| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 01/03/2008 | DE112005000025B4 Glasschneideverfahren Glass cutting method |
| 01/02/2008 | CN200998826Y Improved structure of ultrasonic rotating head |
| 01/02/2008 | CN101096075A Polishing method for optical cylindrical rod |
| 01/02/2008 | CN100359370C Method for cutting liquid crystal display panel |
| 01/02/2008 | CN100358818C Lining method for fragile material base plate and apparatus therefor |
| 01/02/2008 | CN100358697C Wire sawing apparatus |
| 01/02/2008 | CN100358661C Sawing wire |
| 12/26/2007 | CN101092049A Method of managing the processing result of wafer |
| 12/20/2007 | DE10045419B4 Verfahren zur Herstellung eines thermoelektrischen Bauelements, thermoelektrisches Bauelement sowie Vorrichtung zur Durchführung des Verfahrens A process for producing a thermoelectric device, a thermoelectric device, and device for carrying out the method |
| 12/19/2007 | EP1867427A1 Laser machining method |
| 12/13/2007 | WO2007142264A1 Substrate splitting apparatus, substrate splitting method, and split substrate split by using the apparatus or method |
| 12/13/2007 | US20070283944 Abrasive Wire Sawing |
| 12/13/2007 | DE60219034T2 Vorrichtungen zum abtrennen von substraten und zugehörige verfahren Procedural devices to separate from substrates and related |
| 12/12/2007 | CN101087678A Method for cutting brittle material substrate and substrate cutting system |
| 12/12/2007 | CN101086958A Ultraviolet radiation device and cutting machine with the same |
| 12/12/2007 | CN101085541A Cutting method for wafer |
| 12/11/2007 | US7306508 Multi-wire saw |
| 12/06/2007 | WO2007065665A1 Apparatus and method for cleaning a sawn wafer block |
| 12/06/2007 | WO2007059251A3 New diamond uses/applications based on single-crystal cvd diamond produced at rapid growth rate |
| 12/06/2007 | US20070281444 Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method |
| 12/05/2007 | EP1862280A1 Method for cutting brittle material substrate and substrate cutting system |
| 12/05/2007 | CN101083292A Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
| 12/05/2007 | CN101081530A Device and method for incising circular eyeglass |
| 12/05/2007 | CN100353503C Machining apparatus with rotary cutter |
| 11/29/2007 | US20070272223 Method for maintaining a polished concrete floor |
| 11/28/2007 | EP1782465A4 Method and apparatus for cleaving brittle materials |
| 11/28/2007 | CN101080360A Sacrificial substrate for etching |
| 11/28/2007 | CN100351032C Laser based splitting method, object to be split, and semiconductor element chip |
| 11/27/2007 | US7300422 Protective sheath for a cannula, injection unit comprising such a sheath and needle provided with such a sheath |
| 11/21/2007 | EP1855556A1 Method and system for laser marking in the volume of gemstones such as diamonds |
| 11/21/2007 | CN101075558A Method of silicon slices |
| 11/21/2007 | CN100350594C Method for cutting semiconductor wafer |
| 11/21/2007 | CN100349696C A novel laser diamond blocking machine for faceting the bottom of the diamond |
| 11/15/2007 | US20070261690 Sawing Yarn |
| 11/14/2007 | CN200974186Y Shuttle for processing artificial crystal diamond |
| 11/14/2007 | CN101073145A Division starting poin forming method in body to be divided, dividing method for body to be divided, and method of processing work by pulse laser beam |
| 11/14/2007 | CN101071791A Cutting method of chip and apparatus |
| 11/14/2007 | CN101071790A Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device |
| 11/13/2007 | US7294558 Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid |
| 11/08/2007 | WO2007127357A1 Precision slicing of large work pieces |
| 11/08/2007 | WO2007126393A2 An improved net table |
| 11/08/2007 | DE102006020821A1 Polysilicon rod separating device, has controlling device controlling feeding device such that feeding device feeds polysilicon rod into separating tool and desired piece of polysilicon rod is separated from rod |
| 11/07/2007 | CN200970858Y Diamond film cutter |
| 11/07/2007 | CN200970857Y Tool for drilling silicon single-crystal rod from irregular silicon briquette |
| 11/07/2007 | CN200970856Y Multi-axle controlled large size marking cutter |
| 11/07/2007 | CN200970855Y Double-beam laser double-line paddle-tumbler machine for solar silicon chip |
| 11/07/2007 | CN101069270A Supply mechanism for the chuck of an integrated circuit dicing device |
| 11/07/2007 | CN101068666A Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| 11/07/2007 | CN101066616A Vorrichtung und verfahren zum trennen von werkstoffen |
| 11/01/2007 | US20070252154 Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semiconductor Thin Film Chip, Electron Tube and Photo-Detecting Device |
| 10/31/2007 | CN101062576A Vacuum suction pencil and protection method for wafer conveying applying the same |
| 10/25/2007 | WO2007119740A1 Scribing method, scribing apparatus, and scribed substrate scribed by the method or apparatus |
| 10/25/2007 | US20070248126 Scribing sapphire substrates with a solid state uv laser |
| 10/24/2007 | EP1848027A2 Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| 10/24/2007 | EP1649557A4 Method of forming a scribe line on a passive electronic component substrate |
| 10/24/2007 | CN101058221A Water curtain special graphite sculpturing machine |
| 10/18/2007 | DE112004000581B4 Verfahren zum Schneiden von Glas A method for cutting glass |
| 10/17/2007 | EP1844913A2 Apparatus for cutting semiconductor devices |
| 10/17/2007 | EP1844891A1 Method of working sintered diamond, cutter wheel for substrate and method of working the same |
| 10/17/2007 | EP1844311A2 Sample preparation for micro-analysis |
| 10/16/2007 | US7281535 Saw singulation |
| 10/16/2007 | US7281334 Mechanical scribing apparatus with controlling force of a scribing cutter |
| 10/11/2007 | WO2007112984A1 Device for breaking semiconductor wafers using a breaking block |
| 10/11/2007 | WO2007112983A1 Device for breaking semiconductor wafers or similar substrates |
| 10/11/2007 | US20070235842 Semiconductor device and cutting equipment for cutting semiconductor device |
| 10/11/2007 | DE10122628B4 Verfahren zum Abtrennen von Scheiben von einem Werkstück A method for cutting wafers from a workpiece |
| 10/04/2007 | DE102006015142A1 Semiconductor wafer breaking device for manufacturing e.g. integrated circuit, has two counter supports which are provided and turned towards top side of semiconductor wafer, where supports are positioned at sides of preset break line |
| 10/03/2007 | EP1423244B9 Devices for detaching substrates and the associated methods |
| 10/03/2007 | CN101048255A Method and apparatus for forming cracks |
| 10/03/2007 | CN100340419C Mounting and preparing gemstone or industrial diamond for formation of mark on surface thereof |
| 09/27/2007 | DE102006032432B3 Sägeleiste sowie Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück unter Verwendung der Sägeleiste Saw strip, and method for simultaneously separating a plurality of slices of a cylindrical workpiece by using the saw strip |
| 09/26/2007 | CN101043992A Brittle material scribing method and scribing apparatus |
| 09/26/2007 | CN100339974C 晶片加工方法 Wafer processing method |
| 09/20/2007 | US20070214925 Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| 09/12/2007 | CN101032843A Wafer division method |
| 09/11/2007 | US7267037 Bidirectional singulation saw and method |
| 09/05/2007 | CN101031382A Laser machining apparatus and method of adjusting the same |
| 09/05/2007 | CN101028729A 切削装置 Cutting device |
| 09/05/2007 | CN101028728A Method of dividing wlp |
| 09/05/2007 | CN100335259C Method and device for machining fragile material |
| 09/04/2007 | US7265805 Method for cutting liquid crystal display panel wherein removing a particular portion of the seal line |
| 08/29/2007 | CN101027161A Laser processing method and laser processing apparatus |
| 08/23/2007 | WO2007094348A1 Laser scribing method, laser scribing apparatus and cut substrate cut by using such method or apparatus |
| 08/22/2007 | EP1819473A1 Workpiece holder and method for wire sawing |
| 08/22/2007 | CN1333443C Method for manufacturing semiconductor device |
| 08/22/2007 | CN101020347A Eggplant-shaped jewel cutting and polishing process |
| 08/22/2007 | CN101020346A Rose-shaped jewel cutting and polishing process |
| 08/16/2007 | WO2007073356A3 Improved singulation system and method |
| 08/16/2007 | US20070186918 Device and kit for visualizing a cutting regime of a diamond, and a method for determining a cutting regime |
| 08/16/2007 | DE102005013783B4 Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung A method for separating brittle materials by means of laser radiation with asymmetrical density distribution |
| 08/15/2007 | EP1399306B1 Method and device for cutting a single crystal |
| 08/15/2007 | CN2933812Y High-precision diamond cutting slice |
| 08/15/2007 | CN101016439A Chemical mechanical polishing pulp for sapphire substrate underlay |
| 08/15/2007 | CN101015943A Feeding controlling means for multi-wire saw working bench |
| 08/15/2007 | CN101015942A Controlling means of cycloidal generator in multi-wire saw take-up unit |
| 08/15/2007 | CN101015899A 切削装置 Cutting device |
| 08/08/2007 | EP1814817A1 Sacrificial substrate for etching |
| 08/08/2007 | EP1609559B1 Laser beam machining method |
| 08/08/2007 | CN2931051Y Spray cleaning apparatus for scribing machine |
| 08/08/2007 | CN1330596C Parting method for fragile material substrate and parting device using the method |