| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
|---|
| 08/12/2009 | CN101502986A Positioning apparatus for bonding silicon block |
| 08/12/2009 | CN101502985A Workpiece clamping and releasing device of improved multiline cutter |
| 08/12/2009 | CN101502984A Structure for deploying and retracting cutting line for silicon chip cutter |
| 08/12/2009 | CN101502983A Silicon chip cutter |
| 08/12/2009 | CN101502982A Technique for producing ultrathin diamond cutting slice for resin binder |
| 08/12/2009 | CN101502913A Laser beam machining method and laser beam machining device |
| 08/05/2009 | CN101499428A Double-interface card production method and equipment |
| 08/05/2009 | CN101498055A Polishing treatment method for solar grade monocrystal silicon bar |
| 07/30/2009 | US20090188960 Apparatuses for Breaking a Glass Panel Unified with a Process Table |
| 07/29/2009 | CN201279845Y Jewel ring rolling machine with magnetic powder clutch |
| 07/29/2009 | CN201279844Y Apparatus for automatic measurement machining of workpiece thickness |
| 07/29/2009 | CN101491924A Wide tooth type soldering diamond tool node |
| 07/29/2009 | CN100519121C Substrate-cutting system and substrate-producing apparatus |
| 07/22/2009 | CN201275810Y Main roller for linear cutting machine |
| 07/22/2009 | CN101489746A Cutting device |
| 07/22/2009 | CN101486232A Oriented cutting method for preparing infrared non-linear optics element from yellow copper positive uni-axial crystal |
| 07/22/2009 | CN101486231A Oriented cutting method for preparing infrared non-linear optics element from yellow copper uniaxial negative crystal |
| 07/16/2009 | WO2009087723A1 Ingot cutting apparatus and cutting method |
| 07/15/2009 | CN201271960Y Multi-wire cutting machine cross sliding table |
| 07/15/2009 | CN201271959Y Wire movement mechanism of multi-wire cutting machine |
| 07/15/2009 | CN201271958Y Vertical feed apparatus of multi-wire cutting machine |
| 07/15/2009 | CN201271957Y Cutting wire mechanism of multi-wire cutting machine |
| 07/15/2009 | CN201271956Y Cutting wire tension control device for multi-wire cutting machine |
| 07/15/2009 | CN201271955Y Eccentric cam fixture of slicer |
| 07/15/2009 | CN100513110C Wafer dividing method utilizing laser beam |
| 07/09/2009 | WO2009084489A1 Laser working apparatus, and laser working method |
| 07/09/2009 | WO2009084398A1 Method for forming cracks on substrate made of brittle material |
| 07/09/2009 | WO2009084276A1 Laser processing apparatus |
| 07/09/2009 | WO2009084068A1 Process for separating and recovering the suspending fluids contained in exhausted slurries from the machining of silicon |
| 07/09/2009 | DE10044463B4 Plättchenschneidverfahren Dicing process |
| 07/08/2009 | CN101474830A Technological process for slicing solar energy grade six-cun monocrystalline silicon wafer |
| 07/02/2009 | WO2009081621A1 Laser processing apparatus and laser processing method |
| 07/02/2009 | WO2009081524A1 Band-saw cutting apparatus, and cutting method |
| 07/02/2009 | WO2009081245A1 Method for recovering silicon from sawing waste |
| 07/02/2009 | US20090166808 Laser processing method and semiconductor chip |
| 07/01/2009 | EP2075106A1 Slurry for silicon ingot cutting and method of cutting silicon ingot therewith |
| 07/01/2009 | EP2075105A1 Method and device for separating a structure |
| 07/01/2009 | CN201264322Y Single crystal bar multi-wire saw |
| 07/01/2009 | CN201264321Y Guide pulley for multi-wire saw |
| 07/01/2009 | CN201264320Y Inner circle cutting blade |
| 07/01/2009 | CN201264319Y Device for automatically compacting machined workpiece |
| 07/01/2009 | CN201264318Y Silicon chip locating device |
| 07/01/2009 | CN100506500C Brittle material substrate scribing device and scribing method, and automatic analysis line |
| 06/25/2009 | WO2009078884A1 Gemstone and method for cutting the same |
| 06/25/2009 | WO2009078324A1 Method for chamfering/machining brittle material substrate and chamfering/machining apparatus |
| 06/25/2009 | WO2009078130A1 Method for cutting work by wire saw and wire saw |
| 06/25/2009 | WO2009077282A1 Wire spool |
| 06/24/2009 | CN201261233Y Thickness controller for monocrystal silicon crystal cut |
| 06/24/2009 | CN201261232Y Sparse serration brazing diamond tool block |
| 06/24/2009 | CN101462312A Method for processing diamond |
| 06/24/2009 | CN101462311A Method for processing diamond |
| 06/23/2009 | US7549560 Wafer dividing method |
| 06/18/2009 | WO2009075062A1 Method for cutting work by wire saw and wire saw |
| 06/18/2009 | WO2009074317A1 Method of, and apparatus for, separating wafers from a wafer stack |
| 06/18/2009 | CA2707804A1 Method of, and apparatus for, separating wafers from a wafer stack |
| 06/17/2009 | EP2070653A1 Cutting method |
| 06/17/2009 | CN201257718Y Wafer sliver cutting machine |
| 06/17/2009 | CN101456222A Method for cutting wafer |
| 06/16/2009 | US7547613 Laser processing method and laser processing apparatus |
| 06/11/2009 | WO2009072176A1 Multiwirer saw and cutting method of ingot |
| 06/11/2009 | US20090145417 Power tool stand and tool coupling for mounting a portable power tool on the stand |
| 06/10/2009 | CN201253918Y High precision translational worktable of hard and brittle cut-off machine |
| 06/10/2009 | CN101450513A Portable fragile material base slotting device and method |
| 06/10/2009 | CN101450512A Chemical mechanical polishing method and special device and preparation method of the special device |
| 06/03/2009 | EP2065922A1 Cutting method |
| 06/03/2009 | EP2065120A1 Laser processing method and laser processing apparatus |
| 06/03/2009 | CN101444935A Cutting wire |
| 06/03/2009 | CN101444934A Multi-wire sawing reciprocating cutting method and device thereof |
| 06/02/2009 | US7542125 Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removed |
| 05/22/2009 | WO2009062744A1 Method for dividing monocrystals |
| 05/20/2009 | EP2059947A2 Method and system for continuous large-area scanning implantation process |
| 05/20/2009 | DE102007056115A1 Verfahren zum Trennen von Einkristallen A method for separating single crystals |
| 05/20/2009 | CN100490127C Wafer and wafer cutting and dividing method |
| 05/19/2009 | US7533665 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements |
| 05/14/2009 | WO2009060691A1 Machining method of fragile material substrate and scribing device |
| 05/14/2009 | WO2009060562A1 Wire saw apparatus |
| 05/13/2009 | EP2058100A1 Splitting method for brittle materials |
| 05/13/2009 | CN201235584Y Silicon slice wire cutting apparatus |
| 05/13/2009 | CN101432091A Precision slicing of large work pieces |
| 05/13/2009 | CN101428452A Machining device |
| 05/07/2009 | WO2009057474A1 Device for scoring glass sheet |
| 05/07/2009 | WO2009057381A1 Method for cutting a fragile material substrate |
| 05/06/2009 | CN101425473A Vacuum keeping device and wafer cutting machine having the device |
| 05/05/2009 | US7528341 Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus |
| 04/30/2009 | WO2009053007A1 Method and device for recovering a mixture of a thixotropic dispersant and abrasive grains as abrasives |
| 04/30/2009 | WO2009053006A1 Use of a mixture of substantially one thixotropic dispersant and abrasive grains as abrasives |
| 04/30/2009 | WO2009053004A1 Wire saws comprising thixotropic lapping suspensions |
| 04/29/2009 | CN101419936A Splitting method for wafer |
| 04/23/2009 | WO2009051745A1 Constant force mechanical scribers and methods for using same in semiconductor processing applications |
| 04/23/2009 | WO2009050938A1 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| 04/22/2009 | CN201224155Y Mandrel-passing mounting component for abrasive wire machine |
| 04/22/2009 | CN101412154A Laser processing method |
| 04/22/2009 | CN100481337C Division starting point forming method in body to be divided, and dividing method for body to be divided |
| 04/22/2009 | CN100480015C Apparatus for rotating point cutting large size silicon-carbide crystal |
| 04/16/2009 | WO2009047990A1 Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus |
| 04/16/2009 | DE10027086B4 Magnetelement-Schneidverfahren und Magnetelement-Schneidvorrichtung Magnet member cutting method and magnetic element cutter |
| 04/15/2009 | EP2048698A1 Object cutting method |
| 04/15/2009 | CN201220457Y Liquid phase sintering diamond tool block |
| 04/15/2009 | CN101407091A 切削刀具 Cutting Tools |
| 04/15/2009 | CN100478412C Chemical mechanical polishing pulp for sapphire substrate underlay |