| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 11/12/2008 | CN101301734A Microcomputer control multiline cutting machine |
| 11/11/2008 | US7449396 Wafer dividing method |
| 11/05/2008 | CN100430327C Cutter wheel, device and method using cutter wheel, method of dividing laminated substrate, and method and device for mfg. cutter wheel |
| 11/04/2008 | US7446974 Electronic component and tape head having a closure |
| 10/30/2008 | WO2008129943A1 Scribing apparatus and method |
| 10/29/2008 | CN101296787A Method of forming scribe line on substrate of brittle material and scribe line forming apparatus |
| 10/29/2008 | CN100429751C Cutting device |
| 10/23/2008 | WO2008126880A1 Endless chipping belt |
| 10/23/2008 | WO2008126742A1 Laser machining method, laser cutting method, and method for dividing structure having multilayer board |
| 10/23/2008 | WO2008126502A1 Scribe device and scribe method |
| 10/23/2008 | WO2008126501A1 Scribing device and scribing method |
| 10/23/2008 | WO2008125098A1 Method and apparatus for the production of thin disks or films from semiconductor bodies |
| 10/22/2008 | EP1983557A1 Laser beam machining method and semiconductor chip |
| 10/21/2008 | US7439665 Flat display panel and method of dividing the flat display panel |
| 10/21/2008 | US7438286 Workpiece holding jig |
| 10/16/2008 | US20080251557 Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacutring substrate |
| 10/15/2008 | CN101284402A Multi-line cutting machine |
| 10/15/2008 | CN101284401A Multi-line cutting machine in-phase servo drive and constant tension control system |
| 10/15/2008 | CN101284400A Cutting method |
| 10/15/2008 | CN101284399A Round bur abrasive cutting proportion based on ultra-golden section ratio |
| 10/09/2008 | WO2008121001A1 A saw wire apparatus |
| 10/09/2008 | US20080246178 Method For Dividing Ceramic Cylindrical Body and Shape of Notched Portions Thereof |
| 10/08/2008 | CN201128210Y Zone-melting polycrystal hexagonal pyramid cutting device |
| 10/08/2008 | CN201128209Y Internal cutting blade |
| 10/08/2008 | CN101279486A Water flow jet processing apparatus |
| 10/08/2008 | CN101279453A Slicing bamboo single board surface container floor and producing technique thereof |
| 10/01/2008 | EP1973696A1 Drilling device |
| 10/01/2008 | CN201124541Y Adjusting structure for adjusting the height of small headstock of watchmaker's lathe |
| 10/01/2008 | CN101274460A Apparatus and method for mounting silicon ingot to mounter |
| 09/24/2008 | EP1973174A2 Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
| 09/24/2008 | EP1973139A2 Apparatus and method of temperature control during cleaving processes for manufacture of thick film materials |
| 09/24/2008 | EP1549472B1 Method for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 09/24/2008 | CN101269528A Rapid disc scraping machine |
| 09/23/2008 | US7426883 Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method |
| 09/17/2008 | CN100419996C Wafer dividing method |
| 09/17/2008 | CN100419967C Method of producing III-nitride substrate |
| 09/17/2008 | CN100419553C Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus and substrate cutting method using the substrate cutting apparatus |
| 09/17/2008 | CN100418718C Method for dividing substrate and method for manufacturing substrate using such method |
| 09/12/2008 | WO2008108051A1 Cutting method, and wire-saw apparatus |
| 09/11/2008 | US20080218904 Electronic component and tape head having a closure |
| 09/11/2008 | DE10317115B4 Halbleitereinrichtungs-Herstellungsverfahren A semiconductor device manufacturing method |
| 09/10/2008 | CN101263592A Device and method for separating electronic components |
| 09/10/2008 | CN101259737A Device for cutting and fixing large scale potassium dihydrogen phosphate crystal, and method for preventing shaped blank sheet from cracking |
| 09/09/2008 | US7423237 Method of cutting laminated glass with laser beams |
| 09/09/2008 | US7422963 Method for cleaving brittle materials |
| 09/04/2008 | US20080213079 Apparatus and Method for Separating and Transporting Substrates |
| 09/04/2008 | DE102008000418A1 Process to manufacture a ceramic component incorporating design weak points by controlled laser heating and quenching |
| 09/03/2008 | EP1964820A1 Method of glass substrate working and glass part |
| 09/03/2008 | CN101256979A Driving mechanism and cutting apparatus |
| 09/03/2008 | CN100416767C 晶片加工方法 Wafer processing method |
| 08/28/2008 | WO2008102938A1 Method for manufacturing silicon matter for plasma processing apparatus |
| 08/28/2008 | WO2008060244A8 Net block assembly |
| 08/28/2008 | WO2008054332A8 A unit lifter assembly |
| 08/28/2008 | US20080202298 Glass cutting method |
| 08/28/2008 | DE10337920B4 Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes A process for producing a plurality of components and the intermediate product in the form of a layer composite |
| 08/27/2008 | CN101253021A Method of improving nanotopography on surface of wafer and wire saw device |
| 08/21/2008 | WO2008099663A1 Method of working workpiece of highly brittle nonmetallic material and apparatus therefor |
| 08/21/2008 | DE10003240B4 Verfahren zum Steuern einer Drahtsäge und Drahtsäge A method of controlling a wire saw and wire saw |
| 08/20/2008 | EP1959482A1 Laser processing method |
| 08/20/2008 | EP1957247A1 Apparatus and method for cleaning a sawn wafer block |
| 08/20/2008 | EP1291456B1 Polycrystalline silicon rod and method for processing the same |
| 08/20/2008 | CN101244613A Method for protecting crystal plate front side structure and executing crystal plate cutting |
| 08/14/2008 | US20080190981 Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate |
| 08/14/2008 | US20080190139 Precious, Semiprecious or Mineral Cut Stone, and the Method of Cutting Same |
| 08/13/2008 | EP1955813A1 Method for manufacturing (110) silicon wafer |
| 08/13/2008 | CN101242927A Laser processing method |
| 08/13/2008 | CN101241939A Ultra-thin solar silicon slice and its cutting technology |
| 08/13/2008 | CN101241839A System for manufacturing semiconductor package and method for manufacturing semiconductor package |
| 08/12/2008 | US7410831 Method and device for dividing plate-like member |
| 08/06/2008 | EP1951490A1 Method for dividing up substrates in wafer form by using adhesion forces |
| 08/06/2008 | EP1409192A4 Method of ablating an opening in a hard, non-metallic substrate |
| 08/06/2008 | CN201095168Y Diamond slice |
| 08/06/2008 | CN201095167Y Diamond cutter head |
| 08/06/2008 | CN101234515A Method for cutting simulation artificial diamond |
| 08/06/2008 | CN100408249C Laser working machine |
| 08/05/2008 | US7406994 Substrate layer cutting device and method |
| 07/30/2008 | EP1948853A2 New diamond uses/applications based on single-crystal cvd diamond produced at rapid growth rate |
| 07/30/2008 | EP1422201A4 Cutting method for brittle non-metallic materials (two variants) |
| 07/30/2008 | CN101232982A Device and method for cutting off substrate of fragile material |
| 07/30/2008 | CN101229664A Diamond precision cutting tool and processing technology thereof |
| 07/29/2008 | US7405376 Processing apparatus using laser beam |
| 07/29/2008 | US7404399 Diamond tool, synthetic single crystal diamond and method of synthesizing single crystal diamond, and diamond jewelry |
| 07/24/2008 | WO2008044840A3 Machining apparatus and semiconductor strip machining system using the same |
| 07/23/2008 | EP1399291B1 Apparatus and method for measuring tool degradation |
| 07/23/2008 | CN201089195Y Auxiliary appliance for sheet severing |
| 07/23/2008 | CN101227999A Laser processing method and laser processing device |
| 07/23/2008 | CN101226892A Measuring apparatus for work held by chuck table, and laser beam machining apparatus |
| 07/16/2008 | EP1944817A2 Method of manufacturing flat panel display device |
| 07/16/2008 | EP1944118A1 Laser processing method and laser processing device |
| 07/10/2008 | WO2008060244A3 Net block assembly |
| 07/10/2008 | WO2008054332A3 A unit lifter assembly |
| 07/09/2008 | EP1941981A1 Method of forming scribe line on substrate of brittle material and scribe line forming apparatus |
| 07/09/2008 | CN201082573Y Jewel three-dimensional autodesign and detecting device based on machine vision |
| 07/09/2008 | CN101218078A Brittle material scribing wheel, method for manufacturing such brittle material scribing wheel, and scribing method, scribing apparatus and scribing tool using such brittle material scribing wheel |
| 07/08/2008 | US7396742 Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object |
| 07/02/2008 | CN101213058A Reduction method of attraction forces between silicon wafers |
| 06/26/2008 | WO2008075970A1 Method and device for se aration of silicon wafers |
| 06/26/2008 | WO2008074464A1 Edge chamfering wafers |
| 06/26/2008 | US20080149575 Quartz Glass Tool for Heat Treatment of Silicon Wafer and Process for Producing the Same |
| 06/26/2008 | DE102006058819A1 Separating method for multiple disks of workpiece, involves fixing pre-wearing bar on opposite side of peripheral area of workpiece, which is guided from saw wire into workpiece by wire gate |