| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 08/08/2007 | CN101013680A Dicing method and dicing device |
| 08/08/2007 | CN101011846A Cutting devie |
| 08/08/2007 | CN101011845A Scribing apparatus |
| 08/02/2007 | WO2007087510A1 Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control |
| 08/02/2007 | US20070175304 Nozzle assembly for a saw for semiconductors |
| 08/01/2007 | EP1814157A2 Sheet unit including a plurarity of organic light emitting display panels and fabricating method of the same |
| 08/01/2007 | CN1329949C Apparatus and method for splitting substrates |
| 07/26/2007 | WO2007082776A1 Method for representing release forces |
| 07/26/2007 | US20070170597 Process for producing components |
| 07/26/2007 | US20070170159 Laser beam machining method, laser beam machining apparatus, and laser beam machining product |
| 07/25/2007 | EP1811551A1 Laser beam machining method and semiconductor chip |
| 07/25/2007 | CN1328194C Layout liner |
| 07/25/2007 | CN1328028C Improved rectangular brilliant-cut diamond |
| 07/25/2007 | CN1328011C Method and apparatus for grinding magnetic components and method and apparatus for treatment of waste liquid |
| 07/25/2007 | CN1328008C Cutting process for rare-earth alloy |
| 07/25/2007 | CN1328002C Cutting method for workpiece |
| 07/25/2007 | CN101005021A Manufacturing method of semiconductor device |
| 07/19/2007 | US20070164072 Substrate dividing apparatus and method for dividing substrate |
| 07/18/2007 | CN1327491C Dicing method, inspecting method for integrated circuit chip, and substrate-retaining apparatus and adhesive film |
| 07/18/2007 | CN101001730A Bi-directional singulation system and method |
| 07/18/2007 | CN101001729A Vertical crack forming method and vertical crack forming device in substrate |
| 07/12/2007 | WO2007077589A1 Drilling device |
| 07/12/2007 | US20070158314 Laser processing method |
| 07/11/2007 | EP1806202A1 Method and device for forming crack |
| 07/11/2007 | CN1994713A Crystal grain separation device and separation method thereof |
| 07/11/2007 | CN1994712A Wafer and cutting method thereof |
| 07/10/2007 | US7241669 Method of forming a scribe line on a passive electronic component substrate |
| 07/05/2007 | WO2007074823A1 Laser beam machining method and semiconductor chip |
| 07/04/2007 | EP1804280A1 Laser beam machining method |
| 07/04/2007 | EP1803538A1 Brittle material scribing method and scribing apparatus |
| 07/04/2007 | CN1993201A Laser machining method and semiconductor device |
| 07/04/2007 | CN1993200A 激光加工方法 The laser processing method |
| 07/04/2007 | CN1324661C Method for dicing semiconductor wafers |
| 06/28/2007 | WO2007073356A2 Improved singulation system and method |
| 06/28/2007 | US20070148915 Device and method for cutting an assembly |
| 06/28/2007 | DE102006020824B3 Cutting lapping process for workpiece involves using wire saw tool running round workpiece to cut it into thin disks |
| 06/27/2007 | EP1800820A1 Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| 06/27/2007 | CN2917190Y Ceramic baseplate |
| 06/27/2007 | CN1322968C Jigsaw |
| 06/21/2007 | DE10035590B4 Drahtsäge und Verfahren zum Abtrennen von Scheiben von einem Werkstück Wire saw and method for cutting wafers from a workpiece |
| 06/20/2007 | CN2912878Y Annular saw thread sawing machine |
| 06/20/2007 | CN1983555A Semiconductor element and method of making same |
| 06/20/2007 | CN1982005A 线锯 Wire saw |
| 06/20/2007 | CN1982004A Cutting method by wire saw and cut workpiece supporting member in wire saw |
| 06/19/2007 | US7232741 Wafer dividing method |
| 06/19/2007 | US7232738 Device and method for cutting an assembly |
| 06/13/2007 | CN1978167A System and method for scribing sapphire substrates with a solid state uv laser |
| 06/12/2007 | US7228856 Diamond cutting method and diamond provided by the method |
| 06/07/2007 | US20070127995 End mill cutting method for hard brittle material |
| 06/07/2007 | US20070125757 Laser beam machining method |
| 06/06/2007 | CN1976877A System for cutting plate glass |
| 06/06/2007 | CN1974168A 切削装置 Cutting device |
| 06/06/2007 | CN1974167A Scoring device and method and multi braking system |
| 06/06/2007 | CN1974165A Process to separate pieces from a substrate |
| 06/06/2007 | CN1974104A Laser beam processing machine |
| 05/31/2007 | WO2007061018A1 Method of glass substrate working and glass part |
| 05/31/2007 | US20070122926 Substrate layer cutting device and method |
| 05/31/2007 | US20070119893 Substrate cutting device and method |
| 05/30/2007 | EP1789998A2 Supply mechanism for the chuck of an integrated circuit dicing device |
| 05/30/2007 | CN1970266A Cutter wheel, scribing device using the cutter wheel, and cutter wheel manufacturing device for manufacturing the cutter wheel |
| 05/30/2007 | CN1318177C Laser processing method |
| 05/29/2007 | US7223344 Method for treating an exhausted glycol-based slurry |
| 05/24/2007 | US20070117352 Method for dicing semiconductor wafers |
| 05/24/2007 | DE19746533B4 Verfahren zur Erzeugung eines Kühlmittelstromes für die Wafer-Bearbeitung A method for generating a coolant flow for the wafer processing |
| 05/24/2007 | CA2629726A1 New diamond uses/applications based on single-crystal cvd diamond produced at rapid growth rate |
| 05/23/2007 | CN1967816A Wafer and wafer cutting and dividing method |
| 05/23/2007 | CN1967815A Wafer product and processing method therefor |
| 05/23/2007 | CN1967805A Semiconductor device and dicing method for semiconductor substrate |
| 05/23/2007 | CN1967783A Laser processing apparatus and laser processing method |
| 05/23/2007 | CN1966232A 切削装置 Cutting device |
| 05/23/2007 | CN1966198A Laser beam processing machine |
| 05/23/2007 | CN1317102C Diamond cutting knife used for optical glass and gem precision processing |
| 05/18/2007 | WO2007054525A1 Method for dividing up substrates in wafer form by using adhesion forces |
| 05/16/2007 | CN1962964A Nano monocrystalline diamond and method for making same |
| 05/10/2007 | WO2007035097A3 Device and method for separating electronic components |
| 05/09/2007 | EP1782465A2 Method and apparatus for cleaving brittle materials |
| 05/09/2007 | CN2897546Y Arm of gem vehicle with grinding and polishing function |
| 05/03/2007 | WO2007049668A1 Method of forming scribe line on substrate of brittle material and scribe line forming apparatus |
| 05/02/2007 | CN1956814A Device and method for conditioning and monitoring of a saw blade |
| 05/02/2007 | CN1313256C Cutting knife angle-adjusting method |
| 05/01/2007 | US7211526 Laser based splitting method, object to be split, and semiconductor element chip |
| 05/01/2007 | CA2227185C Marking diamond |
| 04/26/2007 | WO2007045343A1 Device and method for fixing non-ferrous metal blocks |
| 04/26/2007 | US20070090100 Glass cutting method and apparatus therefor |
| 04/25/2007 | EP1777031A1 Laser processing method |
| 04/25/2007 | CN1954423A Sawing and handler system for manufacturing semiconductor package |
| 04/25/2007 | CN1953857A Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| 04/25/2007 | CN1953853A Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method |
| 04/25/2007 | CN1953835A Abrasive wire sawing |
| 04/25/2007 | CN1951658A Monocrystalline silicon square-cutting machine |
| 04/19/2007 | WO2005122243A3 Method and apparatus for cleaving brittle materials |
| 04/19/2007 | DE10029239B4 Vorrichtung zum Bearbeiten von magnetischen Bauteilen und Vorrichtung zur Behandlung von Abfallflüssigkeit Apparatus for processing magnetic components and apparatus for treating waste liquid |
| 04/18/2007 | EP1775059A1 Laser processing method and semiconductor device |
| 04/18/2007 | CN1947931A Apparatus for exchanging a cutting blade |
| 04/18/2007 | CN1311528C Method for forming scribe line on semiconductor wafer, and scribe line forming device |
| 04/12/2007 | WO2007040002A1 Method for producing semiconductor wafer and system for determining cutting position of semiconductor ingot |
| 04/12/2007 | US20070080187 Scribing and breaking apparatus and system therefor |
| 04/11/2007 | EP1772245A1 Vertical crack forming method and vertical crack forming device in substrate |
| 04/11/2007 | CN1946527A Saw for semiconductor device |
| 04/11/2007 | CN1943981A Apparatus for exchanging cutting blade |