| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 04/08/2009 | CN101402229A Laser scribing dust collector and operation method thereof |
| 04/08/2009 | CN101402228A Cutting device |
| 04/08/2009 | CN101402227A Cutting blade detection mechanism |
| 04/08/2009 | CN101402226A Cutting device |
| 04/08/2009 | CN101402225A Cutting blade detection mechanism of cutting device |
| 04/08/2009 | CN100477101C Cutting device |
| 04/08/2009 | CN100475419C Method and apparatus for forming cracks |
| 04/02/2009 | WO2009041443A1 Water-soluble processing oil for free-abrasive-grain wire saw |
| 04/02/2009 | WO2009040109A1 Method for producing wafers from ingots |
| 04/01/2009 | CN101396849A Cutting device |
| 03/25/2009 | CN101391465A Laser dicing machine |
| 03/25/2009 | CN101391464A Home roll for line cutting machine |
| 03/25/2009 | CN101391463A Multi-line cutting machine |
| 03/25/2009 | CN101391460A Device and method for cutting breakable substrate material |
| 03/25/2009 | CN100471806C Method for cutting glass |
| 03/25/2009 | CN100471609C Manufacturing objects cutting method |
| 03/19/2009 | WO2009035419A2 An apparatus and method for dicing an ic substrate |
| 03/19/2009 | US20090071995 Scribing and breaking apparatus and system therefor |
| 03/18/2009 | EP1469981B1 Device for cutting a substrate layer, and corresponding method |
| 03/18/2009 | CN101388326A Method of manufacturing device |
| 03/18/2009 | CN101386192A Cutting method of super-hard crystal |
| 03/18/2009 | CN100470758C Cutting and treatment system for manufacturing semiconductor package |
| 03/11/2009 | CN101380785A Workholder for multi-line cutting machine |
| 03/11/2009 | CN100468641C Wafer dividing method and dividing apparatus |
| 03/11/2009 | CN100468055C Preparation method of X-ray diffraction sample rack |
| 03/05/2009 | DE202006020613U1 Einrichtung zum Positionieren und Lageerhalten von dünnen Substraten am geschnittenen Substralblock Means for positioning and location obtaining thin substrates on the cut Substralblock |
| 03/05/2009 | DE102007040801A1 Board material e.g. stone, separating method, involves restricting movement of materials and exposing pressure waves in zone to changed material structure to achieve separation of materials along predetermined break lines |
| 03/04/2009 | EP1340605B1 Tip holder |
| 03/04/2009 | CN101378037A Cutting method and cutting device |
| 02/19/2009 | WO2009022586A1 Scribing head, scribing device, and scribing method |
| 02/18/2009 | CN101370628A Method for representing release forces |
| 02/18/2009 | CN101370617A Drilling device |
| 02/18/2009 | CN101369554A Method for cutting semiconductor substrate |
| 02/18/2009 | CN101367255A Driven wheel structure of numerical control cutting machine for cutting silicon wafer |
| 02/18/2009 | CN100462173C Device and method for forming a plurality of thin sheets from at least two basically same blocks |
| 02/12/2009 | WO2009020004A1 Laser working method, laser working apparatus, and its manufacturing method |
| 02/12/2009 | US20090038341 Round brilliant cut diamond and its incision method |
| 02/11/2009 | CN101362365A Steel wire tightening apparatus of hard material slicing apparatus |
| 02/11/2009 | CN101362364A High precision translational worktable of hard and brittle cut-off machine |
| 02/10/2009 | US7489454 Laser processing device |
| 02/04/2009 | CN101360592A Slurry for silicon ingot slicing and silicon ingot slicing method using the same |
| 02/04/2009 | CN101357492A Device for automatically measuring the thickness of processing piece |
| 02/04/2009 | CN101357491A Cutting device |
| 02/04/2009 | CN100459054C 晶片加工方法 Wafer processing method |
| 02/03/2009 | US7484444 Cutting device with a pair of cutting blades and elements for detecting and controlling wear of the cutting blades |
| 01/29/2009 | WO2009013854A1 Hand operated breaker |
| 01/28/2009 | CN101356047A Apparatus and method for separating and transporting substrates |
| 01/28/2009 | CN100456431C Cutting device with a pair of cutting means |
| 01/22/2009 | WO2009011246A1 Method for processing brittle material substrate and crack forming apparatus used in the method |
| 01/22/2009 | WO2008126742A4 Laser machining method, laser cutting method, and method for dividing structure having multilayer board |
| 01/21/2009 | CN201185184Y Apparatus for shaping double positive angles of high voltage high-power thyristor |
| 01/21/2009 | CN201183292Y Worktable having symmetrical arcs and clamping structure |
| 01/21/2009 | CN101351870A Laser beam machining method and semiconductor chip |
| 01/21/2009 | CN101347966A Device for automatically compacting processing workpiece |
| 01/14/2009 | EP2012959A1 Precision slicing of large work pieces |
| 01/14/2009 | CN201181695Y Vacuum voltage regulation adsorber of scribing machine |
| 01/14/2009 | CN201179695Y Clamper for collapse edge and vertex damage preventing silicon-crystal-bar slicing machine |
| 01/14/2009 | CN101345212A Wafer dividing method |
| 01/14/2009 | CN100452299C Silicon wafer laser processing method and laser beam processing machine |
| 01/07/2009 | EP1722950B1 Nozzle assembly for a saw for a semiconductor device |
| 01/07/2009 | EP1641591B1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/07/2009 | EP1395406B1 Method of separating components from a substrate |
| 01/07/2009 | CN101341575A Improved singulation system and method |
| 01/07/2009 | CN101337400A Cutter |
| 01/07/2009 | CN100448593C Laser machining method |
| 12/31/2008 | WO2009003008A1 Methods of crystallographically reorienting single crystal bodies |
| 12/31/2008 | WO2009001453A1 Multi-wire saw and method of cutting ingot |
| 12/31/2008 | CN101335205A Method of producing iii-nitride substrate |
| 12/25/2008 | US20080314883 Laser Processing Method and Equipment |
| 12/24/2008 | EP2004375A1 Device for breaking semiconductor wafers using a breaking block |
| 12/24/2008 | EP2004374A1 Device for breaking semiconductor wafers or similar substrates |
| 12/24/2008 | CN101327622A Mortar recovery technique for cutting single-crystal and polycrystalline silicon wire |
| 12/24/2008 | CN100445014C 激光加工装置 The laser processing apparatus |
| 12/18/2008 | US20080308727 Sample Preparation for Micro-Analysis |
| 12/18/2008 | DE102006044366B4 Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück A method for separating a plurality of slices of a cylindrical workpiece |
| 12/18/2008 | DE102005046479B4 Verfahren zum Spalten von spröden Materialien mittels Trenching Technologie A method for cleaving brittle materials by trenching technology |
| 12/17/2008 | CN101325178A Cutting device |
| 12/17/2008 | CN101323152A Thimble module and method for separating wafer and blue tape using the module |
| 12/17/2008 | CN100444326C Wafer dividing method |
| 12/17/2008 | CN100443271C Ultrasonic scroll saw cutting process for non-conductive hard fragile material |
| 12/11/2008 | WO2008149515A1 Multi-head mounted scribing device, and tip holder automatic-exchanging system |
| 12/11/2008 | WO2008149514A1 Tip holder for hand cutter, and hand cutter having the tip holder |
| 12/11/2008 | WO2008149490A1 Cutting method and wire saw device |
| 12/11/2008 | DE102008026918A1 Schneideinrichtung mit Ultraschallwandler Cutter with ultrasonic transducers |
| 12/10/2008 | EP1124674B1 Method and device for separating into two slices a wafer of material, in particular semiconductor material |
| 12/10/2008 | CN101318359A 切削装置 Cutting device |
| 12/10/2008 | CN101318358A Cutting blade |
| 12/10/2008 | CN101318357A Jewel/jade processing method |
| 12/09/2008 | US7461648 Abrasive wire sawing |
| 12/04/2008 | US20080295822 Rail guide with bearings for tile saw |
| 12/04/2008 | DE102006052910B4 Wafer-Herstellungs-Verfahren und -Vorrichtung Wafer manufacturing method and apparatus |
| 12/04/2008 | DE102006052908B4 Wafer-Auffang-Vorrichtung Wafer target means |
| 12/03/2008 | CN100440443C Method for cutting semiconductor substrate |
| 11/27/2008 | WO2008142745A1 Laser scribing device and laser scribing method |
| 11/26/2008 | CN101310911A Laser processing device |
| 11/26/2008 | CN100437919C Method of dicing semiconductor wafer into chips, and apparatus using this method |
| 11/25/2008 | US7455731 Polycrystalline silicon rod and method for processing the same |
| 11/20/2008 | WO2008139585A1 Mechanism for causing early crack |
| 11/20/2008 | US20080286943 Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium |
| 11/12/2008 | EP1990293A1 Device and method for singulating |