| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 07/20/2006 | DE10296621B4 Polierkissen und System Polishing pad and system |
| 07/18/2006 | US7077120 Substrate cutting method |
| 07/13/2006 | WO2006073094A1 Process for producing group iii nitride substrate |
| 07/13/2006 | US20060151443 Laser processing device |
| 07/13/2006 | DE10103592B4 Säge zum Zerteilen von Materialien in dünne Scheiben, insbesondere zum Zerteilen von Wafern aus Silizium Saw for cutting of materials in thin slices, especially for cutting wafers of silicon |
| 07/12/2006 | CN2794786Y Germ processing octagonal hand for automatic positioning |
| 07/12/2006 | CN1802243A Diamond wheel and scribing device |
| 07/12/2006 | CN1800292A Abrasive grain and semiconductor block slicing method using the same |
| 07/12/2006 | CN1799767A Tool cover device |
| 07/06/2006 | WO2006070825A1 Method for cutting brittle material substrate and substrate cutting system |
| 07/06/2006 | WO2006070534A1 Electrodeposition wire tool |
| 07/06/2006 | US20060145399 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 07/06/2006 | US20060144828 Device and method for laser processing |
| 07/05/2006 | EP1677346A2 Machining substrates, particularly semiconductor wafers |
| 07/05/2006 | CN2792741Y Diamond saw sheet for processing jade |
| 07/05/2006 | CN1798631A Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 06/29/2006 | US20060138189 Apparatus and method for splitting substrates |
| 06/29/2006 | US20060137674 Diamond cutting method and diamond provided by the method |
| 06/29/2006 | US20060137504 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| 06/28/2006 | EP1674558A1 Slurry for slicing silicon ingot and method for slicing silicon ingot using same |
| 06/28/2006 | CN1795542A Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 06/28/2006 | CN1792597A Autocontrolling multiline rotating, point cutter for diamond |
| 06/28/2006 | CN1261282C Scriber wheel for brittle base-board |
| 06/22/2006 | DE102005023238B3 Device for breaking thin, flat-shaped object has base plate with supporting mat turned upside down in direction of plunger and flat-shaped object has scratched line along lower side of supporting mat |
| 06/21/2006 | CN1791497A Method for cleaning sic particles |
| 06/21/2006 | CN1788965A Apparatus and method for slicing an ingot |
| 06/21/2006 | CN1260176C Method for manufacturing sintered magnet |
| 06/20/2006 | US7063246 Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus |
| 06/15/2006 | WO2006062017A1 Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam |
| 06/15/2006 | WO2006061043A1 Workpiece holder and method for wire sawing |
| 06/15/2006 | WO2006047326B1 Sacrificial substrate for etching |
| 06/15/2006 | US20060124119 Method for cutting diamond |
| 06/14/2006 | EP1670046A1 Semiconductor substrate cutting method |
| 06/14/2006 | CN1785578A 激光束加工机 Laser beam processing machine |
| 06/14/2006 | CN1259264C Device and method for breaking fragile material substrate and system with the device for dividing substrate |
| 06/13/2006 | US7060355 Polycrystalline silicon rod and method of processing the same |
| 06/07/2006 | EP1666221A1 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| 06/07/2006 | CN1784249A Protective sheath for a cannula,injection part including said sheath and needle with said sheath |
| 06/07/2006 | CN1783432A Rectangular substrate dividing apparatus |
| 06/07/2006 | CN1781686A Supersonic vibration cutting device |
| 06/07/2006 | CN1781684A Cutting machine |
| 06/07/2006 | CN1781657A Cutting device |
| 06/06/2006 | US7056070 Jewelry setting/presetting tool |
| 05/31/2006 | CN1780901A Slurry for slicing silicon ingot and method for slicing silicon ingot using same |
| 05/31/2006 | CN1780717A Multi-wire saw |
| 05/31/2006 | CN1779919A 晶片分割方法 Segmentation wafers |
| 05/31/2006 | CN1779918A Wafer dividing method and dividing apparatus |
| 05/31/2006 | CN1779917A Method for dividing semiconductor wafer along streets |
| 05/31/2006 | CN1779914A Silicon wafer laser processing method and laser beam processing machine |
| 05/30/2006 | US7052976 Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| 05/30/2006 | US7051729 Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle |
| 05/24/2006 | EP1433195B1 Method and apparatus for machining substrates |
| 05/24/2006 | CN1776888A Cutting device |
| 05/18/2006 | US20060101858 Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 05/18/2006 | DE19953157B4 Schneidvorrichtung für keramische Grünkörper Cutting device for ceramic green body |
| 05/17/2006 | EP1656235A1 Method for the production of components |
| 05/17/2006 | CN1773680A Cutting device |
| 05/17/2006 | CN1256229C Substrate layer cutting device and related method |
| 05/16/2006 | US7045093 A method for manufacturing a sintered magnet includes the steps of producing a green compact of powder for the sintered magnet, machining the green compact with a wire-saw, and sintering the green compact. |
| 05/16/2006 | US7044120 Baseplate for tool |
| 05/11/2006 | US20060097022 Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus |
| 05/11/2006 | DE102004040671B4 Method for breaking-up thin, plate-shaped substrate or wafer along scribed line so placing wafer etc. on two-part support |
| 05/11/2006 | DE10136534B4 Wafer-Schneidemaschine Wafer cutting machine |
| 05/10/2006 | CN1769987A Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus |
| 05/10/2006 | CN1255858C Scribing device and method for fragile material substrate |
| 05/09/2006 | US7040969 Method and apparatus for grinding magnetic member and method and apparatus for treating waste fluid |
| 05/04/2006 | WO2006047326A1 Sacrificial substrate for etching |
| 05/04/2006 | WO2006046525A1 Method and device for forming crack |
| 05/04/2006 | US20060094342 Monolithic rotating tool |
| 05/03/2006 | EP1653505A2 Method for fabricating and connecting a semiconductor power switching device |
| 05/03/2006 | CN2776653Y Belt saw clamping structure of quartz chip cutting machine |
| 05/03/2006 | CN1768422A Apparatus and method for picking up semiconductor chip |
| 05/03/2006 | CN1766590A Apparatus and method for detecting broken blade of scribing machine |
| 05/03/2006 | CN1254354C Knife flywheel holder |
| 04/27/2006 | CA2515924A1 Improved round cut for gemstone |
| 04/26/2006 | EP1649965A1 Laser beam machining method, laser beam machining apparatus, and laser machined product |
| 04/26/2006 | EP1649557A2 Method of forming a scribe line on a passive electronic component substrate |
| 04/25/2006 | US7032586 Single point engraving cutter tip |
| 04/20/2006 | WO2006040988A1 Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| 04/19/2006 | EP1237673A4 Rocking apparatus and method for slicing a work piece utilizing a diamond impregnated wire |
| 04/13/2006 | WO2006038565A1 Brittle material scribing method and scribing apparatus |
| 04/13/2006 | US20060075687 Slurry for slicing silicon ingot and method for slicing silicon ingot using same |
| 04/12/2006 | CN2770925Y Jewelry diamond |
| 04/12/2006 | CN1758993A Substrate dividing apparatus and method for dividing substrate |
| 04/12/2006 | CN1758986A Laser beam machining method |
| 04/12/2006 | CN1758985A Laser beam machining method |
| 04/12/2006 | CN1250468C Flat display panel and method of dividing the flat display panel |
| 04/11/2006 | US7025665 Method and apparatus for cutting ultra thin silicon wafers |
| 04/11/2006 | US7025054 Method of cutting rare-earth alloy |
| 04/06/2006 | WO2006035870A1 Laser processing method and laser processing apparatus |
| 04/05/2006 | EP1641591A1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 04/05/2006 | CN1248839C Cut-off apparatus and cut-off method |
| 03/30/2006 | US20060065647 Method for cutting substrate using coolant |
| 03/30/2006 | US20060065262 Group encapsulated dicing chuck |
| 03/30/2006 | DE112004000768T5 Verfahren und Vorrichtung zum Trennen eines plattenartigen Elements Method and apparatus for separating a plate-like member |
| 03/29/2006 | EP1534463B1 Method of breaking a brittle substrate |
| 03/29/2006 | CN1247730C Mass ultraprecise processing mucilage glue for Ultrathin monocrystal single substrate and its process |
| 03/29/2006 | CN1247387C Forming mark on gemstone or industrial diamond |
| 03/28/2006 | US7018270 Method and apparatus for cutting semiconductor wafers |
| 03/28/2006 | US7017570 Apparatus and method for splitting substrates |