| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 05/02/2000 | US6056031 System and method for processing ingots |
| 05/02/2000 | US6055976 Method of preparing end faces on integrated circuits |
| 04/27/2000 | WO2000023226A1 Cutting metallates of refractory metals |
| 04/25/2000 | US6053158 Slurry managing system and slurry managing method for wire saws |
| 04/20/2000 | DE19947015A1 Cutting and separating arcuate board into individual small parts, such as semiconductor chips, using cutting machine with clamping table |
| 04/13/2000 | DE19846946A1 Point contact pendulum saw has new type of roller oscillation module replacing pendulum suspension, the saw tool describing a curved path that is not part of circle but part of double cycloid curve |
| 04/12/2000 | CN2373239Y Grinding disc |
| 04/05/2000 | EP0990498A1 Method and device for cutting wafers from a hard brittle ingot |
| 03/30/2000 | DE19842659A1 Tool for cutting plates from a workpiece has openings arranged in region behind cutting edge that enable passage of coolant-lubricant material during cutting of plate |
| 03/28/2000 | US6041766 Method of cutting blocks of hard substances into plates by means of a wire saw, and wire saw for carrying out this method |
| 03/23/2000 | DE19841492A1 Verfahren und Vorrichtung zum Abtrennen einer Vielzahl von Scheiben von einem sprödharten Werkstück Method and device for separating a plurality of discs of a hard brittle workpiece |
| 03/22/2000 | EP0987739A2 Arrangement configured to support substrate during dicing process, and apparatus and method for cutting tapeless subtrate using the arrangement |
| 03/16/2000 | WO2000013870A1 Method and device for cutting and mirror finishing single crystal silicon carbide |
| 03/14/2000 | US6036196 Collet arrangement for integrated circuit structures |
| 03/14/2000 | US6035845 Saw strip for fixing a crystal and process for cutting off wafers |
| 03/09/2000 | DE19839091A1 Sägedraht Saw wire |
| 03/08/2000 | EP0984489A1 Method and device for cleaving semiconductor wafer |
| 03/08/2000 | EP0983831A2 Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy magnets using wire saw, and voice coil motor |
| 03/08/2000 | EP0983152A1 Marking diamond |
| 03/08/2000 | CN1246397A Method for cutting rare earth alloy by scroll saw and method for manufacturing rare earth latten |
| 03/07/2000 | US6033288 Monitoring system for dicing saws |
| 03/02/2000 | DE19932138A1 Saw wire bearing tape for slicing or cutting a material to be worked in a lump includes a delivery reel around which the saw wire assembly is wound and used for delivering continuously or intermittently the saw wire assembly |
| 03/01/2000 | EP0982094A2 Saw wire |
| 02/29/2000 | US6030326 Automatic blade changing system |
| 02/23/2000 | EP0980303A1 Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers |
| 02/16/2000 | EP0980098A1 Semiconducting material substrate for use in integrated circuits manufacturing processes and production method thereof |
| 02/16/2000 | EP0979852A2 A dicing tape and a method of dicing a semiconductor wafer |
| 02/16/2000 | CN1244726A Rubber belt for cutting and method for cutting semiconductor chip |
| 02/15/2000 | US6024814 Method for processing ingots |
| 02/15/2000 | US6024631 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck |
| 02/15/2000 | US6024306 Device and method for fragmenting semiconductor material |
| 02/10/2000 | DE19834447A1 Verfahren zum Behandeln von Halbleitermaterial A process for treating semiconductor material |
| 02/08/2000 | US6021772 Bandsaw and process for cutting off slices from a workpiece |
| 02/08/2000 | US6021696 Slicing method for adjusting a force applied to an object |
| 02/02/2000 | EP0976457A1 Method for treating semiconductor material |
| 01/25/2000 | US6017804 Method and apparatus for cleaving semiconductor material |
| 01/13/2000 | WO2000001519A1 Method for the separation, regeneration and reuse of an exhausted glycol-based slurry |
| 01/05/2000 | EP0968801A1 A method for separating and regenerating polyethylene glycol and silicon carbide abrasive material to enable re-use thereof |
| 01/04/2000 | US6010951 Dual side fabricated semiconductor wafer |
| 01/04/2000 | US6010396 Blade cover in a cutting apparatus |
| 12/28/1999 | US6008069 Fabrication process of a semiconductor device including a dicing process of a semiconductor wafer |
| 12/28/1999 | US6007916 For drawing copper wire for winding, steel cord, stainless steel wire, welding wire |
| 12/28/1999 | US6006739 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 12/28/1999 | US6006738 Method and apparatus for cutting an ingot |
| 12/28/1999 | US6006737 Device and method for cutting semiconductor-crystal bars |
| 12/28/1999 | US6006736 Method and apparatus for washing silicon ingot with water to remove particulate matter |
| 12/09/1999 | DE19825051A1 Verfahren und Vorrichtung zur Herstellung eines zylinderförmigen Einkristalls und Verfahren zum Abtrennen von Halbleiterscheiben Method and apparatus for producing a cylindrical single crystal and method for separating semiconductor wafers |
| 12/09/1999 | DE19825050A1 Process for orientating a cylindrical semiconductor single crystal |
| 12/08/1999 | EP0962284A1 Method and apparatus for manufacturing a cylindrical single crystal and method for slicing wafers |
| 11/30/1999 | US5994230 Method for cold cleaving of laser wafers into bars |
| 11/09/1999 | US5979730 Mounting beam removal equipment |
| 11/09/1999 | US5979728 Apparatus for breaking and separating dies from a wafer |
| 11/03/1999 | EP0953416A2 Wire saw and method for slicing workpiece by use of the same |
| 11/02/1999 | US5976954 Method and apparatus for cleaning and separating wafers bonded to a fixing member |
| 11/02/1999 | US5975990 Method of producing semiconductor wafers |
| 10/28/1999 | WO1999054427A1 Aqueous composition, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid |
| 10/28/1999 | DE19818484A1 Separating semiconductor disc from crystal body |
| 10/27/1999 | EP0951980A2 Apparatus for cleaving crystals |
| 10/26/1999 | US5972154 Methods of dicing flat workpieces |
| 10/26/1999 | US5970744 Cut cornered square mixed-cut gemstone |
| 10/19/1999 | US5968382 Laser cleavage cutting method and system |
| 10/14/1999 | DE19840388A1 Accurate positioning and separation of cast micro-components connected by a carrier layer |
| 10/14/1999 | DE19840387A1 Accurate positioning of micro-parts to tolerances of few microns on microstructure using pneumatic grippers |
| 10/12/1999 | US5964210 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 10/07/1999 | WO1999002295A3 Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire |
| 10/06/1999 | EP0947300A2 An ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus |
| 10/05/1999 | US5962915 Single crystal wafers and a method of preparation thereof |
| 09/29/1999 | CN1229709A Abrasive-bladed multiple cutting wheel assembly |
| 09/22/1999 | CN1229267A Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| 09/16/1999 | WO1999046816A1 Method and device for cleaving semiconductor wafer |
| 09/16/1999 | WO1999046077A2 Superabrasive wire saw and method for making the saw |
| 09/15/1999 | EP0942458A2 Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| 09/14/1999 | US5953590 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck |
| 09/14/1999 | US5950643 Wafer processing system |
| 09/14/1999 | US5950613 Apparatus and method for reducing damage to wafer cutting blades during wafer dicing |
| 09/07/1999 | US5947798 Wire saw cutting apparatus synchronizing workpiece feed speed with wire speed |
| 09/07/1999 | US5947102 Method for cutting wafers from a crystal |
| 09/02/1999 | WO1999043479A1 Microcutter and method for producing microreliefs in a structure |
| 09/01/1999 | EP0938959A1 Abrasive-bladed multiple cutting wheel assembly |
| 08/31/1999 | US5944007 Wire type slicing machine and method |
| 08/19/1999 | WO1999041034A1 Wire sawing device for cutting fine slices using angular crossing of at least two sawing yarn layers |
| 08/17/1999 | US5937844 Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing |
| 08/12/1999 | WO1999039885A1 Apparatus and process for membrane mounted die breaking with automated visualization |
| 08/10/1999 | US5934973 Semiconductor wafer dicing saw |
| 08/03/1999 | US5933351 System and method for locating dies cut from a silicon wafer on a wafer table |
| 08/03/1999 | US5931147 Method of cutting a workpiece with a wire saw |
| 07/27/1999 | US5927263 Method for manufacturing completely circular semiconductor wafers |
| 07/27/1999 | US5927131 Method of manufacturing wire for use in a wire saw and wire for use in a wire saw |
| 07/15/1999 | WO1999035220A1 Aqueous cutting fluid, aqueous cutting agent, and process for cutting hard brittle materials with the same |
| 07/13/1999 | US5922137 Method of producing a semiconductor wafer and a cleaning apparatus for the same |
| 07/06/1999 | US5920769 Method and apparatus for processing a planar structure |
| 07/06/1999 | US5918587 Method of producing slices |
| 06/29/1999 | US5915370 Saw for segmenting a semiconductor wafer |
| 06/23/1999 | EP0923438A1 Method for obtaining a wafer in semiconducting material of large dimensions and use of the resulting wafer for producing substrates of the semiconductor on insulator type |
| 06/22/1999 | US5913305 Cutting device with wires |
| 06/15/1999 | US5913104 Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck |
| 06/15/1999 | CA2174051C Method and apparatus for cutting diamond |
| 06/08/1999 | US5910203 Wire sawing device |
| 06/01/1999 | US5907988 Wire saw apparatus |
| 06/01/1999 | CA2162772C Laser finishing and measurement of diamond surfaces |