| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 06/25/2008 | EP1935599A1 Device and method for the separation and the transport of substrates |
| 06/25/2008 | CN101204836A Method and device for sawing a workpiece |
| 06/25/2008 | CN100396460C Device for separating materials |
| 06/18/2008 | CN101203362A Plate material cutting unit, cutting device having the cutting unit, and cutting facility having the cutting device |
| 06/18/2008 | CN101200102A Method for slicing a multiplicity of wafers from a workpiece |
| 06/17/2008 | US7387951 Method of dicing semiconductor wafer into chips, and apparatus using this method |
| 06/17/2008 | US7387119 Dicing saw with variable indexing capability |
| 06/12/2008 | WO2008069099A1 Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material |
| 06/12/2008 | US20080135532 Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate |
| 06/12/2008 | DE102006052910A1 Wafer-Herstellungs-Verfahren und -Vorrichtung Wafer manufacturing method and apparatus |
| 06/12/2008 | DE102006052908A1 Device for collecting a number of wafers to be separated by a holding element comprises a frame, a holder connected to a frame for holding the holding element, lateral guiding elements and a lower collecting element |
| 06/11/2008 | CN201070808Y Tool for cutting anomalistic large diameter monocrystal head, tail |
| 06/11/2008 | CN101198450A A tool for stretching the foil of a foil carrier, a machine for removing dies from a wafer and a method for removing dies |
| 06/11/2008 | CN101197316A 加工装置 Processing device |
| 06/11/2008 | CN101195259A Cutter mechanism of sheet type multi-layer ceramic capacitance inductance cutting machine |
| 06/11/2008 | CN101195190A Laser processing method and laser processing apparatus |
| 06/04/2008 | EP1926580A1 Reduction of attraction forces between silicon wafers |
| 06/04/2008 | CN101193732A Device and method for positioning and blocking thin substrates on a cut substrate block |
| 06/04/2008 | CN100392842C Apparatus and method for picking up semiconductor chip |
| 05/28/2008 | CN101188194A Bonded wafer and method for producing bonded wafer |
| 05/22/2008 | WO2008060244A2 Net block assembly |
| 05/21/2008 | CN201061901Y Round butt fixture |
| 05/21/2008 | CN100389082C Block cutting method, its product and use of the product |
| 05/20/2008 | US7373936 Portable finishing apparatus for hard material |
| 05/14/2008 | EP1920885A1 Method of improving nanotopography of surface of wafer and wire saw apparatus |
| 05/14/2008 | EP1920874A1 Laser processing method |
| 05/14/2008 | CN101180167A Device for the separation of substrates from a stack |
| 05/14/2008 | CN101176977A Processing technique of artificial crystal diamond semi-finished products |
| 05/14/2008 | CN100388428C Processing apparatus using laser beam |
| 05/08/2008 | WO2008054332A2 A unit lifter assembly |
| 05/08/2008 | DE10296690B4 Verfahren zur Herstellung eines Sintermagneten A process for producing a sintered magnet |
| 05/08/2008 | DE102006050330A1 Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben A method for simultaneously severing at least two cylindrical workpieces in a plurality of discs |
| 05/07/2008 | EP1918993A1 Method and device for structuring solar modules |
| 05/07/2008 | CN101174547A Wafer processing method |
| 04/30/2008 | CN101168270A Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers |
| 04/24/2008 | WO2008047790A1 Disklike cutting tool and cutting device |
| 04/24/2008 | WO2008047789A1 Disklike cutting tool and cutting device |
| 04/24/2008 | WO2008047622A1 Glass cutting apparatus, glass substrate disassembling apparatus, glass substrate disassembling system, glass cutting method and glass substrate disassembling method |
| 04/24/2008 | WO2008047446A1 Slurry for silicon ingot cutting and method of cutting silicon ingot therewith |
| 04/23/2008 | EP1232038B1 Method and apparatus for separating non-metallic materials |
| 04/23/2008 | CN101165858A Processing method for wafer |
| 04/23/2008 | CN100383929C Semiconductor processing process |
| 04/23/2008 | CN100383926C Laser beam machining method |
| 04/17/2008 | WO2008044840A2 Machining apparatus and semiconductor strip machining system using the same |
| 04/17/2008 | WO2008044613A1 Apparatus and method for edge processing of a sheet of brittle material |
| 04/17/2008 | WO2008044507A1 Scribe device and scribe method |
| 04/17/2008 | DE102004011991B4 Drahtsäge zum Abtrennen von Scheiben von einem Werkstück und Verfahren zum Abtrennen von Scheiben Wire saw for cutting wafers from a workpiece and methods of cutting wafers |
| 04/10/2008 | WO2008040782A1 Device for separating a stacked structure and related method |
| 04/10/2008 | DE202008000123U1 Kittstab Kittstab |
| 04/09/2008 | CN201044947Y Crystal face tropism processing X-ray position indicator |
| 04/03/2008 | DE102006044366A1 Simultaneous cutting of disks from a cylindrical workpiece by saw wires measures the density of the abrasive suspension in the tank, for replacement when at a threshold level |
| 04/02/2008 | EP1906438A1 Method for cutting workpiece |
| 04/01/2008 | US7351282 Cutting method and apparatus for ingot, wafer, and manufacturing method of solar cell |
| 03/27/2008 | WO2008035679A1 Laser processing method and laser processing apparatus |
| 03/27/2008 | WO2008035530A1 Cutting method and epitaxial wafer manufacturing method |
| 03/27/2008 | WO2008035529A1 Cutting method |
| 03/27/2008 | WO2008035513A1 Cutting method |
| 03/26/2008 | EP1901897A1 Device and method for positioning and blocking thin substrates on a cut substrate block |
| 03/20/2008 | WO2008032152A1 High-speed rotary diamond cutting machine |
| 03/19/2008 | CN101146657A Scribe device |
| 03/19/2008 | CN101146642A Laser machining method |
| 03/12/2008 | CN201033411Y Dust absorption main engine for environment-protection processing of jewellery |
| 03/12/2008 | CN101140868A Epitaxial wafer and method of producing same |
| 03/12/2008 | CN101138869A Monocrystalline silicon high-efficient composite cutting method and cutting system thereof |
| 03/05/2008 | EP1893392A2 A tool for stretching the foil of a foil carrier, a machine for removing dies from a wafer and a method for removing dies |
| 03/05/2008 | EP1893385A1 Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components |
| 03/05/2008 | CN101136361A Laser processing method |
| 03/05/2008 | CN101134265A Laser processing method and method of cutting semiconductor material substrate |
| 02/27/2008 | CN101132896A Method for manufacturing silicon block and silicon slice |
| 02/27/2008 | CN100372072C Plate-like workpiece dividing apparatus |
| 02/21/2008 | DE112005003549T5 Verfahren zur Herstellung von Siliziumblöcken und Siliziumwafern A process for producing silicon ingots and silicon wafers |
| 02/20/2008 | CN101128294A Method and device for cutting fragile material plate |
| 02/19/2008 | US7331495 Substrate and method of separating components from a substrate |
| 02/14/2008 | WO2007126393A3 An improved net table |
| 02/13/2008 | EP1886783A1 Plate material cutting unit, cutting device having the cutting unit, and cutting facility having the cutting device |
| 02/13/2008 | EP1886782A1 Device and method for cutting off substrate of fragile material |
| 02/13/2008 | CN101123188A Semiconductor wafers with highly precise edge profile and method for producing them |
| 02/13/2008 | CN101121287A Wafer fixing board |
| 02/13/2008 | CN100369235C Machining substrates, particularly semiconductor wafers |
| 02/13/2008 | CN100368502C Abrasive grain and semiconductor block slicing method using the same |
| 02/06/2008 | EP1883515A1 Device for the separation of substrates from a stack |
| 02/06/2008 | CN201017868Y Substrates separate machine |
| 02/06/2008 | CN100367466C Process for manufacturing a semiconductor chip |
| 01/31/2008 | WO2007059251A9 New diamond uses/applications based on single-crystal cvd diamond produced at rapid growth rate |
| 01/30/2008 | CN101115581A Method of working sintered diamond, cutter wheel for substrate and method of working the same |
| 01/30/2008 | CN101112776A Instrument for accurate cutting of crystal round examples and method of use thereof |
| 01/30/2008 | CN100364721C 流体混合装置及切削装置 Fluid mixing device and cutting device |
| 01/24/2008 | WO2008010457A1 Cutting apparatus |
| 01/24/2008 | WO2008010303A1 Cutting device |
| 01/24/2008 | US20080016783 Matrix Liquid for Producing a Chip Removal Suspension and Used as a Lubricating or Machining Liquid |
| 01/23/2008 | CN201009379Y Rapid disc scraping machine |
| 01/23/2008 | CN101110392A Laser processing method and laser processing apparatus |
| 01/23/2008 | CN101110391A System and method for cutting underlay |
| 01/17/2008 | US20080011134 Sawing Strip And Method For Simultaneously Cutting Off A Multiplicity Of Slices From A Cylindrical Workpiece Using A Sawing Strip |
| 01/16/2008 | CN101104213A Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip |
| 01/16/2008 | CN100361914C Scribing method, cutter wheel, scribing device using the cutter wheel and device for mfg. cutter wheel |
| 01/10/2008 | WO2008004395A1 Laser processing method |
| 01/10/2008 | WO2008004307A1 Boring method, production method of substrate, and manufacturing method of electronic component |
| 01/10/2008 | WO2008003502A1 Apparatus and method for separating and transporting substrates |
| 01/08/2008 | US7316174 Cutting machine for plate-shaped material |