, containing cutting grain and dispersed worked material abraded particles, with suspension treated with gas |
| 03/23/2005 | EP0740598B1 Method and apparatus for scribing and/or breaking semiconductor wafers |
| 03/17/2005 | WO2005023504A1 Method of dividing ceramics cylindrical body and shape of cutout part of the cylindrical body |
| 03/17/2005 | WO2005023474A1 Method of end mill cutting for hard brittle material |
| 03/17/2005 | DE10337920A1 Verfahren zur Herstellung von Bauteilen A process for the production of components |
| 03/17/2005 | DE102004038340A1 Verfahren zum Unterteilen eines plattenartigen Werkstücks A method of dividing a plate-like workpiece |
| 03/16/2005 | EP1513650A2 A monolithic rotating tool |
| 03/16/2005 | CN1192853C Device and method for cutting magnetic element |
| 03/10/2005 | US20050051913 Fluid mixing device and cutting device |
| 03/09/2005 | EP1511597A2 Laser diamond blocking machine for faceting the bottom of the diamond |
| 03/09/2005 | CN1590056A Jigsaw |