| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 11/17/2005 | US20050255630 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 11/17/2005 | DE102005007312A1 Process to cut slices of semiconductor wafer material from a cylindrical block with regulated spray application of slurry |
| 11/16/2005 | EP1595668A1 Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 11/16/2005 | EP1595637A1 Device and method for laser processing |
| 11/10/2005 | WO2005105681A1 Glass cutting method and its apparatus |
| 11/10/2005 | WO2005105354A1 Device and method for conditioning and monitoring of a saw blade |
| 11/08/2005 | US6962147 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements |
| 11/03/2005 | WO2005102638A1 Method for forming vertical crack on brittle board and vertical crack forming apparatus |
| 11/03/2005 | US20050245172 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements |
| 11/03/2005 | US20050245051 Parting method for fragile material substrate and parting device using the method |
| 11/02/2005 | CN1691281A Method for manufacturing substrate wafer used for semiconductor component with few defect, component made by the method and application thereof |
| 11/01/2005 | US6960813 Method and apparatus for cutting devices from substrates |
| 11/01/2005 | US6960739 Scribing sapphire substrates with a solid state UV laser |
| 10/26/2005 | EP1588793A1 Laser processing device |
| 10/20/2005 | WO2005098916A1 Laser processing method and semiconductor chip |
| 10/20/2005 | WO2005067682A3 An apparatus and method for controlled cleaving |
| 10/20/2005 | US20050229914 Workpiece holding jig |
| 10/20/2005 | US20050229755 Pasted base board cutting system and base board cutting method |
| 10/19/2005 | CN1683106A Laser processing method and laser processing apparatus |
| 10/19/2005 | CN1223531C Cutting method for brittle non-metallic materials |
| 10/19/2005 | CN1223443C Method for preparing agate of emulating natural grape |
| 10/19/2005 | CN1223442C Jewelry decoration, diamond and square zirconium and cutting method for them |
| 10/18/2005 | US6955989 Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon |
| 10/13/2005 | WO2005095076A1 Method and apparatus for cutting ultra thin silicon wafers |
| 10/13/2005 | US20050223570 Mechanical scribing apparatus with controlling force of a scribing cutter |
| 10/13/2005 | DE102005014052A1 Silicon block cutting method for use in e.g. electronic field, involves holding block in cut area after block is cut, such that individual slices are firmly clamped on opposite sides by membrane, and releasing portion of un-cut block |
| 10/13/2005 | DE102004013038A1 Saw system for slicing hard brittle material especially crystal has a set of parallel saw blades each backed by a polishing blade in a common holder |
| 10/06/2005 | US20050221585 Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon |
| 10/06/2005 | US20050217656 Method and apparatus for cutting ultra thin silicon wafers |
| 10/05/2005 | EP1583140A1 Method for producing semiconductor single crystal wafer and laser processing device used therefor |
| 10/05/2005 | CN1678439A Pasted base board cutting system and base board cutting method |
| 10/05/2005 | CN1677622A Method of dicing semiconductor wafer into chips, and apparatus using this method |
| 09/29/2005 | US20050215078 Scribing sapphire substrates with a solid state UV laser |
| 09/29/2005 | US20050215033 Method of dicing semiconductor wafer into chips, and apparatus using this method |
| 09/29/2005 | US20050211236 Dicing saw with variable indexing capability |
| 09/29/2005 | DE102004011991A1 Wire saw for separating disks from a workpiece comprises a bearing formed by a system of leaf springs that move the workpiece at the end positions of a seesaw motion a specified height from a wire grid |
| 09/28/2005 | EP1580800A1 Method for cutting semiconductor substrate |
| 09/28/2005 | EP1579971A1 Method for dividing substrate and method for manufacturing substrate using such method |
| 09/28/2005 | CN1675041A Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 09/28/2005 | CN1675021A Method of breaking a brittle substrate |
| 09/27/2005 | US6949449 Method of forming a scribe line on a ceramic substrate |
| 09/27/2005 | US6949015 Machining apparatus equipped with rotary tool |
| 09/22/2005 | WO2005087458A1 Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| 09/22/2005 | WO2004082730A3 Protective sheath for a cannula |
| 09/22/2005 | DE10335063B4 Automatisches Aufkitten von Si-Stäben auf die Sägeunterlage Automatic cementing of Si rods on the Sägeunterlage |
| 09/22/2005 | DE102004010377A1 Herstellung von Substratwafern für defektarme Halbleiterbauteile, ihre Verwendung, sowie damit erhaltene Bauteile Preparation of substrate wafers for low-defect semiconductor devices, their use, and thus obtained components |
| 09/20/2005 | US6945844 Methods for dynamically controlling a semiconductor dicing saw |
| 09/20/2005 | US6945521 Fluid mixing device and cutting device |
| 09/20/2005 | US6945242 Cutting method using wire saw, wire saw device, and method of manufacturing rare-earth magnet |
| 09/15/2005 | WO2005084874A1 Laser processing equipment |
| 09/15/2005 | US20050202650 Method of dividing a wafer which has a low-k film formed on dicing lines |
| 09/15/2005 | US20050202596 Laser processing method |
| 09/15/2005 | US20050199592 Laser based splitting method, object to be split, and semiconductor element chip |
| 09/14/2005 | EP1574485A1 Process for free-form cutting bent substrates of brittle material |
| 09/14/2005 | CN1667798A Method and apparatus for cleaving a wafer, method and apparatus for manufacturing semiconductor device |
| 09/14/2005 | CN1667797A Method for manufacturing semiconductor device |
| 09/13/2005 | US6944370 Method of processing a semiconductor wafer |
| 09/13/2005 | US6941940 Wire saw and process for slicing multiple semiconductor ingots |
| 09/09/2005 | WO2005082588A2 Saw for a semiconductor device |
| 09/08/2005 | US20050196899 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid |
| 09/08/2005 | US20050194364 Laser processing method and laser processing apparatus |
| 09/08/2005 | US20050193942 Method for making substrate wafers for low-defect semiconductor components, obtained thereby and uses thereof |
| 09/08/2005 | DE202005007894U1 Thin, plate shaped article e.g. silicon wafer, breaking device, has support mat with oval, semicircle or wedge shaped clearance recess below scratching line of article, where recess extends in moving direction of breaking stamp |
| 09/08/2005 | DE102005004845A1 Wafer-Unterteilungsverfahren Wafer dividing method |
| 09/07/2005 | EP1571242A2 Production of substrate wafers for low defect semiconductor components, applications thereof and components made therewith |
| 09/07/2005 | EP1570941A2 Laser based splitting method, object to be split, and semiconductor element chip |
| 09/07/2005 | CN1665656A Device and method for scribing substrate of brittle material |
| 09/06/2005 | US6939785 Process for manufacturing a semiconductor chip |
| 09/06/2005 | US6939199 Method and apparatus for cutting semiconductor wafers |
| 09/01/2005 | WO2005080059A1 Nozzle assembly for a saw for semiconductors |
| 09/01/2005 | US20050189330 Laser processing method and laser processing apparatus |
| 08/31/2005 | EP1568457A1 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface |
| 08/31/2005 | EP1385683B1 Substrate- layer cutting device and method associated therewith |
| 08/31/2005 | CN2721365Y Drawing table style downward diamond excircle cutting and sheet dividing machine |
| 08/25/2005 | WO2005077850A1 System for cutting plate glass |
| 08/25/2005 | US20050186761 Group encapsulated dicing chuck |
| 08/25/2005 | US20050184037 Laser processing method and laser processing apparatus |
| 08/25/2005 | US20050183713 Wire sawing apparatus and wire sawing method |
| 08/25/2005 | DE102004012402B3 Laser-cutting process to manufacture a three-dimensionally curved automotive windscreen |
| 08/24/2005 | CN1657921A Preparation method of X-ray diffraction sample rack |
| 08/24/2005 | CN1657220A Laser based splitting method, object to be split, and semiconductor element chip |
| 08/23/2005 | US6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus |
| 08/18/2005 | US20050181581 Laser processing method and laser processing apparatus |
| 08/18/2005 | US20050178241 Grindable self-cleaning singulation saw blade and method |
| 08/17/2005 | EP1390184B1 Method for treating an exhausted glycol-based slurry |
| 08/17/2005 | CN1655912A Machining apparatus and methods |
| 08/16/2005 | US6929537 Slurry recycling method |
| 08/16/2005 | US6929000 Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle |
| 08/11/2005 | US20050173387 Laser processing method and laser processing apparatus |
| 08/11/2005 | DE102004058194A1 Saw-strip, has two surfaces fixed to crystal piece and carrier plate, respectively, where strip cuts semi conductor disc from piece using wire saw and separates from strip by drilling holes in strip |
| 08/10/2005 | EP1561557A1 Method for treating an exhausted glycol-based slurry |
| 08/10/2005 | EP1341730B1 Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone |
| 08/10/2005 | CN1652305A Cutting device with a pair of cutting means |
| 08/04/2005 | US20050170613 Wafer dividing method |
| 08/04/2005 | US20050166745 Cutting device with a pair of cutting means |
| 08/03/2005 | EP1389158B1 Dual laser cutting of wafers |
| 08/03/2005 | CN1649709A Bi-directional singulation saw system and method |
| 08/02/2005 | US6923171 Device and method for determining the orientation of a crystallographic plane in relation to a crystal surface and device for cutting a single crystal in a cutting machine |
| 07/28/2005 | WO2005067682A2 An apparatus and method for controlled cleaving |
| 07/28/2005 | DE102004053329A1 Bearbeitungsvorrichtung unter Verwendung eines Laserstrahls Machining apparatus using a laser beam |