| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
|---|
| 12/07/2006 | WO2006082585A3 Sample preparation for micro-analysis |
| 12/07/2006 | DE19626396B4 Verfahren und Vorrichtung zur Herstellung und zum Schleifen von Siliziumscheiben Method and apparatus for the production and grinding of silicon wafers |
| 12/07/2006 | DE102005023618B3 Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel Means for separating of silicon wafers from a stack |
| 12/06/2006 | CN1872433A Processing machine with washing device |
| 11/30/2006 | WO2006125559A1 Device for the separation of substrates from a stack |
| 11/30/2006 | DE10054038B4 Verfahren zum Trennen eines plattenförmigen Körpers, insbesondere eines Halbleiterwafers, in Einzelstücke A method of separating a plate-shaped body, in particular a semiconductor wafer, into individual pieces |
| 11/29/2006 | EP1725384A1 Nozzle assembly for a saw for semiconductors |
| 11/29/2006 | EP1368172A4 Method and apparatus for cutting workpieces |
| 11/29/2006 | CN1871104A Method for scribing substrate of brittle material and scriber |
| 11/23/2006 | US20060261117 Breaking device for separating ceramic printed circuit boards |
| 11/23/2006 | DE202006005237U1 Device for breaking of semiconductor disks or wafers has breaking wedge, tilted and aligned opposite to section of semiconductor disk for single semiconductor disk that is pre scratched in initial area of reference break line |
| 11/22/2006 | EP1724082A1 Device for breaking a thin plate-like workpiece |
| 11/22/2006 | EP1722950A2 Saw for a semiconductor device |
| 11/22/2006 | CN1867435A Work cutting device and work cutting method |
| 11/22/2006 | CN1866474A Process for exfoliating a thin film |
| 11/21/2006 | US7137865 Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 11/16/2006 | WO2006120736A1 Method for producing silicon block and silicon wafer |
| 11/16/2006 | US20060258268 Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same |
| 11/16/2006 | US20060255024 Laser beam machining method |
| 11/15/2006 | EP1721695A1 Laser processing equipment |
| 11/15/2006 | EP1097782B1 Wire saw and cutting method |
| 11/15/2006 | CN1863740A Scribe head, scribe apparatus and scribe method using the scribe head |
| 11/15/2006 | CN1285103C Method and apparatus for cutting devices from conductive substrated |
| 11/15/2006 | CN1284657C Method for cutting slice from workpiece |
| 11/14/2006 | US7134582 Substrate and method of separating components from a substrate |
| 11/09/2006 | US20060249134 Multi-wire saw |
| 11/08/2006 | CN1857878A Ultrasonic scroll saw cutting process for non-conductive hard fragile material |
| 11/07/2006 | US7131562 Scribing and breaking apparatus, system therefor, and scribing and breaking method |
| 11/02/2006 | WO2006115466A1 Improved net block assembly |
| 11/02/2006 | US20060245138 Perforated plate for water chuck |
| 11/02/2006 | EP1717001A1 Method for manufacturing semiconductor wafers, method for their slicing and wire saw used for the same |
| 11/02/2006 | DE102005016518B3 Substrate replacing and separating device for e.g. wafers, has gripping and transfer mechanism that has gripping components for holding substrates chiseled from substrate block on carrier system, and tilting mechanism for held substrates |
| 11/01/2006 | CN1856392A Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| 10/31/2006 | US7129150 Method of dividing a semiconductor wafer |
| 10/25/2006 | CN1282228C Method and device for cutting non-metal substrate |
| 10/19/2006 | DE112004001036T5 Diamantscheibe und Ritzvorrichtung Diamond blade and scoring device |
| 10/18/2006 | EP1713118A1 Method for manufacturing semiconductor wafer and system for determining cut position of semiconductor ingot |
| 10/18/2006 | EP1712339A1 Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel |
| 10/18/2006 | CN1280077C Method for separation, regeneration and reuse of exhausted glycol-based slurry |
| 10/12/2006 | US20060228565 Polycrystalline silicon rod and method for processing the same |
| 10/12/2006 | DE102004013038B4 Sägevorrichtung zum Sägen eines Werkstücks aus hartem sprödem Material Sawing device for sawing of a workpiece made of hard brittle material |
| 10/11/2006 | CN2825256Y Perforating machine for jade and pearl |
| 10/11/2006 | CN2825255Y Device for cutting monocrystalline silicon to rectangle |
| 10/11/2006 | CN2825254Y Band saw for quartz materials cutting machine |
| 10/04/2006 | CN2822840Y Double edge diamond drilling bit |
| 10/04/2006 | CN1841702A Wafer cutting method and device thereof |
| 10/04/2006 | CN1278305C Method for cutting wafer, mechanism and magnetic tape head assembly for cutting wafer |
| 10/03/2006 | US7115443 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 10/03/2006 | US7114424 Wire sawing device |
| 10/01/2006 | CA2524988A1 Multiplet jewelry product and method of manufacture |
| 09/28/2006 | WO2006101091A1 Laser machining method |
| 09/28/2006 | WO2006101087A1 Scribe device |
| 09/28/2006 | WO2005008849A3 Method of forming a scribe line on a passive electronic component substrate |
| 09/26/2006 | US7112518 Method and apparatus for cutting devices from substrates |
| 09/21/2006 | US20060211220 Method and device or dividing plate-like member |
| 09/20/2006 | CN2818116Y Positioning seat for processing jade |
| 09/20/2006 | CN1835823A Method for the production of components |
| 09/14/2006 | US20060201983 Glass cutting method |
| 09/14/2006 | DE10019601B4 Layer composite material for sliding elements and for plain bearings, particularly crankshaft bearing, camshaft bearings or connecting rod bearings, comprises primary layer made from copper alloy or aluminum alloy |
| 09/13/2006 | EP1700678A1 Scribe head and scribe device |
| 09/13/2006 | EP1700677A1 Scribe line forming mechanism, scribe head, and scribe device |
| 09/12/2006 | US7105103 System and method for the manufacture of surgical blades |
| 09/08/2006 | WO2006092035A1 Method and system for laser marking in the volume of gemstones such as diamonds |
| 09/06/2006 | EP1490191A4 System and method for the manufacture of surgical blades |
| 09/05/2006 | US7101797 Substrate processing device and processing method |
| 08/31/2006 | WO2006090632A1 Method and device for cutting fragile material plate |
| 08/31/2006 | WO2006022597A3 Supply mechanism for the chuck of an integrated circuit dicing device |
| 08/31/2006 | US20060194416 Method for producing single crystal ingot from which semiconductor wafer is sliced |
| 08/30/2006 | CN1826207A Laser machining method and device, and machined product |
| 08/30/2006 | CN1824482A 切削装置 Cutting device |
| 08/29/2006 | US7098118 Method and apparatus for machining substrate |
| 08/24/2006 | DE19840388B4 Vorrichtung zum Positionieren und Vereinzeln einer Vielzahl von mittels einer Trägerschicht verbundenen Mikroabformteilen Device for positioning and separating a plurality of connected by means of a carrier layer Mikroabformteilen |
| 08/23/2006 | EP1692719A1 Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 08/17/2006 | US20060184113 Protective sheath for a cannula, injection unit comprising such a sheath and needle provided with such a sheath |
| 08/17/2006 | US20060183298 Method for manufacturing a ceramic/metal substrate |
| 08/16/2006 | EP1690660A1 Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| 08/16/2006 | CN1819159A Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device |
| 08/16/2006 | CN1818753A Flat display panel and method of dividing the flat display panel |
| 08/16/2006 | CN1817603A Wafer dividing method |
| 08/16/2006 | CN1270000C Method and device for cutting single crystals, in addition to an adjusting device and a test method for determining a crystal orientation |
| 08/10/2006 | WO2006082899A1 Method of working sintered diamond, cutter wheel for substrate and method of working the same |
| 08/10/2006 | WO2006082585A2 Sample preparation for micro-analysis |
| 08/09/2006 | CN1815694A Semiconductor processing process |
| 08/09/2006 | CN1268466C Method and device for cutting nonmetal substrate using laser beam |
| 08/08/2006 | US7087857 Method of dividing a workpiece in the form of a plate having a layer and a substrate made of different materials |
| 08/08/2006 | US7086394 Grindable self-cleaning singulation saw blade and method |
| 08/03/2006 | US20060169113 Blade assembly cover |
| 08/02/2006 | EP1685934A1 Wire sawing device and process |
| 08/02/2006 | EP1685927A1 Multi-wire saw |
| 08/02/2006 | CN1812056A Method of machining substrate and method of manufacturing element |
| 08/02/2006 | CN1810480A Method for manufacturing a doughnut-shaped glass substrate |
| 08/01/2006 | US7082940 Wire sawing apparatus and wire sawing method |
| 07/27/2006 | US20060163209 Laser machining |
| 07/27/2006 | US20060162717 Apparatus and methods for aligning a center of mass with a rotational axis of a shaft or spindle |
| 07/27/2006 | DE102005007312B4 Process to cut slices of semiconductor wafer material from a cylindrical block with regulated spray application of slurry |
| 07/26/2006 | CN1809512A Brittle board dividing system and brittle board dividing method |
| 07/26/2006 | CN1265947C Equipment for cutting liquid crystal display panel |
| 07/26/2006 | CN1265929C Method for cutting non-metal base |
| 07/26/2006 | CN1265925C Workpiece cutting device and method |
| 07/20/2006 | US20060160331 Laser processing method and laser processing apparatus |