| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 03/23/2006 | DE10234494B4 Vorrichtung und Verfahren zum Ausgleichen von axialen Verschiebungen und Schwingungen an einer Welleneinrichtung einer Schneidmaschine Apparatus and method for compensating axial displacements and vibrations of a shaft means of a cutting machine |
| 03/22/2006 | CN2765759Y Mechanical hand for processing high grade gem |
| 03/22/2006 | CN1750917A Substrate-processing table and substrate processing device |
| 03/21/2006 | USRE39018 High speed method of aligning cutting lines of a workplace using patterns |
| 03/21/2006 | US7015118 Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line |
| 03/15/2006 | EP1634326A2 Method for producing a ceramic/metal substrate |
| 03/15/2006 | CN1747820A Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 03/08/2006 | EP1474273B1 Laser machine for examination, planning and marking raw diamond |
| 03/08/2006 | CN2762997Y Slicking apparatus |
| 03/08/2006 | CN1744284A Laser beam processing apparatus for processing semiconductor wafer,method executed therein, and such semiconductor wafer processed thereby |
| 03/08/2006 | CN1743158A Cutting knife angle-adjusting method |
| 03/07/2006 | US7008861 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 03/02/2006 | WO2006022597A2 Supply mechanism for the chuck of an integrated circuit dicing device |
| 03/02/2006 | US20060042437 Machining apparatus and methods |
| 03/02/2006 | DE19950068B4 Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben Method and apparatus for separating and stripping of substrate wafers |
| 03/02/2006 | DE102004040671A1 Method for breaking-up thin, plate-shaped substrate or wafer along scribed line so placing wafer etc. on two-part support |
| 03/01/2006 | EP1630140A1 Brittle board dividing system and brittle board dividing method |
| 03/01/2006 | CN1741879A Method for dividing substrate and method for manufacturing substrate using such method |
| 03/01/2006 | CN1243630C Cutting machine |
| 02/28/2006 | US7005081 Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method |
| 02/23/2006 | US20060040473 Laser processing method and laser processing apparatus |
| 02/23/2006 | DE112004000581T5 Verfahren zum Schneiden von Glas A method for cutting glass |
| 02/23/2006 | DE102005038639A1 Measurement, orientation and fixation of single crystal(s) for semiconductor industry by orienting single crystal based on angles of lattice plane normal relative to axis of revolving table, before fixing crystal and fastening on support |
| 02/22/2006 | CN1736681A Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface |
| 02/22/2006 | CN1242874C Method for controlling cutting and sorting workpieces |
| 02/21/2006 | US7001247 Processing apparatus provided with backpressure sensor |
| 02/21/2006 | US7000607 Gemstone and corresponding method of cutting |
| 02/21/2006 | US7000605 Engraver apparatus and method |
| 02/15/2006 | CN1735490A Scribe line forming device and scribe line forming method |
| 02/15/2006 | CN1735489A Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| 02/15/2006 | CN1733442A Diamond optical fiber cutter processing and designing method |
| 02/14/2006 | US6998571 Laser beam processing machine |
| 02/09/2006 | WO2006013763A1 Laser processing method and semiconductor device |
| 02/09/2006 | US20060027886 Apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| 02/09/2006 | US20060027531 Base material cutting method, base material cutting apparatus, ingot cutting method, ingot cutting apparatus and wafer producing method |
| 02/02/2006 | WO2006011608A1 Vertical crack forming method and vertical crack forming device in substrate |
| 02/02/2006 | WO2006011372A1 Laser processing method |
| 02/02/2006 | US20060025051 Wire sawing apparatus |
| 02/01/2006 | EP1620238A1 Method for cleaning sic particles |
| 02/01/2006 | CN1727167A Wire sawing apparatus |
| 02/01/2006 | CN1239303C Abrasion granule and slicing up method of semiconductor block using the abrasion granule |
| 01/31/2006 | US6992026 Laser processing method and laser processing apparatus |
| 01/31/2006 | US6990880 Method for using a blade assembly cover |
| 01/26/2006 | DE102005022530A1 Waferteilungsverfahren Wafer dividing method |
| 01/25/2006 | CN1724234A Apparatus for rotating point cutting large size silicon-carbide crystal |
| 01/24/2006 | US6988936 Surface preparation for receiving processing treatments |
| 01/24/2006 | CA2441383C Polishing pad and system |
| 01/19/2006 | WO2005082588A3 Saw for a semiconductor device |
| 01/19/2006 | US20060014383 Method of producing semiconductor single crystal wafer and laser processing device used therefor |
| 01/19/2006 | US20060011593 Method of cutting processed object |
| 01/19/2006 | DE102005031200A1 Production of a sapphire substrate used in the production of semiconductor microelectronic or optoelectronic components comprises separating the substrate from a sapphire crystal along a crystallographic a-axis of the sapphire crystal |
| 01/19/2006 | DE102004031966A1 Semiconductor wafer production, used in electronics and microelectronics, comprises separating a semiconductor wafer from a single crystal, mechanically processing the wafer, etching, fine grinding and polishing |
| 01/18/2006 | EP1617466A1 Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 01/18/2006 | CN1723547A Method of producing semiconductor single crystal wafer and laser processing device used therefor |
| 01/11/2006 | CN1720117A Device and method for laser processing |
| 01/11/2006 | CN1720116A 激光加工装置 The laser processing apparatus |
| 01/11/2006 | CN1718407A Diamond cutting knife used for optical glass and gem precision processing |
| 01/05/2006 | DE102005007368A1 Schmierend wirkende Polymer-Wasser-Mischung Lubricating acting polymer-water mixture |
| 01/04/2006 | CN1717784A Laser beam machining method |
| 01/04/2006 | CN1717298A A novel laser bruting machine |
| 01/04/2006 | CN1235270C Cutter |
| 01/04/2006 | CN1234827C Non-combustible water-series cutting fluid composition and non-combustible water-series cutting fluid |
| 01/04/2006 | CN1234515C Substrate and method of separating compositions from substrate |
| 01/03/2006 | US6981495 Wire sawing process and device |
| 12/29/2005 | WO2005123888A1 Matrix liquid for producing a chip removal suspension, and used as a lubricating or machining liquid |
| 12/29/2005 | WO2005123356A1 Pressing roller apparatus for brittle material cleaving machine |
| 12/29/2005 | US20050287768 Method and apparatus for cleaving brittle materials |
| 12/28/2005 | EP1610364A1 Laser beam machining method |
| 12/28/2005 | EP1609559A1 Laser beam machining method |
| 12/28/2005 | EP1609558A1 Laser beam machining method |
| 12/28/2005 | CN1713353A 晶片加工方法 Wafer processing method |
| 12/22/2005 | WO2005122243A2 Method and apparatus for cleaving brittle materials |
| 12/22/2005 | US20050282359 Wafer processing method |
| 12/22/2005 | US20050279740 Scribing sapphire substrates with a solid state UV laser with edge detection |
| 12/22/2005 | CA2569376A1 Method and apparatus for cleaving brittle materials |
| 12/20/2005 | US6976302 Slider manufacturing aid |
| 12/14/2005 | EP1604794A1 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| 12/14/2005 | EP1603722A1 Breaking device for separating ceramic printed circuit boards |
| 12/14/2005 | EP1603612A2 Protective sheath for a cannula |
| 12/14/2005 | CN1706615A Toothed diamond saw blade for processing jade and jewel and its production process |
| 12/14/2005 | CN1231334C Workpiece regulating method for cutting machine |
| 12/08/2005 | WO2005115676A1 Laser processing method and equipment |
| 12/08/2005 | US20050268899 Saw singulation |
| 12/08/2005 | US20050268763 Method and apparatus for cutting semiconductor wafers |
| 12/07/2005 | CN2744495Y Flat-pin quartz crystal shearing equipment |
| 12/07/2005 | CN1230286C Cutter |
| 12/01/2005 | WO2005113212A1 Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| 12/01/2005 | US20050263503 Method of breaking a brittle substrate |
| 11/30/2005 | EP1600270A1 Substrate dividing apparatus and method for dividing substrate |
| 11/30/2005 | CN1229207C Device for cutting liquid crystal display screen and method for cutting by the same device |
| 11/24/2005 | WO2005110678A1 Carrying apparatus for cutting wire |
| 11/24/2005 | WO2005110654A1 Abrasive wire sawing |
| 11/24/2005 | US20050259459 Wafer dividing method |
| 11/24/2005 | DE102004020737A1 Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung Apparatus for severing components from brittle materials with stress-free component storage |
| 11/23/2005 | EP1598163A1 Substrate-processing table and substrate processing device |
| 11/23/2005 | CN2741742Y Automatic binding device for multiple particle gemstone |
| 11/23/2005 | CN1700444A Wafer dividing method |
| 11/23/2005 | CN1228162C Method for cutting off rare-earth alloy, process for preparing rare-earth magnet and fret saw |
| 11/17/2005 | WO2005109492A1 Sawing and handler system for manufacturing semiconductor package |
| 11/17/2005 | WO2005107998A1 Device for separative machining of components made from brittle material with stress-free component mounting |