| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 04/05/2007 | WO2007037118A1 Laser cutting device, laser cutting system and laser cutting method for brittle material |
| 04/05/2007 | WO2007037096A1 Method for manufacturing (110) silicon wafer |
| 04/05/2007 | DE102005046479A1 Separation of brittle materials such as a semiconductor into parts uses a formed fracture inducing channel |
| 04/04/2007 | CN1941290A Unpolished semiconductor wafer and manufacture method thereof |
| 04/04/2007 | CN1939661A 切削装置 Cutting device |
| 04/04/2007 | CN1308113C Method and apparatus of ablating an opening in a hard, non-metallic substrate |
| 04/03/2007 | US7199026 Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same |
| 03/29/2007 | WO2007035097A2 Device and method for separating electronic components |
| 03/29/2007 | US20070072395 Substrate and method of separating components from a substrate |
| 03/29/2007 | US20070068504 Group encapsulated dicing chuck |
| 03/28/2007 | CN1938837A Method of forming a scribe line on a ceramic substrate |
| 03/28/2007 | CN1938828A 激光加工方法及半导体芯片 The laser processing method and a semiconductor chip |
| 03/28/2007 | CN1938136A Method and apparatus for cutting ultra thin silicon wafers |
| 03/28/2007 | CN1935480A Partition device and alignment method for wafer |
| 03/28/2007 | CN1307442C Method of cutting workpiece of film filter |
| 03/22/2007 | WO2007032392A1 Laser processing method and laser processing device |
| 03/22/2007 | WO2007032346A1 Cutter and cutting apparatus provided with disc-shaped cutting blade |
| 03/22/2007 | US20070063402 Substrate processing table and substrate processing device |
| 03/22/2007 | US20070062511 Group encapsulated dicing chuck |
| 03/21/2007 | EP1423244B1 Devices for detaching substrates and the associated methods |
| 03/21/2007 | CN2880443Y Monocrystalline silicon rod square cutting and barelling processing machine tool |
| 03/21/2007 | CN1933942A Electrodeposition wire tool |
| 03/21/2007 | CN1931551A Cutting apparatus and processing method |
| 03/21/2007 | CN1305655C Machining apparatus and methods |
| 03/21/2007 | CN1305654C Bi-directional singulation saw system and method |
| 03/20/2007 | US7192337 Method for cutting diamond |
| 03/15/2007 | DE10117923B4 Halbleiterwaferschneidmaschine Semiconductor wafer cutting machine |
| 03/15/2007 | DE10116791B4 "Verfahren zur Herstellung einer großen Anzahl von Halbleiterchip s aus einem Halbleiterwafer" "A process for producing a large number of semiconductor chip S from a semiconductor wafer" |
| 03/14/2007 | EP1412149B1 Machine for cutting wafers |
| 03/14/2007 | CN1929978A Method for forming vertical crack on brittle board and vertical crack forming apparatus |
| 03/14/2007 | CN1927565A Ink-jet printing head manufacturing method |
| 03/14/2007 | CN1927520A 激光束加工机 Laser beam processing machine |
| 03/13/2007 | US7189304 Substrate layer cutting device and method |
| 03/08/2007 | WO2007026512A1 Method of improving nanotopography on surface of wafer and wire saw device |
| 03/08/2007 | WO2006134532A3 A tool for stretching the foil of a foil carrier, a machine for removing dies from a wafer and a method for removing dies |
| 03/08/2007 | DE102005038639B4 Verfahren und Vorrichtung zur Vermessung, Ausrichtung und Fixierung sowie Befestigung von Einkristallen auf einem gemeinsamen Träger Method and apparatus for measuring, aligning and fixing and mounting of single crystals on a common carrier |
| 03/07/2007 | CN1925945A Laser processing apparatus |
| 03/06/2007 | CA2291041C Diamond marking |
| 03/01/2007 | US20070045229 System and method for the manufacture of surgical blades |
| 03/01/2007 | DE102005016519B3 Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates |
| 02/28/2007 | EP1757419A1 Method, apparatus and slurry for wire sawing |
| 02/28/2007 | EP1756253A1 Matrix liquid for producing a chip removal suspension, and used as a lubricating or machining liquid |
| 02/28/2007 | EP1755816A1 Abrasive wire sawing |
| 02/27/2007 | US7183137 Method for dicing semiconductor wafers |
| 02/27/2007 | US7182234 Substrate cutting device and method |
| 02/22/2007 | WO2007020835A1 System for brittle material cutting process and method employed therein |
| 02/22/2007 | WO2007020822A1 Laser processing method |
| 02/22/2007 | US20070039932 Device for separative machining of components made from brittle material with stress-free component mounting |
| 02/21/2007 | EP1284847B1 Wire saw and process for slicing multiple semiconductor ingots |
| 02/15/2007 | DE19723078B4 Verfahren und Vorrichtung zur Reinigung von Wafern Method and apparatus for cleaning wafers |
| 02/14/2007 | CN2868630Y Diamond horizontal boring machine |
| 02/14/2007 | CN1914014A Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel |
| 02/14/2007 | CN1911623A Manufacturing method of songhua jade health-care product |
| 02/13/2007 | US7174620 Method of manufacturing thin quartz crystal wafer |
| 02/08/2007 | DE112005000025T5 Glasschneideverfahren und Gerät dazu Glass cutting method and apparatus to |
| 02/08/2007 | DE102005038027A1 Verfahren zum Durchtrennen von spröden Flachmaterialien A method for separating brittle flat materials |
| 02/07/2007 | EP1748873A1 Method and apparatus for cutting ultra thin silicon wafers |
| 02/07/2007 | CN1910035A An apparatus and method for controlled cleaving |
| 02/07/2007 | CN1907646A Cutting apparatus equipped with blade detection means |
| 02/07/2007 | CN1298523C Method and device for scribing fragile material substrate |
| 02/07/2007 | CN1298292C System and method for the manufacture of surgical blades |
| 02/06/2007 | USRE39484 Process for the production of thin semiconductor material films |
| 01/31/2007 | EP1748474A1 Laser processing method and semiconductor chip |
| 01/31/2007 | EP1747867A1 Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| 01/31/2007 | CN1906740A Method of producing III-nitride substrate |
| 01/31/2007 | CN1906003A Scribe head and scribe device |
| 01/31/2007 | CN1906002A Scribe forming structure, scribe head and scribe device |
| 01/30/2007 | US7169688 Method and apparatus for cutting devices from substrates |
| 01/25/2007 | WO2007010810A1 Laser processing apparatus and method for adjusting same |
| 01/24/2007 | CN2860801Y Modified transmission joint device structure for quartz crystal cutting machine |
| 01/24/2007 | CN1296988C Method and wafer for maintaining ultra clean bonding pads on a wafer |
| 01/17/2007 | EP1743368A1 Sawing and handler system for manufacturing semiconductor package |
| 01/17/2007 | EP1742757A1 Device for separative machining of components made from brittle material with stress-free component mounting |
| 01/11/2007 | WO2007005823A2 Semiconductor wafer cutting blade and method |
| 01/11/2007 | WO2007004890A1 Reduction of attraction forces between silicon wafers |
| 01/11/2007 | WO2007004700A1 Brittle material scribing wheel, method for manufacturing such brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel |
| 01/10/2007 | EP1742253A1 Laser processing method and semiconductor chip |
| 01/10/2007 | EP1741680A1 System for cutting plate glass |
| 01/10/2007 | EP1741534A1 Method for forming vertical crack on brittle board and vertical crack forming apparatus |
| 01/10/2007 | EP1741527A1 Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| 01/10/2007 | CN1891422A Apparatus for scribing a substrate in use for a flat panel display |
| 01/04/2007 | US20070004175 Semiconductor wafer cutting blade and method |
| 01/03/2007 | EP1739731A1 Process for producing group iii nitride substrate |
| 01/03/2007 | EP1738886A1 Method of detecting dysfunctions in a wire sawing device and device for carrying out said method |
| 01/03/2007 | CN2853367Y Slip limiting structure of band-saw driving wheel of quartz cutter |
| 01/03/2007 | CN1890797A Semiconductor substrate assemblies and methods for preparing and dicing the same |
| 01/03/2007 | CN1890074A Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| 12/28/2006 | US20060289410 Laser machining apparatus |
| 12/27/2006 | EP1735142A2 An apparatus and method for controlled cleaving |
| 12/21/2006 | WO2006134532A2 A tool for stretching the foil of a foil carrier, a machine for removing dies from a wafer and a method for removing dies |
| 12/21/2006 | WO2006133798A1 Device and method for positioning and blocking thin substrates on a cut substrate block |
| 12/21/2006 | DE102005028112A1 Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung A method for positioning and station keeping of substrates, especially of thin silicon wafers after wire sawing at their singulation |
| 12/20/2006 | EP1385683B8 Substrate- layer cutting device and method associated therewith |
| 12/20/2006 | CN2848520Y Band saw adjusting device of quartz chip cutter |
| 12/19/2006 | US7151045 Method for separating sapphire wafer into chips using dry-etching |
| 12/13/2006 | EP1635990B1 Laser bruting machine |
| 12/13/2006 | CN1289275C Machine for cutting wafers |
| 12/07/2006 | WO2006129798A1 Plate material cutting unit, cutting device having the cutting unit, and cutting facility having the cutting device |
| 12/07/2006 | WO2006129563A1 Device and method for cutting off substrate of fragile material |
| 12/07/2006 | WO2006128433A1 Device and method for lapping with a cutting wire |